JPH0451999B2 - - Google Patents
Info
- Publication number
- JPH0451999B2 JPH0451999B2 JP9400883A JP9400883A JPH0451999B2 JP H0451999 B2 JPH0451999 B2 JP H0451999B2 JP 9400883 A JP9400883 A JP 9400883A JP 9400883 A JP9400883 A JP 9400883A JP H0451999 B2 JPH0451999 B2 JP H0451999B2
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- temperature
- gas
- core tube
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、電気部品のプリント基板への接合、
およびプリント基板上の回路の接合等に用いる雰
囲気炉に係り、特に安定した接合条件を保持する
ための熱媒体としてのガスの供給に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to the bonding of electrical components to a printed circuit board,
The present invention also relates to atmospheric furnaces used for bonding circuits on printed circuit boards, and particularly to the supply of gas as a heat medium to maintain stable bonding conditions.
電子計算機、通信機器等に用いられる印刷回路
基板は、近年印刷回路基板上の回路網が高密度化
し、かつ電気部品の端子数が増加するに伴い、印
刷回路基板にペースト状の半田を供給したり、リ
ング状の半田およびフラツクスを部品端子に供給
した後、該部品端子を印刷回路基板の回路網に接
触させ、しかる後に印刷回路基板を半田溶融温度
まで加熱する事により半田を再溶融し、半田付接
続する方法が実施されている。
Printed circuit boards used in computers, communication equipment, etc. have become more densely packed in recent years, and the number of terminals for electrical components has increased. or after supplying a ring-shaped solder and flux to a component terminal, bringing the component terminal into contact with a circuit network of a printed circuit board, and then remelting the solder by heating the printed circuit board to the solder melting temperature, A soldering connection method has been implemented.
この場合、半田の再溶融を行う加熱炉は、トン
ネル状の長い炉芯管とベルト状のコンベアを有
し、熱媒体として安価な非酸化性ガスであるN2
ガスを用いた連続雰囲気型の電気炉（以下雰囲気
炉と呼ぶ）が作業性の良さから使われる事が多
い。 In this case, the heating furnace that remelts the solder has a long tunnel-like furnace core tube and a belt-like conveyor, and uses N2, an inexpensive non-oxidizing gas, as a heat medium.
A continuous atmosphere electric furnace using gas (hereinafter referred to as an atmosphere furnace) is often used due to its ease of work.
第１図に、従来提案されている雰囲気炉の一例
を示す。図中、１は半田付される印刷回路基板お
よび電気部品、半田よりなる被加熱物、２は雰囲
気炉の炉芯管、３は前記炉芯管を加熱するヒータ
ー、４は前記被加熱物１を一定速度で搬送するベ
ルト式のコンベア（通常ステンレス製のメツシユ
により構成される）、５は熱媒体であるN2ガス８
を吹き出すノズル、６は前記ガスの排気口、７は
前記コンベアを駆動するドラム、９は冷却部であ
る。通常ヒーター３は、図の様に複数のゾーンに
分割され、それぞれ別々の設定温度でコントロー
ルされる。 FIG. 1 shows an example of a conventionally proposed atmospheric furnace. In the figure, 1 is an object to be heated consisting of a printed circuit board and electrical components to be soldered, and solder, 2 is a furnace core tube of an atmosphere furnace, 3 is a heater that heats the furnace core tube, and 4 is the object to be heated 1 5 is a belt-type conveyor (usually composed of stainless steel mesh) that conveys at a constant speed, 5 is N 2 gas as a heat medium 8
6 is an exhaust port for the gas, 7 is a drum that drives the conveyor, and 9 is a cooling section. Normally, the heater 3 is divided into a plurality of zones as shown in the figure, and each zone is controlled at a different set temperature.
第１図に示す雰囲気炉においては、ノズル５よ
り吹き出されたN2ガスが炉芯管２中を排気口６
に向つて流れ、その間に炉芯管２の管壁を通して
ヒーター３により250℃〜300℃にまで加熱され
る。前記被加熱物１は、コンベア４により一定速
度で炉芯管５内を搬送され、前記N2ガスからの
伝導熱と前記炉芯管２からの輻射熱により加熱さ
れ、半田付される。 In the atmospheric furnace shown in FIG.
