JPH0451536A - Probe board for inspection of semiconductor product and manufacture of probe board - Google Patents

Abstract

PURPOSE:To make it easy to manufacture a probe board by making the probe board consisting of one or more probe group consisting of a plurality of probes that extend toward a common reference point and that have a tip for inspection at the side of the reference point and a base that supports probes in cantilever. CONSTITUTION:When an angle included by a virtual line corresponding to a probe 14 and the X-axis of a cartesian coordinate system with a reference point O0 as origin is theta, coordinates of a probe tip 24 for inspection are X1 and Y1, coordinates of a bearing point P2 for the probe 14 by a base 12 in the cartesian coordinate system are X2 and Y2, and the distance from the tip 24 for inspection to the bearing point P2 is l, calculate expressions X2=X1+l.costheta and Y2=Y1+l.sintheta taking the same constant value of l and a different value of angle Q for every calculation repeatedly a plurality of times to obtain many bearing points P2n, preparing in the base 12 a ring-shape edge portion 28 that continuously extends circumferentially in the periphery of the reference point O0 for the value of each bearing point P2n and that satisfies both of above expressions, and make each probe 14 be supported in cantilever at the edge portion 28, thereby manufacturing a probe board 10 for inspecting a semiconductor product. In this way, the free end lengths of probes become the same and the probe board can be easily manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an inspection probe board used for testing semiconductor products such as semiconductor integrated circuits, and a method for manufacturing the same.

(Prior Art) In testing the electrical characteristics of semiconductor products completed on semiconductor wafers, a testing probe board mounted on a testing machine is used. This type of testing probe board includes a plurality of probes each having a so-called testing tip that corresponds to a testing site such as an electrode of a semiconductor product and is pressed against the corresponding testing site.

Each probe is arranged radially on the base and cantilevered on the base.

During an inspection, each inspection tip is pressed against the corresponding inspected region by being elastically deformed by the corresponding probe under bending force.

In general, a portion of a semiconductor product to be inspected is formed on an imaginary line drawing a rectangle. Therefore, in the known inspection probe board, the probes are arranged so that the inspection tips are located on a virtual reference line that depicts a square having the same size as the square and extend radially.

However, in known inspection probe boards, the distance from the inspection tip of the probe to the attachment portion to the base, that is, the free end length, differs from probe to probe. As a result, even if the bending force that acts on the probe during inspection is the same, the moment differs for each probe, so the contact pressure that acts between the inspection tip of the probe and the part to be inspected of the semiconductor product varies for each probe. different.

In this way, if the contact pressure between the inspection tip of the probe and the part to be inspected of the semiconductor product differs depending on the probe, the part to be inspected on the semiconductor wafer is generally made of a thin film, so the part to be tested on the semiconductor wafer is generally made of a thin film. The parts are not inspected correctly, and the parts to be inspected that are subjected to high contact pressure are destroyed.

In order to solve this problem, the position of the probe's testing tip and the soldering position of the probe to the terminal formed on the base are used to determine the mounting position of the probe on the base. A method has been proposed in which an inspection probe board is manufactured by cutting the base along the defined positions (Japanese Patent Application Laid-Open No. 64-54363).

(Problem to be Solved) However, with this known manufacturing method, the mounting position of the probe to the base cannot be determined unless the soldering position of the probe to the terminal formed on the base is determined. Even if the size of the semiconductor product is different, if the arrangement of the probes on the base, such as the arrangement spacing, differs, the mounting positions of the probes on the base will differ. As a result, in this known manufacturing method, the position of the electrode part where the end of the probe is positioned by soldering is unstable and cannot be accurate, so each probe board is custom-made and standardized. It was difficult.

An object of the present invention is to provide an inspection probe holder that has the same free end length of the probes and can be easily manufactured, and a method for manufacturing the same.

(Solution Means, Effects, Effects) The inspection probe board of the present invention includes at least one probe group consisting of a plurality of probes extending toward a common reference point and having inspection tips on the side of the reference point; and a base that supports the probe in a cantilevered manner.

Each of the probes is located on a virtual straight line extending radially from the reference point, and is arranged on the base at angular intervals around the reference point.

