JPH0452763B2 - - Google Patents
Info
- Publication number
- JPH0452763B2 JPH0452763B2 JP59055670A JP5567084A JPH0452763B2 JP H0452763 B2 JPH0452763 B2 JP H0452763B2 JP 59055670 A JP59055670 A JP 59055670A JP 5567084 A JP5567084 A JP 5567084A JP H0452763 B2 JPH0452763 B2 JP H0452763B2
- Authority
- JP
- Japan
- Prior art keywords
- wood
- pieces
- treated
- wood pieces
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010875 treated wood Substances 0.000 claims description 41
- 239000002023 wood Substances 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 24
- 150000002894 organic compounds Chemical group 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 238000006266 etherification reaction Methods 0.000 claims description 4
- 239000012374 esterification agent Substances 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 2
- 229920002522 Wood fibre Polymers 0.000 claims 1
- 239000002025 wood fiber Substances 0.000 claims 1
- 239000010876 untreated wood Substances 0.000 description 29
- 239000010410 layer Substances 0.000 description 13
- 229920000877 Melamine resin Polymers 0.000 description 6
- 239000004640 Melamine resin Substances 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- 239000000077 insect repellent Substances 0.000 description 4
- -1 organic acid halides Chemical class 0.000 description 4
- 239000003755 preservative agent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 239000011094 fiberboard Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 2
- 241000256602 Isoptera Species 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- 241001465754 Metazoa Species 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000001805 chlorine compounds Chemical class 0.000 description 2
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- WFPZPJSADLPSON-UHFFFAOYSA-N dinitrogen tetraoxide Chemical compound [O-][N+](=O)[N+]([O-])=O WFPZPJSADLPSON-UHFFFAOYSA-N 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- PNVPNXKRAUBJGW-UHFFFAOYSA-N (2-chloroacetyl) 2-chloroacetate Chemical compound ClCC(=O)OC(=O)CCl PNVPNXKRAUBJGW-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 241000233866 Fungi Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- AOBXGGAGUYYNQH-UHFFFAOYSA-N ammonium sulfate urea Chemical compound [NH4+].[NH4+].NC(N)=O.[O-]S([O-])(=O)=O AOBXGGAGUYYNQH-UHFFFAOYSA-N 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 229940073608 benzyl chloride Drugs 0.000 description 1
- 210000000170 cell membrane Anatomy 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- HRYZWHHZPQKTII-UHFFFAOYSA-N chloroethane Chemical compound CCCl HRYZWHHZPQKTII-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000008050 dialkyl sulfates Chemical class 0.000 description 1
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 229960003750 ethyl chloride Drugs 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 229940050176 methyl chloride Drugs 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
Description
【発明の詳細な説明】
(発明の分野)
本発明は、木質人造板材(パーテイクルボー
ド、フアイバーボード等)の製造方法に関し、さ
らに詳くは、木材成分中の水酸基を化学的に修飾
した処理木材片と無処理木材片とのそれぞれに接
着剤を付着させ、この処理木材片と無処理木材片
とを適宜堆積させて積層した後、圧締結合する工
程からなる木質人造板材の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of the Invention) The present invention relates to a method for manufacturing artificial wooden boards (particle board, fiber board, etc.), and more particularly, to a method for chemically modifying hydroxyl groups in wood components. Relating to a method for producing wooden artificial board materials, which comprises the steps of attaching an adhesive to each of a piece of wood and a piece of untreated wood, stacking the treated wood piece and the untreated wood piece as appropriate, and then press-fitting the pieces together. .
(従来技術とその問題点)
従来、木質人造板材は、資源の有効利用、均一
な大版製品を得られること、および、材質、接着
剤、加圧力で種々の性質の板材を得られることか
ら、建築用材、その他広範な用途に利用されてい
る。(Prior art and its problems) Traditionally, wooden artificial boards have been developed because of the effective use of resources, the ability to obtain uniform large-sized products, and the ability to obtain boards with various properties depending on the material, adhesive, and pressing force. , construction materials, and a wide range of other uses.