During this time, it passes through the tube wall of the furnace core tube 2 and is heated to 250°C to 300°C by the heater 3. The object to be heated 1 is conveyed through the furnace core tube 5 at a constant speed by a conveyor 4, heated by conduction heat from the N 2 gas and radiant heat from the furnace core tube 2, and soldered.
第２図に、加熱される印刷回路基板の温度上昇
カーブを示す。温度コントロールは、加熱ヒータ
ー３を複数のゾーンに分け、ヒーターの設定温度
をそれぞれ独立にコントロールする事により印刷
回路基板のピーク温度を205℃〜220℃程度の範囲
に押える必要がある。ところが、こうした構造の
炉においては、流れ込むガスの温度と投入される
被加熱物の温度が変化する場合、その影響を受け
やすく冬期においては１１に示すカーブを、夏期
においては１２に示すカーブをとりやすい。 FIG. 2 shows a temperature rise curve of a heated printed circuit board. For temperature control, it is necessary to keep the peak temperature of the printed circuit board within a range of about 205° C. to 220° C. by dividing the heating heater 3 into a plurality of zones and controlling the set temperature of each heater independently. However, in a furnace with such a structure, it is susceptible to changes in the temperature of the gas flowing in and the temperature of the heated object, so the curve shown in 11 is taken in the winter and the curve shown in 12 is taken in the summer. Cheap.
さらに、使用する熱媒体はガスであり、熱容量
が極めて小さい。そのため、被加熱物を流さない
状態（以下空炉状態という）と、被加熱物を流し
ている状態の炉内温度は第３図の様に変化する。
状態イは空炉状態、ロは、炉の温度を下げるため
にダミーを投入した状態、ハは被加熱物を半田付
している状態である。ガスの熱容量が小さいた
め、イとハの温度差は、通常40℃〜50℃と大きく
とられている。半田付設定温度１３は、空炉状態
における設定温度１４と被加熱物の熱負荷のバラ
ンスが保たれた所で安定する。ところが、被加熱
物の熱負荷が大きい場合、図の様に徐々に炉温が
低下する事がしばしば生じる。かかる問題を解決
するためには、熱媒体の熱容量を見かけ上増加す
る必要があるが、従来は、流入するN2ガスは、
液体窒素を蒸発させ、常温で暖めるだけであり、
冬期は０℃近く、夏期は30℃〜35℃と変動する上
に、流入時の絶対温度が低いため、むしろ炉の熱
容量を下げる役割をはたしていた。 Furthermore, the heat medium used is gas and has an extremely small heat capacity. Therefore, the temperature inside the furnace changes as shown in FIG. 3 when the object to be heated is not flowing (hereinafter referred to as an empty furnace state) and when the object to be heated is flowing.
Condition A is an empty furnace, condition B is a condition in which a dummy is inserted to lower the temperature of the furnace, and condition C is a condition in which objects to be heated are being soldered. Since the heat capacity of the gas is small, the temperature difference between A and C is usually set at 40°C to 50°C. The soldering set temperature 13 becomes stable when a balance between the set temperature 14 in the empty furnace state and the heat load of the object to be heated is maintained. However, when the heat load on the object to be heated is large, the furnace temperature often gradually decreases as shown in the figure. In order to solve this problem, it is necessary to increase the apparent heat capacity of the heat medium, but conventionally, the inflowing N2 gas
It simply evaporates liquid nitrogen and warms it at room temperature.
Since the temperature fluctuates from nearly 0°C in winter to 30°C to 35°C in summer, and the absolute temperature at the time of inflow is low, it actually served to lower the heat capacity of the furnace.
本発明の目的は、かかる問題を解決し、外気の
影響による炉内温度の不安定性を小さくすると共
に、熱媒体であるガスの見かけの熱容量を増す事
により安定した炉内条件を持つ雰囲気炉を提供す
る事にある。
The purpose of the present invention is to solve such problems, to reduce the instability of the temperature inside the furnace due to the influence of outside air, and to create an atmosphere furnace with stable conditions inside the furnace by increasing the apparent heat capacity of gas, which is a heating medium. It is about providing.
〔発明の概要〕
この発明の特徴とするところは、雰囲気連続式
の電気炉において、流入する熱媒体ガスの温度を
半田付温度に近くかつ一定の温度にコントロール
する事により炉の熱容量を増し、半田付温度の安
定化をはかる事にある。[Summary of the Invention] The present invention is characterized in that in a continuous atmosphere electric furnace, the heat capacity of the furnace is increased by controlling the temperature of the inflowing heat carrier gas to a constant temperature close to the soldering temperature. The purpose is to stabilize the soldering temperature.
以下、本発明の一実施例を図面を用いて詳細に
説明する。
Hereinafter, one embodiment of the present invention will be described in detail using the drawings.
第４図は、本発明の一実施例による雰囲気炉炉
の断面を示す図である。 FIG. 4 is a diagram showing a cross section of an atmospheric furnace according to an embodiment of the present invention.
１〜９は第１図と同じ、１５は、N2ガスを流
すパイプであり、通常Cuパイプから成る、この
パイプは炉体１６にうがつた穴の中を通され、ヒ
ーター３により200℃程度に加熱される。N2ガス
は、さらに補助ヒーター１７により半田付温度で
ある210℃にまで加熱され炉芯管２内に吹き込ま
れる。その結果ゾーンＣは、流入したガスで冷却
される事がなく、炉の熱容量は増大する。従つて
炉の温度設定は、ゾーンＣにおいて、従来の250
℃から、220℃程度にまで下げる事ができ、炉温
の変動を小さくかつ安定化させる事ができる。 1 to 9 are the same as in Fig. 1. 15 is a pipe for flowing N 2 gas, which is usually made of Cu pipe. This pipe is passed through a hole in the furnace body 16, and heated to about 200°C by the heater 3. heated to. The N 2 gas is further heated to 210° C., which is the soldering temperature, by the auxiliary heater 17 and blown into the furnace core tube 2 . As a result, zone C is not cooled by the incoming gas, and the heat capacity of the furnace increases. Therefore, the temperature setting of the furnace is 250℃ in zone C.
℃ to around 220℃, making it possible to reduce and stabilize fluctuations in furnace temperature.
以上述べた如く本発明によれば、N2ガスを炉
体内で予備加熱し、かつ補助ヒーターで所定の半
田付温度にまで加熱する事により、炉の熱容量を
増大させ、且つ炉温をより半田付温度に近づける
事ができる事により安定した半田付を可能とする
ものである。
As described above, according to the present invention, the heat capacity of the furnace is increased by preheating N2 gas in the furnace body and heating it to a predetermined soldering temperature with an auxiliary heater, and the furnace temperature is further reduced to a soldering temperature. By being able to approach the soldering temperature, stable soldering is possible.
第１図は従来技術による雰囲気炉の構成図、第
２図は従来技術による雰囲気炉で加熱した印刷回
路基板の温度変化を示すグラフ、第３図は炉内温
度の変化を示すグラフ、第４図は本発明による雰
囲気炉の一実施例を示す構成図である。
１……被加熱物、２……炉芯管、３……ヒータ
ー、４……コンベア、５……ガス吹出ノズル、６
……排気口、７……コンベア駆動ドラム、８……
N2ガス、９……冷却部、１０……基板温度設定
カーブ、１１……冬期の温度カーブ、１２……夏
期の温度カーブ、１３……半田付設定温度、１４
……空炉における炉内温度、１５……ガス輸送パ
イプ、１６……炉体、１７……補助ヒーター。
Figure 1 is a diagram showing the configuration of an atmosphere furnace according to the prior art, Figure 2 is a graph showing the temperature change of a printed circuit board heated in the atmosphere furnace according to the prior art, Figure 3 is a graph showing the change in temperature inside the furnace, and Figure 4 is a graph showing the change in temperature in the furnace. The figure is a configuration diagram showing an embodiment of an atmospheric furnace according to the present invention. 1... Item to be heated, 2... Furnace core tube, 3... Heater, 4... Conveyor, 5... Gas blowing nozzle, 6
...Exhaust port, 7...Conveyor drive drum, 8...