Further, each of the probes has an angle between the corresponding virtual straight line and the X-axis of the orthogonal coordinates having the origin at the reference point as θ, and coordinate values of the inspection tip in the orthogonal coordinates as Xi and Yl. , the coordinate value of the support point of the probe by the base in the Cartesian coordinates is expressed as X2. Y2. When the distance from the inspection tip to the support point is U,
Said! It is in contact with the base at a portion that satisfies the following formula, where % is the same value.

In the above formula, 1 is the so-called free end length. Furthermore, since Xl and Yl are the same as the X and Y coordinate values of the inspected region, respectively, they can be easily determined from the semiconductor product to be inspected.

For example, the probe board of the present invention has the above formula (1) (
A large number of support points are obtained by performing the calculation in 2) multiple times at different values of angle θ, and based on the obtained support points, a ring shape that extends continuously around the reference point and satisfies both of the above equations is determined. It can be manufactured by forming a portion on the base and bringing each of the probes into contact with the base at the annular portion.

Therefore, according to the present invention, it is possible to easily manufacture a probe holder in which the attachment position of each probe to the base can be easily determined.

The base may include a plate-shaped base member having a hole, and a receiving member provided on the base member to receive the probe. In this case, it is preferable that the receiving member has an annular edge that extends continuously around the hole and satisfies both of the above expressions, and that the edge is in contact with the probe.

According to such a probe board, the distance from the virtual reference line on which each testing tip is placed to the edge, ie, l, is the same at any part of the edge. Therefore, since the virtual straight lines corresponding to each probe can be arbitrarily arranged, manufacturing can be made easier. Furthermore, if the semiconductor product has the same shape and size as the virtual lines on which the parts to be inspected are arranged, for example, even if the intervals at which the parts to be inspected are arranged are different, the shape and size of the edges will be the same. This makes it possible to produce large quantities of the same type of base.

Since the part to be inspected is generally placed on a line defining a rectangle, each inspection tip can be placed on a virtual reference line that defines the rectangle, and the X-axis can be made perpendicular to the virtual reference line. .

The present invention includes at least one probe group consisting of a plurality of probes extending toward a common reference point and having inspection tips on the side of the reference point, and a base supporting the probe in a cantilever shape. A method for manufacturing a probe board for semiconductor product inspection, wherein each of the probes is located on a virtual straight line extending radially from the reference point and is arranged on the base at angular intervals around the reference point, The angle between the virtual straight line corresponding to the probe and the X axis of rectangular coordinates with the origin at the reference point is θ, the coordinate values of the inspection tip in the rectangular coordinates are XI and Yl, and the coordinate values of the inspection tip in the rectangular coordinates are When the coordinate values of the support point of the probe by the base are X2, Y2, and the distance from the inspection tip to the support point is 2, the following formula is obtained by subtracting the same value from 1: X2 =XI +il ・cos θY2= Y
1 + j2 - sin θ is performed multiple times by using a different value of angle θ for each calculation to obtain a large number of support points, and based on each of the obtained support points, continuously move around the reference point. The method includes forming an annular edge on the base that is elongated and satisfies both of the above expressions, and supporting each probe in a cantilever shape on the edge.

(Example) The probe board 10 for testing semiconductor products shown in FIGS. 1 and 2 is used for testing semiconductor products arranged on an imaginary line in which a line connecting adjacent parts to be tested defines a square. It will be done.

The probe board 10 includes a disc-shaped base member 12 and a plurality of probes 14 arranged on one surface of the base member.
, an annular receiving member 16 provided on the base member 12 and receiving each probe 14 , and a terminal 18 provided on the base member 12 for each globe 14 .

In the illustrated example, the base member 12 consists of a printed circuit board. To this end, each terminal 1B is printed on the other side of the base member 12 at angularly spaced locations around the center of the base member 12. A hole passing through the base member 12 and the terminal 18 is formed for each terminal. A vial 20 electrically connecting each probe to the measuring machine is inserted into the equation and soldered to the terminal 18.

A hole 22 is formed in the center of the base member 12 to confirm the inspection tip 24 of the probe 14 and the inspected portion of the semiconductor product. Although the shape of the hole 22 is square in the illustrated example, it can be made into any shape such as circular or rectangular.

Each probe 14 is provided corresponding to the part to be inspected, and is arranged on a virtual straight line extending radially from the center of the base member 12 at angular intervals from each other around the center. has been done. The rear end of each probe 14 is soldered to a corresponding terminal 18.