しかしながら、一方では、各種菌類の侵蝕や白
蟻等の虫害を受けて腐朽し易く、昨今のように気
密性が高く、暖房装置の普及が進んだ住宅環境下
においては、このような腐朽の発生はむしろ増加
してきており、木質人造板材の耐久性低下の一因
として大きな問題となつてきている。 However, on the other hand, it is easy to rot due to erosion by various fungi and damage from insects such as termites, and in today's housing environment where airtightness is high and heating devices are widespread, the occurrence of such rot is difficult. In fact, it has been increasing, and is becoming a major problem as one of the causes of decreased durability of wooden artificial boards.
この虫害にかかる問題を改善するため、製造時
における防腐防虫剤の添加が一般的な方法として
実施されているが、有毒であり、人畜への危険が
あるので、使用個所が限定されるという欠点があ
る。 In order to improve the problem of insect damage, it is common practice to add preservatives and insect repellents during manufacturing, but they are toxic and pose a danger to humans and animals, so the areas where they can be used are limited. There is.
一方、木質人造板材は湿気等の水分を周囲の環
境条件に応じて吸収し、放散するという、いわゆ
る呼吸性を有する反面、このような湿気等の吸
収、放散の繰返しに伴つて膨潤化したり、反り、
ねじれ、伸縮等の変形を生じるという本質的な欠
点を有している。 On the other hand, although wooden artificial boards absorb and release moisture depending on the surrounding environmental conditions, so-called breathability, they also swell and swell due to repeated absorption and release of moisture. warp,
It has the essential drawback of causing deformations such as twisting and expansion/contraction.
(発明の目的)
本発明の目的は、前記欠点に鑑みてなされたも
ので、防腐防蟻性、寸法安定性、耐湿性に優れた
人畜無害な木質人造板材(パーテイクルボード、
フアイバーボード等)の製造方法を提供すること
にある。(Object of the Invention) The object of the present invention has been made in view of the above-mentioned drawbacks, and is a wooden artificial board (particle board,
The purpose of the present invention is to provide a method for manufacturing fiberboard (fiberboard, etc.).
(発明の構成)
本発明者らは、前記目的を達成するため、鋭意
研究の結果、木材成分中の水酸基を非親水性基に
置換させる有機化合物で化学的に修飾し、反応性
の低い置換基を導入して得た処理木材片が腐朽し
にくく、防腐防虫剤を用いずとも充分な防腐防虫
性を有するとともに、吸水率が小さく、膨潤化し
にくいことに着目し、木質人造板材の表裏面層の
うち、少なくとも片側表面層を、前記処理木材片
で形成するようにしたものである。(Structure of the Invention) In order to achieve the above object, the present inventors, as a result of intensive research, have chemically modified the hydroxyl groups in wood components with organic compounds that replace them with non-hydrophilic groups, resulting in a substitution with low reactivity. Focusing on the fact that the treated wood pieces obtained by introducing the group are resistant to decay and have sufficient rot and insect repellent properties without the use of preservatives and insect repellents, they also have a low water absorption rate and are difficult to swell. At least one surface layer of the layers is formed of the treated wood piece.
本発明の要旨は、前記目的を達成するため、木
材原材を細片化して得た木材片に接着剤を付着さ
せ、これを堆積させてなる堆積層の表裏面のう
ち、少なくとも片面に、木材成分中の水酸基を非
親水性基に置換させる有機化合物で化学的に修飾
し、かつ、接着剤を付着させた処理木材片を層状
に形成した後、圧締結合することを特徴とする木
質人造板材の製造方法にある。 The gist of the present invention is, in order to achieve the above-mentioned object, to apply adhesive to wood pieces obtained by cutting raw wood material into pieces, and to deposit the adhesive on at least one side of the front and back surfaces of the deposited layer. Wood that is chemically modified with an organic compound that replaces the hydroxyl groups in the wood components with non-hydrophilic groups, and is formed by forming layers of treated wood pieces to which an adhesive is attached, and then press-fitting them together. It is in the manufacturing method of artificial board material.
なお、便宜上、本発明にかかる木質人造板材の
製造方法を、無処理木材片と処理木材片とを得る
第1段階と、この第1段階で得た無処理木材片と
処理木材片とのそれぞれに接着剤を付着させ、適
宜、堆積させて積層した後、圧締結合する第2段
階とに分けて説明する。 For convenience, the method for producing a wooden artificial board according to the present invention will be described in detail in a first step of obtaining untreated wood pieces and treated wood pieces, and of the untreated wood pieces and treated wood pieces obtained in this first step, respectively. The explanation will be divided into a second step in which an adhesive is applied to the adhesive, and the adhesive is deposited and laminated as appropriate, and then the adhesive is press-fitted.
第1段階において無処理木材片を得る方法とし
ては、木材原材をチツパーその他適当な装置で繊
維状、チツプ状、フレーク状、パーテイクル状な
どに細片化する方法がある。なお、使用する木材
原材の樹種には特に制限はない。 In the first step, the untreated wood pieces can be obtained by cutting raw wood into pieces into fibers, chips, flakes, particles, etc. using a chipper or other suitable device. Note that there are no particular restrictions on the species of wood used as the raw material.
また、処理木材片を得る方法としては、前記無
処理木材片に非親水性基を導入する有機化合物を
適当な手段で接触させて化学的に処理することに
より、その木材成分、特にセルロースの水酸基を
化学的に修飾する方法がある。 In addition, as a method for obtaining treated wood pieces, the untreated wood pieces are chemically treated by contacting them with an organic compound that introduces non-hydrophilic groups by an appropriate means, so that the wood components, particularly the hydroxyl groups of cellulose, are treated. There is a method of chemically modifying.
ここで、前記有機化合物とは、木材成分、特に
セルロースの水酸基を化学的に修飾して木材片に
非親水性で反応性の低い置換基を導入する物質を
意味し、その代表的なものとして下記の如きエス
テル化剤およびエーテル化剤を挙げることができ
る。 Here, the organic compound refers to a substance that chemically modifies the hydroxyl group of wood components, particularly cellulose, and introduces non-hydrophilic and low-reactivity substituents into wood pieces. The following esterifying agents and etherifying agents may be mentioned.
エステル化剤としては有機酸無水物(例えば酢
酸、プロピオン酸、酪酸などの酸無水物)、有機
酸ハロゲン化物(例えば前記の酸の他カプロン
酸、ラウリン酸、ステアリン酸およびメタクリル
酸などの酸ハロゲン化物、特に酸塩化物)、およ
び有機酸無水物と脂肪酸の混合物(例えば無水ト
リフルオル酢酸または無水クロル酢酸、プロピオ
ン酸、カプロン酸またはラウリン酸等との混合
物)などを挙げることができる。これらのエステ
ル化剤は単独で、あるいは2種以上混合して使用
することができる。 Esterifying agents include organic acid anhydrides (for example, acid anhydrides such as acetic acid, propionic acid, and butyric acid), organic acid halides (for example, in addition to the above acids, acid halides such as caproic acid, lauric acid, stearic acid, and methacrylic acid). chlorides, especially acid chlorides), and mixtures of organic acid anhydrides and fatty acids (for example mixtures with trifluoroacetic anhydride or chloroacetic anhydride, propionic acid, caproic acid or lauric acid, etc.). These esterifying agents can be used alone or in combination of two or more.
前記エステル化剤には、木材成分との反応を促
進するための触媒および/またはエステル化剤の
木材細胞膜内への浸透を促進するための溶剤を添
加しておくことができる。このような触媒として
は硫酸、過塩素酸、尿素−硫安、脂肪酸塩および
ピリジンなどが、溶剤としてはベンゼン、トルエ
ン、ジメチルホルムアミドおよび四酸化二窒素−
ジメチルホルムアミドなどが挙げられ、また各々
2種またはそれ以上の混合物として用いてもよ
い。 A catalyst for promoting the reaction with the wood component and/or a solvent for promoting the penetration of the esterifying agent into the wood cell membrane can be added to the esterifying agent. Such catalysts include sulfuric acid, perchloric acid, urea-ammonium sulfate, fatty acid salts, and pyridine, and solvents include benzene, toluene, dimethylformamide, and dinitrogen tetroxide.
Examples include dimethylformamide, and two or more of each may be used as a mixture.
これらの触媒および/または溶剤は、エステル
化剤に添加する代りに、あるいは添加するととも
に、該エステル化剤で処理する前の無処理木材片
に予め含浸させておいてもよい。 Instead of or in addition to being added to the esterifying agent, these catalysts and/or solvents may be pre-impregnated into the untreated wood piece before being treated with the esterifying agent.
次に、エーテル化剤としては、例えばエチレン
オキサイド、プロピレンオキサイド等の1,2−
エポキシド、塩化メチル、塩化エチル等のハロゲ
ン化アルキル、塩化ベンジル等の芳香族ハロゲン
化物、ジメチル硫酸等のジアルキル硫酸、モノク
ロル酢酸等のα−ハロゲン酸、シアン化ビニル等
の陰性基で活性化されたビニル化合物、ホルムア
ルデヒド等のアルデヒドなどを用いることができ
る。 Next, as the etherification agent, for example, 1,2- such as ethylene oxide, propylene oxide, etc.
Activated with epoxides, alkyl halides such as methyl chloride and ethyl chloride, aromatic halides such as benzyl chloride, dialkyl sulfates such as dimethyl sulfate, α-halogen acids such as monochloroacetic acid, and negative groups such as vinyl cyanide. Vinyl compounds, aldehydes such as formaldehyde, etc. can be used.
エーテル化剤の場合も、エステル化剤の場合と
同様、触媒(例えば、水酸化ナトリウムの如きア
ルカリ触媒)や溶剤(例えばエステル化剤の場合
に使用されるものと同様の溶剤)を適宜添加する
ことができ、またエーテル化剤で処理する前の無
処理木材片に予めこれらを含浸させておくことも
できるが、触媒の場合は特に後者によるのが好ま
しい。 In the case of an etherification agent, as in the case of an esterification agent, a catalyst (for example, an alkaline catalyst such as sodium hydroxide) and a solvent (for example, a solvent similar to that used in the case of an esterification agent) are added as appropriate. It is also possible to pre-impregnate the untreated wood pieces with the etherifying agent before treatment, although the latter is particularly preferred in the case of catalysts.
無処理木材片を前記有機化合物に接触させる方
法としては、例えば、無処理木材片を有機化合物
溶液中に浸漬し、あるいは、気化した有機化合物
に晒して接触させる方法がある。そして、このよ
うな方法を減圧下、加圧下あるいは減圧加圧法に
より行えば、無処理木材片に対する有機化合物の
含浸をより一層促進させることができる。なお、
有機化合物と無処理木材片との接触時間は、前記
の処理条件に応じて異なる。 Examples of the method of bringing the untreated wood piece into contact with the organic compound include a method of immersing the untreated wood piece in an organic compound solution, or exposing the untreated wood piece to a vaporized organic compound and bringing it into contact. If such a method is carried out under reduced pressure, under increased pressure, or by a reduced pressure method, the impregnation of the organic compound into the untreated wood piece can be further promoted. In addition,
The contact time between the organic compound and the untreated wood chips varies depending on the treatment conditions mentioned above.
このような有機化合物による化学的処理によ
り、無処理木材片はその木材成分、特にセルロー
スの水酸基がエステル化、エーテル化などの化学
的修飾を受けて非親水性で反応性の低い置換基を
導入することにより、処理木材片となる。 Through chemical treatment with such organic compounds, untreated wood chips undergo chemical modifications such as esterification and etherification of the hydroxyl groups of the wood components, especially cellulose, and introduce substituents that are non-hydrophilic and have low reactivity. This results in treated wood pieces.
