JPH0451977Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a substrate structure of a diamond cutting wheel used for cutting concrete, asphalt, stone, building materials, and other materials.

[Conventional technology]

In a diamond cutting wheel, repeated stress is applied to the diamond layer baked on the outer periphery of a flat substrate during operation, which may cause fatigue failure.

In order to strengthen this substrate, as shown in FIGS. 5 and 6, there is a substrate a on which a diamond layer d is baked on the outer periphery, and a waveform having concave portions b and convex portions c is formed radially.

[Problem that the invention attempts to solve]

In this conventional reinforced substrate with concave and convex portions b and c, the convex portion c comes into contact with the workpiece during cutting, which not only deteriorates the sharpness of the cutting wheel, but also generates frictional heat and deforms the entire body. I had a problem with it.

The purpose of the present invention is to find a reinforced structure for the substrate that does not come into contact with the workpiece during cutting, and to solve the problems of conventional diamond cutting wheels.

[Means for solving problems]

The diamond cutting wheel of the present invention has a shape that is plastically deformed by press working instead of the conventional wave shape.
A concave recess with a depth of 0.1 mm to 1/2 of the substrate thickness is provided on the entire surface of the substrate, which eliminates contact with the workpiece during cutting, and also has a diamond layer on the substrate itself. It is possible to provide sufficient strength to cope with the external force applied to the material.

Hereinafter, the features of the present invention will be explained based on the attached drawings.

〔Example〕

The diamond grindstones shown in FIGS. 1 to 4 are examples in which a diamond layer 2 is baked on the outer periphery of a substrate 1. Of course, the diamond layer 2 may be replaced with diamond chips.

A plurality of concave depressions 3 are provided on the substrate 1 by press working.

The depth of the recess 3 should be deep depending on the degree of plastic working, but if it is too deep, the board thickness will become thinner in that part and there will be problems with the strength, so it should be about 0.1 mm to 1/2 of the board thickness. It is better to Further, the effect of forming the recess 3 is not so affected by its shape, but from the viewpoint of press processing, for example, the rectangular shape shown in the figure should have a side of 10 mm or less, and the circular shape should have a diameter of 10 mm or less.

Further, the concave depressions 3 may be located symmetrically on the front and back sides of the substrate 1 as shown in FIGS. 1 and 2, or in different positions on the front and back sides as shown in FIGS. 3 and 4. There is no difference in setting it in any way.

In the example diamond cutting grindstone shown in FIGS. 3 and 4, approximately diamond-shaped concave depressions 3 of different sizes are provided at different positions on the front and back sides, and the concave depressions 3 are arranged at equal intervals on concentric circles. A plurality of concentric rings are provided on the substrate 1, and the diameters of the concentric circles are changed in several stages. In this case, it is advantageous because the concave depressions 3 can be arranged uniformly and at equal intervals over the entire surface of the substrate 1.

In any case, the intervals between the concave depressions 3 should be as uniform as possible so that interference does not occur during press working, and the concave depressions 3 should be arranged so that the opposite side of the substrate 1 does not become convex. It may be provided so that the flatness of the substrate is maintained.

In the present invention, it is important that the concave recess 3 is formed on the entire surface of the substrate by press working, and that the entire substrate 1 is subjected to plastic working at this time.

A mixture of diamond abrasive grains and metal powder as a binder is processed and formed into a desired shape on the outer periphery of the substrate 1 having the depressions 3, and then this is sandwiched between molds such as graphite plates.
When sintering at 600 to 1000°C, the same effect as annealing is given to the substrate 1. That is, if the substrate 1 is sufficiently subjected to plastic working, crystal grains will be prevented from becoming coarser or will be made finer, improving the toughness of the substrate 1 and, as a result, increasing its fatigue strength. In addition, recrystallization progresses rapidly over the entire surface of the substrate 1 during heating, eliminating residual stress caused by pressing, residual stress due to rolling of the substrate material, and directionality, resulting in the substrate 1 having excellent toughness after sintering. and has little distortion.

[Effect of idea]

As explained above, in the diamond cutting grindstone of the present invention, concave depressions that are plastically deformed by press working are formed on the entire surface of the substrate, so the structure of this part becomes more dense and the substrate is strengthened. Moreover, since nothing protrudes from the surface of the substrate, the substrate does not come into contact with the workpiece during cutting, causing frictional heat and deformation.

[Brief explanation of the drawing]

1 to 4 are diagrams showing an embodiment of the present invention, and FIG. 1 is a sectional view taken along the line of FIG.
FIG. 2 is a front view, FIG. 3 is a sectional view taken along the line - FIG. 4, and FIG. 4 is a front view. 5 and 6 are diagrams showing a conventional diamond cutting grindstone having a corrugated substrate, in which FIG. 5 is a sectional view taken along the line shown in FIG. 6, and FIG. 6 is a front view. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Diamond layer, 3...Concave depression, a...Substrate, b...Concave part, c...Convex part, d...Diamond layer.

Claims (1)

[Scope of utility model registration request] A diamond cutting grindstone with diamond chips on the outer periphery of a disk-shaped substrate has concave depressions with a depth of 0.1 mm to 1/2 of the substrate thickness, which are plastically deformed by press working, on the entire surface of the substrate. A diamond cutting whetstone with a reinforced substrate characterized by: