JPH0452021U - - Google Patents
Info
- Publication number
- JPH0452021U JPH0452021U JP9440590U JP9440590U JPH0452021U JP H0452021 U JPH0452021 U JP H0452021U JP 9440590 U JP9440590 U JP 9440590U JP 9440590 U JP9440590 U JP 9440590U JP H0452021 U JPH0452021 U JP H0452021U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- runner
- resin
- lead frame
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9440590U JPH0452021U (fi) | 1990-09-07 | 1990-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9440590U JPH0452021U (fi) | 1990-09-07 | 1990-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0452021U true JPH0452021U (fi) | 1992-05-01 |
Family
ID=31832315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9440590U Pending JPH0452021U (fi) | 1990-09-07 | 1990-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452021U (fi) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244642A (ja) * | 1993-02-16 | 1994-09-02 | Yokogawa Hewlett Packard Ltd | 変調器 |
| JP2006326877A (ja) * | 2005-05-23 | 2006-12-07 | Kasai Kogyo Co Ltd | 自動車用内装部品の製造方法 |
-
1990
- 1990-09-07 JP JP9440590U patent/JPH0452021U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244642A (ja) * | 1993-02-16 | 1994-09-02 | Yokogawa Hewlett Packard Ltd | 変調器 |
| JP2006326877A (ja) * | 2005-05-23 | 2006-12-07 | Kasai Kogyo Co Ltd | 自動車用内装部品の製造方法 |
| JP4618722B2 (ja) * | 2005-05-23 | 2011-01-26 | 河西工業株式会社 | 自動車用内装部品の製造方法 |