なお、前述の方法では、木材原材を細片化した
後、化学的処理を施して処理木材片を得る方法を
示したが、必ずしもこれに限らず、木材原材を化
学的に処理した後、これを細片化して処理木材片
を得てもよい。 In addition, in the above-mentioned method, a method of obtaining treated wood pieces by chemically treating raw wood material after cutting it into small pieces was shown, but this is not necessarily the case. , this may be cut into pieces to obtain treated wood pieces.
第2段階において接着剤を付着させる方法とし
ては、例えば、落下する無処理木材片、処理木材
片のそれぞれに接着剤をスプレイによつて吹きつ
ける方法がある。 As a method for applying the adhesive in the second step, for example, there is a method of spraying the adhesive onto each of the falling untreated wood pieces and treated wood pieces.
堆積させる方法としては、例えば、接着剤を付
着させた前記処理木材片を機械的に飛ばし、処理
木材片の個々の質量差を利用して比較的小さな処
理木材片を表層面に配し、この処理木材片の上に
前述の無処理木材片を一定の厚さに堆積させ、さ
らに、この無処理木材片の上に前述と同様な方法
で処理木材片を堆積させることにより、3層構造
としてもよい。 As a method for depositing, for example, the treated wood pieces to which the adhesive has been adhered are mechanically blown away, relatively small pieces of treated wood are placed on the surface layer using the difference in mass of each treated wood piece, and then the treated wood pieces are placed on the surface layer. A three-layer structure is created by depositing the above-mentioned untreated wood pieces on top of the treated wood pieces to a certain thickness, and then depositing the treated wood pieces on top of the untreated wood pieces in the same manner as described above. Good too.
また、必ずしも同一形状の木材片を堆積させる
必要はなく、異なる形状の木材片、例えば、繊維
状の処理木材片とチツプ状の無処理木材片とを、
適宜、堆積させてよい。例えば、繊維状の処理木
材片を一定厚さに堆積させた後、その上に順次粒
径の大なるチツプ状の無処理木材片を堆積させ、
さらに、その上に繊維状の処理木材片を堆積させ
て3層構造としてもよい。 Furthermore, it is not always necessary to pile up pieces of wood with the same shape, but with wood pieces of different shapes, for example, treated wood pieces in the form of fibers and untreated wood pieces in the form of chips.
It may be deposited as appropriate. For example, after depositing fibrous treated wood pieces to a certain thickness, chip-like untreated wood pieces of increasing particle size are sequentially deposited on top of it,
Furthermore, fibrous treated wood pieces may be deposited thereon to form a three-layer structure.
この方法によれば、表裏面が滑らかな繊維状処
理木材片で覆われることになるので、優れた耐水
性を有する木質人造板材を製造できるという利点
がある。 According to this method, since the front and back surfaces are covered with smooth fibrous treated wood pieces, there is an advantage that an artificial wooden board having excellent water resistance can be manufactured.
なお、前述の方法では、3層構造となる場合を
示したが、必ずしもこれに限らず、2層構造また
は3層以上の積層構造を形成する場合であつても
よいことは勿論である。 In addition, in the above-mentioned method, although the case where a three-layer structure is formed was shown, the case is not necessarily limited to this, and it goes without saying that a two-layer structure or a laminated structure of three or more layers may be formed.
圧縮結合する方法としては、例えば、堆積させ
た処理木材片と無処理木材片とを1回の圧締作業
で圧締結合させる方法がある。なお、接着剤の種
類によつては加圧時に加熱してもよいことは勿論
である。 As a method for compression bonding, for example, there is a method in which stacked treated wood pieces and untreated wood pieces are press-fitted in one press operation. It goes without saying that depending on the type of adhesive, heating may be applied during pressurization.
