JPH04507B2 - - Google Patents

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Publication number
JPH04507B2
JPH04507B2 JP61267950A JP26795086A JPH04507B2 JP H04507 B2 JPH04507 B2 JP H04507B2 JP 61267950 A JP61267950 A JP 61267950A JP 26795086 A JP26795086 A JP 26795086A JP H04507 B2 JPH04507 B2 JP H04507B2
Authority
JP
Japan
Prior art keywords
ink
acid
resin
oil
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61267950A
Other languages
Japanese (ja)
Other versions
JPS63120779A (en
Inventor
Masaharu Hatsutori
Norimasa Ikeda
Mitsuru Suezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP61267950A priority Critical patent/JPS63120779A/en
Publication of JPS63120779A publication Critical patent/JPS63120779A/en
Publication of JPH04507B2 publication Critical patent/JPH04507B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】[Detailed description of the invention]

(産業上の利用分野) 本発明は水なし平版印刷において、耐地汚れ性
が良好で、かつ印刷適性の優れた水なし平版用イ
ンキ組成物に関するものである。 (従来技術) 現在の印刷の主流をなす湿し水によるインキ反
撥性を利用した平版印刷法に対して、かかる湿し
水を必要としない平版印刷法を使用する水なし平
版印刷法が提案され、特にシリコーンゴムを非画
線部にもうけた平版印刷版を用いて印刷する方法
が実用化されている。 このような水なし平版印刷において従来の油性
インキを用いて印刷すると、地汚れが発生して好
ましくないということが知られている。 水なし平版印刷における地汚れ発生という現象
は印刷中に印刷機の駆動部やローラの摩擦に起因
して版面の温度が上昇し、インキ自体の凝集力が
低下してしまい、本来インキ反撥性であるべき非
画線部にインキが付着するものである。 このような現象は湿し水を使用する従来の平版
印刷においては、全く考慮する必要はなく、水な
し平版印刷版に発生する特有の問題である。なぜ
なら従来の湿し水を用いる平版印刷の場合はイン
キ反撥機構が異なり、また湿し水の蒸発により版
面温度の上昇はかなり抑制されるので、このよう
な地汚れ現象は考慮する必要がないし、インキの
凝集力はむしろ小さいものが好ましいとされてい
る。 これを改良するためにバインダー樹脂成分を高
分子量化して凝集力を上げ耐地汚れ性を改良する
方法が考えられる。しかしながら、例えば油性イ
ンキ中の樹脂成分を従来の方法で高分子量化して
も、耐地汚れ性が良好で、かつ印刷適性が優れ、
また良好な印刷物を与える水なし平版インキを得
ることは難しい。 (発明が解決しようとする問題点) 本発明は、かかる従来技術の諸欠点に鑑み創案
されたもので、その目的は耐地汚れ性に優れ、か
つ印刷適性の優れた水なし平版用インキ組成物を
提供することにある。 (問題点を解決するための手段) かかる本発明の目的は、沸点200℃以上の炭化
水素溶媒と、乾性油ないし半乾性油との混合物中
で加熱撹拌溶解下に、フエノール樹脂、ロジン変
性フエノール樹脂、エポキシ樹脂およびキシレン
樹脂の群から選ばれる少なくとも1種を活性水素
を含有するアミン化合物で分子鎖伸長せしめて得
られた変性樹脂を含有することを特徴とする水な
し平版用インキ組成物により達成される。 本発明に使用される沸点200℃以上の炭化水素
溶媒としては、炭素数12以上の脂肪族、脂環族、
芳香族炭化水素が広く使用出来るが、好ましく
は、通常の油性インキ溶剤として使用されている
沸点200〜350℃の石油系溶剤が使用され、例えば
パラフイン系、イソパラフイン系、α−オレフイ
ン系、ナフテン系、芳香族含有パラフイン系など
の高沸点石油溶剤が挙げられる。 本発明において乾性油としては、ヨウ素価130
以上の動植物油が使用でき、例えばアマニ油、オ
イチシカ油、エノ油、キリ油、脱水ヒマシ油など
およびこれらの重合体が挙げられ、また半乾性油
としてはヨウ素価100〜130の動植物油で、例えば
綿実油、大豆油、ゴマ油、ナタネ油などやこれら
の重合体が挙げられる。 本発明において使用されるビヒクル用樹脂とし
ては、フエノール樹脂、ロジン変性フエノール樹
脂、エポキシ樹脂およびキシレン樹脂の群から選
ばれる少なくとも1種が挙げられ、これらは単独
または2種以上混合して使用することができる。 本発明において分子鎖伸長剤として用いられる