The testing tip 24 of each probe 14 is provided on the center side, and is bent toward the semiconductor product so as to face the corresponding testing site during testing. The virtual reference line connecting the inspection tips 424 of adjacent probes 14 defines a square that is the same size as the square defined by the virtual line connecting adjacent test regions.

Each probe 14 is made of a wire rod having a circular cross section, and is attached to the receiving member 16 with an adhesive 26 such as an adhesive. As a result, each probe 14 is supported in a cantilevered manner by a base made up of the base member 12 and the receiving member 16.

The edge 28 extends continuously around the hole 22 and is formed as a corner satisfying the following formula.

X2 ==Xl +l1-cosθ---(1)Y2=
Y1+u-sinθ---(2) above (1) and (2
), as shown in FIG. 3, θ is a straight line 30 extending from the intersection of the extension lines of the probe, that is, the reference point OO, through the arrangement point PI of the inspection tip 24 and the support point P2 of the probe 14 by the edge 28. This is the angle formed between Furthermore, xl and Yl are the X and Y coordinate values of the arrangement point P1 in the orthogonal coordinates, respectively, and xl and Y2 are the X and Y coordinate values of the support point P2 in the orthogonal coordinates, respectively.

Furthermore, 1 is from the arrangement point P1 of the inspection tip to the support point P2.
It is a constant value depending on the distance.

Therefore, the free end lengths of the probes 14 are the same. That is, since X2-Xi = IL-cosθ, the above formula (1) can be obtained.

Similarly, Y2-Yl=Jl-sinθ Therefore, the above formula (2) can be obtained.

Note that m is the distance from the origin 00 to the arrangement point PI, and L is the distance from the origin OO to the support point P2.

In the above equations (1) and (2), the straight line 30 corresponds to a virtual straight line assigned to an arbitrary probe, and the arrangement point P1
Since P2 corresponds to the intersection of the straight line 30 and the virtual reference line 32 connecting the test tips of a plurality of adjacent probes, the support point P2 corresponds to the edge 28 of the receiving member 16, and 2 corresponds to the free end of the probe. Corresponds to the length. Therefore, since 2 is the same value, the free end lengths of the probes are the same.

Furthermore, since the reference line 32 corresponds to a virtual line connecting adjacent parts to be inspected of the semiconductor product to be inspected, xl and Yl can be easily determined from the semiconductor product to be inspected. Therefore, the edge 28 can be determined by calculating a large number of support points P2 by substituting the same value for 2 in the above equations (1) and (2) and different values for θ.

According to the probe board 10 described above, a line 30n connecting the reference point, that is, the origin oO, and an arbitrary point P2n on the edge 28
, from the intersection Pin of the line 30n and the line 32 to the point P2
Since the distance to n is always the same, any virtual straight line can be assigned to the probe 14.

The rectangular coordinates are orthogonal to the X-axis or an imaginary reference line connecting adjacent inspection tips, and orthogonal to the Y-axis or another imaginary reference line connecting other adjacent inspection tips, as shown in Figure 3. For example, the X-axis extends on line 30n (line 3
There may be other coordinates with the reference point oO as the origin, such as coordinates (matching 0n).

Instead of attaching each probe 14 to the receiving member 16 with the adhesive 26, as shown in FIG. It may be fixed with adhesive or the like.

The probes do not need to be arranged so that the extension lines of all the probes intersect at a common reference point OO, but depending on the type of semiconductor product, for example, they can be divided into multiple probe groups each having multiple probes. A common reference point and rectangular coordinates may be determined for each probe group.

In the embodiment shown in FIG. 5, each probe is included in either a first probe group consisting of a plurality of probes 14a or a second probe group consisting of another plurality of probes 14b. .

Each probe 14a of the first probe group is brought into contact with the base at the edge 28a so that its extended line intersects at a common reference point Oa. On the other hand, each probe 14b of the second probe group is in contact with the base at the edge 28b so that its extension line intersects at the common reference point Ob. The reference points Oa and ob are each used as the origin of the Cartesian coordinates of the corresponding probe group.

In the embodiment shown in FIG. 6, each probe is included in either a first probe group consisting of a plurality of probes 14c or a second probe group consisting of another plurality of probes 14d. .