また、圧締結合する方法は、一回の圧締作業で
圧締結合させる方法だけでなく、予備圧締後に圧
締結合させる方法であつてもよい。例えば、処理
木材片および無処理木材片を、適宜、堆積した
後、予備圧締して板状体とし、この板状体を重ね
合わせて圧締結合することにより、多層の木質人
造板材を製造する方法がある。 Moreover, the method of press-fitting is not limited to a method of press-fitting in one press-clamping operation, but may be a method of carrying out press-fitting after preliminary press-clamping. For example, after appropriately piling up treated and untreated wood pieces, pre-pressing them to form a plate-like body, stacking these plate-like bodies and pressing them together, produces a multilayer wooden artificial board. There is a way to do it.
この方法によれば、均一な厚さの処理木材片か
らなる処理層を有する木質人造板材を簡単に製造
できるという利点がある。 This method has the advantage that it is possible to easily produce a wooden artificial board having a treated layer made of treated wood pieces of uniform thickness.
(実施例の説明) 以下、本発明にかかる実施例を説明する。(Explanation of Examples) Examples according to the present invention will be described below.
実施例
木材をチツパーで粗粉砕した後、フレーカーで
更に細片化して長さ12mm、巾1.5mm、厚さ0.5mm程
度を平均の大きさとするパーテイクルボード用無
処理木材片を得た。そして、この無処理木材片の
一部を反応容器に入れ、この反応容器に無水酢酸
を注入した後、反応容器を125℃に加熱し、この
温度を50分間維持して反応させ、木材成分中の水
酸基の一部を非親水性のアセチル基に置換した処
理木材片を得た。なお、この処理木材片の全乾重
量は、元の無処理木材片の全乾乾重量よりも約17
%増加していた。Example After coarsely crushing wood with a chipper, it was further broken into pieces with a flaker to obtain untreated wood pieces for particle board having an average size of about 12 mm in length, 1.5 mm in width, and 0.5 mm in thickness. Then, a part of this untreated wood piece is placed in a reaction vessel, and after injecting acetic anhydride into this reaction vessel, the reaction vessel is heated to 125°C, and this temperature is maintained for 50 minutes to cause a reaction. A treated wood piece was obtained in which a portion of the hydroxyl groups were replaced with non-hydrophilic acetyl groups. The total dry weight of this treated wood piece is approximately 17% lower than the total dry weight of the original untreated wood piece.
% increase.
次に、この処理木材片を機械的に落下させ、落
下途中の前記処理木材片にメラミン樹脂接着剤を
スプレーで吹き付けて付着させるとともに、接着
剤が付着した前記処理木材片を均一に堆積させる
ことにより、厚さ約10mmのマツト状物を得た。な
お、前記メラミン樹脂接着剤は、処理木材片100
重量部(全乾換算)に対し、その固形分が4重量
部となる割合で吹き付けられた。 Next, the treated wood pieces are mechanically dropped, and a melamine resin adhesive is sprayed to adhere to the treated wood pieces that are falling, and the treated wood pieces to which the adhesive has adhered are deposited uniformly. A pine-like material with a thickness of about 10 mm was obtained. Note that the melamine resin adhesive is applied to treated wood pieces of 100
The solid content was sprayed at a ratio of 4 parts by weight to parts by weight (on a completely dry basis).
ついで、均一な厚さに堆積させた処理木材片か
らなるマツト状物の上面に、前述と同様な操作で
メラミン樹脂接着剤を付着させた無処理木材片を
均一に堆積させることにより、厚さ約50mmの2層
構造のマツト状物を得た。なお、前記メラミン樹
脂接着剤は、無処理木材片100重量部(全乾換算)
に対し、その固形分が7重量部となる割合で吹き
付けられた。 Next, untreated wood pieces to which melamine resin adhesive has been applied are deposited uniformly on the top surface of the pine-like object made of treated wood pieces deposited to a uniform thickness in the same manner as described above. A pine-like material with a two-layer structure of about 50 mm was obtained. The above melamine resin adhesive is made from 100 parts by weight of untreated wood pieces (dry equivalent).
The solid content was sprayed at a rate of 7 parts by weight.
