JPH07130800A - Probe card - Google Patents

Abstract

PURPOSE:To prevent the positional discrepancy of the end of each probe of a probe card which is caused by the circumferential rotation of each probe in a probe fastening ring, in the inspection of a wafer. CONSTITUTION:On each probe 2 embedded in a probe fastening ring 3 of a probe card, a stabilizer is so fixed that it is parallel with the center axis of each cylindrical probe 2 and is vertical to the surface of each probe 2. Thereby, when each probe 2 is rotated in its circumferential direction in the probe fastening ring 3, each stabilizer so generates a resistant force that the rotation of each probe 2 is prevented, and in its turn, the displacement of the end of each probe 2 is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card,
In particular, the present invention relates to a structure of a fixed portion of a probe whose tip is brought into contact with a pad of a semiconductor chip for sequentially testing electrical characteristics of the semiconductor chip divided and manufactured on the semiconductor wafer.

[0002]

2. Description of the Related Art FIG. 6 showing a plan view of a conventional probe card disclosed in, for example, Japanese Patent Application Laid-Open No. 2-293672.
FIG. 6B is a sectional view taken along the line CC ′ of FIG.
In this probe card, a connector portion 23 is formed at one end of a resin card substrate 1 and an opening portion 24 is provided at the other end of the probe card. Many ends are embedded in the ring 25. The rear end of the probe 2 is connected to the wiring 20 formed on the surface of the card substrate 1, and one end of the wiring 20 is connected to the connector conductor 22 via the connection line 21.

When the electrical characteristics of the chips in the semiconductor wafer 4 are measured using this probe card, first, the opening 24 is positioned on the chip area on the semiconductor wafer 4, and then the probe card is lowered. Then, the tip of the probe 2 having springiness was brought into contact with the pad 5 for measurement.

[0004]

However, one of the precisions required when using such a probe card is the positional precision of the tip of the probe 2 with respect to the pad 5 on the semiconductor wafer 4. , Because the tips are not aligned, it is not possible to make accurate contact with the pad 5,
Accidents often occurred in which a chip that had no problem in characteristics was judged as a defective product.

The cause of such "unevenness" of the probe 2 has not been clearly understood in the past, but it was found that the main cause is the structure for fixing to the fixing ring 25 of the probe 2. did. That is, in the conventional case, the probe 2 has the ring 25.
The cause was that it would rotate inside.

[0006] This rotational displacement is gradually generated by repeatedly contacting the tip of the semiconductor wafer 4 and vibration of the semiconductor wafer 4 during its movement. Even with a small rotation angle, this displacement is magnified at the tip of the probe 2, resulting in a horizontal displacement of 10 to 50 μm, and this displacement amount is negligible with respect to the pad 5 size of 50 to 100 μm. It became clear that not.

It is an object of the present invention to provide a probe card which prevents such a rotational displacement and enables a highly reliable test.

[0008]

The first structure of the present invention is as follows.
A probe having a tip abutting on a pad on a semiconductor wafer; a card substrate having an opening; and a ring provided at a peripheral end of the opening, the rear end of the probe being inside the ring. In the inserted and fixed probe card, means for preventing rotational displacement of the probe is provided.

A second structure of the present invention comprises a probe whose tip abuts on a pad on a semiconductor wafer, a card substrate having an opening, and a ring provided at the peripheral end of the opening. In the probe card in which the rear end of the probe is inserted and fixed in the ring, the probe is made of a square material.

[0010]

1 is a plan view of a probe card according to a first embodiment of the present invention seen from above, FIG. 2 is a sectional view taken along the line AA 'of FIG. 1, and FIG. 3 is a sectional view of FIG. It is a sectional view taken along the line -B '.

In FIG. 1, in this embodiment, an insulating probe fixing ring 3 for fixing a large number of probes 2 to be brought into contact with a pad of a semiconductor wafer is fixed to the lower surface of a cart substrate 1, and a card is used. Conductor wiring extends from the rear end portion of the probe 2 to the connector connection portion at the right end on the lower surface of the substrate 1, and the semiconductor wafer tester electrically connected to this connection portion tests the characteristics of the semiconductor wafer. Be seen.

Referring to FIG. 2 showing a longitudinal section of the ring 3 of FIG. 1, since the tip of the probe 2 is brought into contact with the electrode pads 5 on the semiconductor wafer 4 without displacement, the probe 2 A stabilizer 6 for preventing the rotational movement of the is embedded in the ring 3.