Each probe 14c of the first probe group is brought into contact with the base at the edge 28c so that its extended line intersects at a common reference point Oc. On the other hand, each probe 14d of the second probe group is brought into contact with the base at the edge 28d so that its extension lines intersect at the common reference point Od. The reference points Oc and Od are each used as the origin of the Cartesian coordinates of the corresponding probe group.

In the embodiments shown in FIGS. 5 and 6, if there are other probes, those other probes are at least one probe group different from the first and second probe groups described above.
Other probe groups may also be used.

FIG. 7 shows the relationship between the variation in the free end length of a probe using a tungsten needle (horizontal axis) and the resulting difference in contact pressure (vertical axis). The length of the free end of the probe was 5 mm, the diameter of the wire of the probe was 250 μm, the diameter of the tip of the probe was 50 μm, and the amount of deflection of the probe was 100 μm. Further, the contact area of the tip of the probe with the region to be inspected was set to about 185 μm 2 since the tip of the probe normally contacts the region to be inspected in an inclined state with respect to the region to be inspected.

As is clear from Fig. 5, the free end length of the probe is 25
The contact pressure is 194.3kg/c due to the difference in μm.
m2 also changes, and if the free end length of the probe differs by 250 μm, the contact pressure will change by 1943 kg/Cm2.

[Brief explanation of drawings]

Figure 1 shows an inspection probe holder for semiconductor products according to the present invention.
2 is a sectional view taken along line 2-2 in FIG. 1; FIG. 3 is a diagram for explaining the present invention in detail; FIG.
Figure 4 is a diagram showing another example of fixing the probe to the base, Figures 5 and 6 are diagrams each showing other examples of the probe placement method, and Figure 7 is a diagram showing the length of the free end of the probe. FIG. 3 is a diagram showing variations and changes in contact pressure. 10: Inspection probe board for semiconductor products, 12: Base member, 14.14a, 14b, 14c, 14d nib probe, 16: Receiving member, 22: Hole, 24: Inspection tip, 28.28a, 28b.

Claims (4)

[Claims] (1) At least one probe group consisting of a plurality of probes extending toward a common reference point and having inspection tips on the side of the reference point, and a base supporting the probe in a cantilever shape; A probe board for testing semiconductor products, wherein each of the probes is arranged on a virtual straight line extending radially from the reference point on the base at angular intervals around the reference point, Each of the probes has an angle between the corresponding virtual straight line and the X-axis of rectangular coordinates having the reference point as the origin, θ,
The coordinate value of the inspection tip in the rectangular coordinate is X1,
Y1, the coordinate value of the support point of the probe by the base in the rectangular coordinates is X2, Y2, the distance from the inspection tip to the support point is l, then the following formula where l is the same value: X2= A probe board for semiconductor product inspection, which is brought into contact with the base at a portion that satisfies the following: X1+l・cos θ Y2=Y1+l・sin θ. (2) The base includes a plate-shaped base member having a hole;
a receiving member provided on the base member to receive the probe, the receiving member having an annular edge that extends continuously around the hole and satisfies both of the above expressions;
The probe board for semiconductor product inspection according to claim 1, wherein the probe board is in contact with the probe at the edge. (3) For semiconductor product inspection according to claim (1), each of the inspection tips is arranged on a virtual reference line defining a rectangle, and the X-axis is perpendicular to the virtual reference line. probe board. (4) at least one probe group consisting of a plurality of probes extending toward a common reference point and having inspection tips on the side of the reference point; and a base supporting the probe in a cantilevered manner; A method for manufacturing a probe board for semiconductor product inspection, wherein each of the probes is located on a virtual straight line extending radially from the reference point and arranged on the base at angular intervals around the reference point, , the angle between the virtual straight line corresponding to the probe and the X-axis of rectangular coordinates with the reference point as the origin is θ, and the coordinate values of the inspection tip in the rectangular coordinates are X1, Y1.
, the coordinate values of the support point of the probe by the base in the rectangular coordinates are X2, Y2, and the distance from the inspection tip to the support point is l, then the following equation where l is the same value: X2 = X1 + l・Calculate cos θ Y2=Y1+l・sin θ multiple times by using a different value of angle θ for each calculation to obtain a large number of support points, and based on each of the obtained support points, calculate the area around the reference point. A method for manufacturing a probe board for semiconductor product inspection, comprising: forming an annular edge portion that extends continuously and satisfying both of the above formulas on the base, and supporting each of the probes in a cantilever shape on the edge portion. .