さらに、堆積させた前記無処理木材片の上面
に、前述と同様な操作でメラミン樹脂接着剤を付
着させた処理木材片を均一に堆積させることによ
り、厚さ約60mmの3層構造のマツト状物を得た。
なお、前記メラミン樹脂接着剤は、処理木材片
100重量部(全乾換算)に対し、その固形分が4
重量部となる割合で吹き付けられた。 Furthermore, treated wood pieces to which melamine resin adhesive has been attached are deposited uniformly on the top surface of the untreated wood pieces, using the same operation as described above, to form a three-layer pine-like structure with a thickness of approximately 60 mm. I got something.
Note that the melamine resin adhesive is applied to treated wood pieces.
The solid content is 4 parts per 100 parts by weight (on a completely dry basis).
It was sprayed in parts by weight.
最後に、このようにして得られた3層構造のマ
ツト状物を145℃、30Kg/cm2の条件で加熱加圧す
ることにより、表裏面層が処理木材片で形成さ
れ、芯層が無処理木材片で形成された厚さ15mmの
木質人造板材を得た。 Finally, the three-layered pine-like material thus obtained is heated and pressurized at 145°C and 30 kg/cm 2 to form the front and back layers of treated wood chips, and the core layer is untreated. A 15 mm thick wooden artificial board made of wood chips was obtained.
(発明の効果)
以上の説明から明らかなように、本発明によれ
ば、大気に露出する片側表面層が処理木材片で形
成されることになるので、無処理木材片のみから
なる木質人造板材よりも優れた防腐防蟻性を有
し、しかも、有毒な防腐防虫剤を用いないので、
人畜無害で環境汚染の心配がない木質人造板材が
得られる。(Effects of the Invention) As is clear from the above description, according to the present invention, the surface layer on one side exposed to the atmosphere is formed of treated wood pieces, so the wooden artificial board made only of untreated wood pieces It has better preservative and termite-proofing properties than other products, and does not use toxic preservatives and insect repellents.
A wooden artificial board material that is harmless to humans and animals and free from environmental pollution can be obtained.
さらに、本発明にかかる処理木材片は吸水率が
小さいので、接着剤が吸収されず、従つて接着剤
の塗布量が少なくなるとともに、膨潤化による木
質人造板材の軟弱化を防止でき、優れた耐湿性を
有する木質人造板材を得ることができる。 Furthermore, since the treated wood pieces according to the present invention have a low water absorption rate, the adhesive is not absorbed, so the amount of adhesive applied is reduced, and the softening of the wooden artificial board due to swelling can be prevented, making it an excellent product. A wooden artificial board material having moisture resistance can be obtained.
また、本発明にかかる木質人造板材は、少なく
とも片側表面層が処理木材片にて形成されている
ので、無処理木材片までで湿気が到達しにくく、
優れた寸法安定性を有している。このため、耐湿
性を要求される場所に使用でき、しかも、防腐防
蟻性を有していることと相まつて巾広い用途に利
用できる。 In addition, since at least one surface layer of the wooden artificial board according to the present invention is formed of treated wood pieces, it is difficult for moisture to reach the untreated wood pieces.
It has excellent dimensional stability. Therefore, it can be used in places where moisture resistance is required, and since it has antiseptic and termite properties, it can be used in a wide range of applications.
そして、全層を処理木材片で構構成していない
ので、安価に製造できるという効果がある。 Furthermore, since all the layers are not made of treated wood pieces, there is an advantage that it can be manufactured at low cost.