Referring to FIG. 3 showing a cross section of the probe 1 including the stabilizer 6, the probe 2 has a circular cross section, and four stabilizer plates are provided on the circumference thereof.
It has a cross shape. The stabilizer 6 is manufactured by an integral molding method by pressing the probe 2, or is fixed to the probe 2 by an adhesive method. Since the rotation of the probe 2 is prevented by the stabilizer 6, the tip of the probe 2 is accurately positioned on the pad 5.

FIG. 4 is a sectional view showing a probe according to a second embodiment of the present invention. In FIG. 4, in this embodiment, the stabilizer 6 is composed of three plates, and these plates are provided on the circumferential portion of the probe 2 so as to form an angle of 120 ° with each other.

Since this embodiment is common to the first embodiment except the shape of the stabilizer, the description of the common parts will be omitted. Also in FIG. 5 below, the common part is omitted in the same manner.

Referring to the perspective view of FIG. 5A showing the probe portion of the third embodiment of the present invention, the probe 10 of this embodiment is shown.
The stabilizer 11 is a concavo-convex pattern formed by pressing the probe 10 from two directions and plastically deforming it.
Can be prevented from rotating.

Referring to the perspective view of FIG. 5B showing the probe portion of the fourth embodiment of the present invention, the probe 12 of this embodiment is shown.
The stabilizer 13 is a concavo-convex shape that is pressed from four directions and plastically deformed, and likewise can prevent rotation.

Referring to the perspective view of FIG. 5C showing the probe portion of the fifth embodiment of the present invention, the probe 14 of this embodiment is shown.
Is made of a square bar having a square or rectangular cross section, and it has an advantage that rotation can be prevented without particularly processing this part. The corners may have chamfered corners, may have an elliptical shape, or may have a triangular cross-sectional shape.

Referring to the perspective view of FIG. 5D showing the probe portion of the sixth embodiment of the present invention, the probe 15 of this embodiment is shown.
The stabilizer 16 is made of a so-called satin-finished surface where fine irregularities are formed. The surface of the satin-finished surface is made by a mechanical method such as spraying a sound or a chemical method such as etching. Since the ring 3 fits on the matte surface, the rotational force can be prevented. In particular, when the ring 3 is formed by injecting the mold resin, the resin can be fixed in a state of filling the fine irregularities without a gap.

Referring to the perspective view of FIG. 5 (E) showing the probe portion of the seventh embodiment of the present invention, the probe 1 is
The stabilizer 18 of No. 7 is formed by being bent at the bent portion 19, and the portion shown by the dotted line is axially deformed to the portion shown by the solid line, so that rotation can be prevented.

[0021]

As described above, according to the present invention, since the probe does not rotate, the displacement of the tip of the probe disappears, the tip accurately abuts on the pad, and a highly reliable test can be performed. Not only that, there is an effect that the pitch of the pads of the semiconductor chip can be narrowed.

[Brief description of drawings]

FIG. 1 is a plan view of a probe card according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG.

3 is a cross-sectional view taken along the line BB ′ of FIG.

FIG. 4 is a cross-sectional view of a probe trailing end portion of a probe card according to a second embodiment of the present invention.

5A to 5E are perspective views showing the rear end of the probe of the probe card of the third to seventh embodiments of the present invention, respectively.

6A and 6B are a plan view of a conventional probe card and a cross-sectional view taken along the line CC ′ of FIG. 6, respectively.

[Explanation of symbols]

 1 Card Substrate 2,10,12,14,15,17 Probe 3,25 Probe Fixing Ring 4 Semiconductor Wafer 5 Electrode Pad 6,11,13,16,18 Stabilizer 19 Bent 20 Wiring 21 Connection Line 22 Connector Conductor 23 Connector 24 Opening

Claims (6)

[Claims] 1. A rear end of the probe comprising: a probe whose tip contacts a pad on a semiconductor wafer; a card substrate having an opening; and a ring provided at a peripheral end of the opening. A probe card in which the probe is inserted and fixed in the ring, and means for preventing rotational displacement of the probe is provided. 2. The probe card according to claim 1, wherein the means is a plurality of plates provided at the rear end portion. 3. The probe card according to claim 1, wherein the means is an uneven portion formed by plastically deforming the rear end portion. 4. The probe card according to claim 1, wherein the means is a portion formed by bending the rear end portion in the axial direction. 5. The probe card according to claim 1, wherein the means is a surface portion having fine irregularities formed mechanically or chemically. 6. A rear end of the probe, comprising a probe having a tip abutting on a pad on a semiconductor wafer, a card substrate having an aperture, and a ring provided at a peripheral end of the aperture. A probe card in which the probe is inserted and fixed in the ring, wherein the probe is made of a square material.