JPH0452996Y2 - - Google Patents
Info
- Publication number
- JPH0452996Y2 JPH0452996Y2 JP9641687U JP9641687U JPH0452996Y2 JP H0452996 Y2 JPH0452996 Y2 JP H0452996Y2 JP 9641687 U JP9641687 U JP 9641687U JP 9641687 U JP9641687 U JP 9641687U JP H0452996 Y2 JPH0452996 Y2 JP H0452996Y2
- Authority
- JP
- Japan
- Prior art keywords
- carrier body
- bonding land
- cavity
- stepped
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000000605 extraction Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9641687U JPH0452996Y2 (US20020095090A1-20020718-M00002.png) | 1987-06-23 | 1987-06-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9641687U JPH0452996Y2 (US20020095090A1-20020718-M00002.png) | 1987-06-23 | 1987-06-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6413139U JPS6413139U (US20020095090A1-20020718-M00002.png) | 1989-01-24 |
JPH0452996Y2 true JPH0452996Y2 (US20020095090A1-20020718-M00002.png) | 1992-12-14 |
Family
ID=31321319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9641687U Expired JPH0452996Y2 (US20020095090A1-20020718-M00002.png) | 1987-06-23 | 1987-06-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0452996Y2 (US20020095090A1-20020718-M00002.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3718518B2 (ja) | 2003-10-03 | 2005-11-24 | 日東電工株式会社 | 光屈折率変調重合体、光屈折率変調重合体組成物および屈折率制御方法 |
-
1987
- 1987-06-23 JP JP9641687U patent/JPH0452996Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6413139U (US20020095090A1-20020718-M00002.png) | 1989-01-24 |