Claims (1)
付着させ、これを堆積させてなる堆積層の表裏面
のうち、少なくとも片面に、木材成分中の水酸基
を非親水性基に置換させる有機化合物で化学的に
修飾し、かつ、接着剤を付着させた処理木材片を
層状に形成した後、圧締結合することを特徴とす
る木質人造板材の製造方法。 2 前記処理木材片が、木材原材を細片化して得
た木材繊維、木材チツプ等の木材片を、木材成分
中の水酸基に反応して非親水性基に置換させる有
機化合物で化学的に処理して得たものであること
を特徴とする特許請求の範囲第1項に記載の木質
人造板材の製造方法。 3 前記処理木材片が、木材原材を木材成分中の
水酸基に反応して非親水性基に置換させる有機化
合物で化学的に処理した後、細片化して得たもの
であることを特徴とする特許請求の範囲第1項に
記載の木質人造板材の製造方法。 4 前記有機化合物が、エステル化剤またはエー
テル化剤であることを特徴とする特許請求の範囲
第1項ないし第3項のいずれか1項に記載の木質
人造板材の製造方法。[Scope of Claims] 1. An adhesive is attached to wood pieces obtained by cutting raw wood material into pieces, and hydroxyl groups in the wood components are added to at least one of the front and back surfaces of the deposited layer formed by depositing this adhesive. A method for producing an artificial wooden board, which comprises forming a layer of treated wood pieces that have been chemically modified with an organic compound substituted with a non-hydrophilic group and attached with an adhesive, and then press-fitting the pieces. 2 The treated wood pieces are wood pieces such as wood fibers and wood chips obtained by cutting wood raw materials into pieces, which are chemically treated with an organic compound that reacts with the hydroxyl groups in the wood components and replaces them with non-hydrophilic groups. The method for manufacturing an artificial wooden board according to claim 1, which is obtained by processing. 3. The treated wood pieces are obtained by chemically treating raw wood with an organic compound that reacts with hydroxyl groups in wood components and substituting them with non-hydrophilic groups, and then cutting the wood into small pieces. A method for manufacturing a wooden artificial board according to claim 1. 4. The method for producing a wooden artificial board according to any one of claims 1 to 3, wherein the organic compound is an esterification agent or an etherification agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5567084A JPS60198206A (en) | 1984-03-22 | 1984-03-22 | Preparation of wooden artificial board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5567084A JPS60198206A (en) | 1984-03-22 | 1984-03-22 | Preparation of wooden artificial board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60198206A JPS60198206A (en) | 1985-10-07 |
JPH0452763B2 true JPH0452763B2 (en) | 1992-08-24 |
Family
ID=13005296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5567084A Granted JPS60198206A (en) | 1984-03-22 | 1984-03-22 | Preparation of wooden artificial board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60198206A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63102905A (en) * | 1986-10-17 | 1988-05-07 | Hokkaido | Preparation of water-resistant particle board and fiber board |
JPH04122638A (en) * | 1990-09-12 | 1992-04-23 | Noda Corp | Composite board and manufacture thereof |
JPH04122637A (en) * | 1990-09-12 | 1992-04-23 | Noda Corp | Composite board and manufacture thereof |
JP2649985B2 (en) * | 1990-10-05 | 1997-09-03 | 株式会社ノダ | Composite plate and method of manufacturing the same |
JPH06117903A (en) * | 1992-10-05 | 1994-04-28 | Ckd Corp | Liquid level detector |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5611239A (en) * | 1979-07-10 | 1981-02-04 | Eidai Co Ltd | Manufacture of particle board |
JPS599041A (en) * | 1982-07-09 | 1984-01-18 | Okura Ind Co Ltd | Preparation of woody molded product |
JPS5933133A (en) * | 1982-08-19 | 1984-02-22 | Okura Ind Co Ltd | Manufacture of esterified wood |
-
1984
- 1984-03-22 JP JP5567084A patent/JPS60198206A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5611239A (en) * | 1979-07-10 | 1981-02-04 | Eidai Co Ltd | Manufacture of particle board |
JPS599041A (en) * | 1982-07-09 | 1984-01-18 | Okura Ind Co Ltd | Preparation of woody molded product |
JPS5933133A (en) * | 1982-08-19 | 1984-02-22 | Okura Ind Co Ltd | Manufacture of esterified wood |
Also Published As
Publication number | Publication date |
---|---|
JPS60198206A (en) | 1985-10-07 |
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