N2 gas, 9... Cooling section, 10... Board temperature setting curve, 11... Winter temperature curve, 12... Summer temperature curve, 13... Soldering setting temperature, 14
...Furnace temperature in empty furnace, 15...Gas transport pipe, 16...Furnace body, 17...Auxiliary heater.
Claims (1)
中に加熱することにより前記電子部品と基板との
半田付を行う雰囲気炉であつて、前記炉芯管内を
通して前記基板を移送するコンベアと、前記炉芯
管を囲う炉体と、該炉体を貫通する熱媒体ガスを
輸送すると同時に予備加熱するパイプと、前記炉
体中で予備加熱した前記熱媒体ガスを前記炉芯管
内に流入させる前に半田付温度にまで高めるため
の補助ヒーターを備えたことを特徴とする雰囲気
炉。1. An atmosphere furnace for soldering the electronic components and the board by heating the board on which the electronic component is mounted while passing through the furnace core tube, and a conveyor for transporting the board through the furnace core tube; A furnace body that surrounds the furnace core tube, a pipe that passes through the furnace body and preheats the heat medium gas while transporting it, and a pipe that preheats the heat medium gas that is preheated in the furnace body before flowing into the furnace core tube. An atmosphere furnace characterized by being equipped with an auxiliary heater to raise the temperature to the soldering temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9400883A JPS59220282A (en) | 1983-05-30 | 1983-05-30 | Furnace containing gaseous atmosphere |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9400883A JPS59220282A (en) | 1983-05-30 | 1983-05-30 | Furnace containing gaseous atmosphere |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59220282A JPS59220282A (en) | 1984-12-11 |
| JPH0451999B2 true JPH0451999B2 (en) | 1992-08-20 |
Family
ID=14098414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9400883A Granted JPS59220282A (en) | 1983-05-30 | 1983-05-30 | Furnace containing gaseous atmosphere |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59220282A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0693544B2 (en) * | 1985-12-20 | 1994-11-16 | 松下電器産業株式会社 | Electronic component soldering device |
| JPH0787987B2 (en) * | 1987-07-13 | 1995-09-27 | 松下電器産業株式会社 | Soldering device |
| JP2546689B2 (en) * | 1987-09-26 | 1996-10-23 | エイティックテクトロン 株式会社 | Reflow soldering method and device |
| JPH0248132Y2 (en) * | 1988-09-16 | 1990-12-18 | ||
| JP2016203207A (en) * | 2015-04-22 | 2016-12-08 | 吉塚精機株式会社 | Reflow furnace |
-
1983
- 1983-05-30 JP JP9400883A patent/JPS59220282A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59220282A (en) | 1984-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0451999B2 (en) | ||
| JP3250082B2 (en) | Automatic soldering equipment | |
| JPS61289697A (en) | Soldering | |
| JP2546689B2 (en) | Reflow soldering method and device | |
| JPH01262069A (en) | Heating device for substrate and heating method | |
| JP3114278B2 (en) | Chisso reflow device | |
| JPH04356349A (en) | Atmosphere control method for inert gas reflow device | |
| JP2001257458A (en) | Member for soldering, and method of soldering | |
| JP2003037357A (en) | Soldering method and heating unit | |
| JP2001320163A (en) | Reflow device and its board heating method | |
| JP2791158B2 (en) | Heating equipment | |
| JPH0751273B2 (en) | Substrate heating device | |
| JPH038392A (en) | Soldering and device therefor | |
| JP3495207B2 (en) | Reflow soldering equipment | |
| JP3186215B2 (en) | Chisso reflow device | |
| JP2001053434A (en) | Method and apparatus for reflowing | |
| JPH02238289A (en) | Oxygen concentration reducing method in atmospheric furnace and oxygen concentration ultra-lowering atmospheric furnace | |
| JP4186284B2 (en) | Heating device | |
| JPH04158977A (en) | Combined soldering device | |
| JP2502827B2 (en) | Reflow soldering equipment | |
| JP2006173471A (en) | Reflow soldering apparatus | |
| Xu et al. | How Challenging Conventional Wisdom Can Optimize Solder Reflow | |
| JP2597695Y2 (en) | Reflow furnace | |
| JP2001085834A (en) | Reflow soldering method and component-mounting system using the same | |
| JP2022185954A (en) | Reflow method |