活性水素を含有するアミン化合物としては、エチ
ルアミン、n−プロピルアミン、n−ブチルアミ
ン、ヘキシルアミン、ラウリルアミン、ステアリ
ルアミン、エタノールアミン、アリルアミン等の
モノアミン、エチレンジアミン、トリメチレンジ
アミン、テトラメチレンジアミン、ペンタメチレ
ンジアミン、ヘキサメチレンジアミン等のジアミ
ン、ジエチレントリアミン、トリエチレンテトラ
ミン、ビスヒドロキシジエチレントリアミン等の
ポリアミンやアミンアダクト等が有効に使用でき
る。 また、アミン誘導体としてのアミド化合物とし
ては、ギ酸、酢酸、プロピオン酸、イタコン酸、
カプリル酸、グリコール酸、アクリル酸、ラウリ
ン酸、ミリスチン酸、パルミチン酸、ステアリン
酸、オレイン酸、リノール酸、リノレイン酸等の
モノカルボン酸、マロン酸、コハク酸、グルタル
酸、アジピン酸、ピメリン酸、スペリン酸、アゼ
ライン酸、セバシン酸、マレイン酸、フマール
酸、ダイマー酸などの有機ジカルボン酸、トリメ
リツト酸等の有機トリカルボン酸、3,9−ビス
(2カルボキシアルキル)2,4,8,10−テト
ラオキサスピロウンデカン等の有機カルボン酸と
前記のアミン、ジアミン、ポリアミン等との縮合
物が挙げられる。 本発明に用いられる活性水素を含有するアミン
化合物は上述のような構造組成のものであるが、
取扱い、安全性等を考慮すると、ポリアミド樹脂
が好ましく、樹脂、溶剤との相溶性の点から炭素
数6〜60の酸とポリアミンからなるポリアミド樹
脂が特に好ましく用いられる。 上記ポリアミド樹脂の分子量としては500〜
20000の範囲が好ましく、より好ましくは500〜
10000の範囲である。 本発明の変性樹脂は、沸点200℃以上の炭化水
素溶媒中、乾性油ないし半乾性油中、あるいはこ
れらの混合物中で加熱撹拌溶解下に、ビビクル用
樹脂あるいはこれらの混合物と活性水素を含有す
るアミン化合物を反応させることにより得られる
ものであるが、反応性条件としては通常温度70〜
200℃の範囲が好ましく、より好ましくは100〜
170℃であり、反応体の濃度としては通常5〜80
重量%が望ましく、より好ましくは20〜70重量%
が良い。この反応は印刷インキ用ワニス組成物の
製造工程において行うことができ、まず樹脂成
分、乾性油、溶媒を加えて加熱溶解し、次いで所
定温度で、活性水素を含有するアミン化合物を添
加し、反応せしめるものである。また、これらの
反応系に、インキ用ワニス組成物成分として極性
溶媒などが含まれていてもよく、必要に応じて、
他の成分を含有することもできる。 反応時間は目的とするインキ用ワニス組成物の
要求特性に応じて任意に選ぶことができるが、通
常0.1〜3時間、好ましくは0.3〜2時間である。 本発明による変性樹脂を含有する組成物は、従
来から通常平版印刷用に用いられている公知の他
のインキ成分を加えてインキ化される。 このような成分としては、必要に応じて追加さ
れる樹脂成分、例えばフエノール樹脂、ロジン変
性フエノール樹脂、アルキツド樹脂、ロジンエス
テル、石油樹脂、マレイン酸樹脂等が、また乾性
油、半乾性油等があり、これらを単に添加しただ
けでも良いし、本発明で得られた樹脂組成物とク
ツキングして用いてもよい。また、ゲル化剤とし
て、有機アルミニウム化合物等、公知のものが使
用できる。 また、インキとする場合の着色剤としては、無
機ないし有機系の顔料など従来のインキ組成物に
使用されているものが用いられる。 さらに、例えばワツクス、乾燥剤、グリース、
分散剤、充填剤、その他公知のものを必要に応じ
て使用することができる。 以上のような材料を用いて三本ロールで練肉し
たインキは地汚れ発生温度が高く、印刷適性に優
れ、バランスのとれた水なし平版印刷用インキと
なすことができる。 (実施例) 以下実施例により具体的に説明するが、本発明
はこれに制限されるものではない。 なお、実施例、比較例に用いられる部数は重量
部である。 実施例 1 ロジン変性フエノール樹脂(ポリスチレン基準
重量平均分子量5万)37部、“舶純亜麻”No.4(東
新油脂(株)製乾性油)20部、5号ソルベント(日本
石油(株)製炭化水素溶媒、沸点270〜310℃)40部を
窒素流下に混合、加熱昇温し、200℃で60分加熱
撹拌した後に、ダイマー酸とジエチレントリアミ
ンとの縮合物(モル比1:1)のポリアミド化合
物(分子量:5000)を3部加え、30分間反応させ
た。 このようにして得られたワニス85部に“セイカ
フアースト”イエロー2340(大日精化(株)製インキ
用黄色顔料)15部を加えて、常法により、3本ロ
ールで混練し、インキAを得た。 実施例 2 シクロペンタジエン系石油樹脂(重量平均分子
量2.2万)42部、“舶純亜麻仁油”No.4 16部、5
号ソルベント40部を窒素流下に混合、加熱溶解
後、180℃で加熱撹拌下にジエチレントリアミン
2部を添加し、30分間加熱撹拌した。 このようにして得られたインキ用ワニスから実
施例1と同様にしてインキ化を行い、インキBを
得た。 実施例 3 実施例1の組成において、ダイマー酸とジエチ
レントリアミンとの縮合物の代りに、リノール酸
とヘキサメチレンジアミンとの縮合物(分子量:
3000)を使用して、同様にワニス化、インキ化を
行ない、インキCを得た。 比較実施例 1 実施例1において、ロジン変性フエノール樹脂
を40部としてポリアミド化合物を使用しないで、
同様にワニス化、インキ化を行ない、インキDを
得た。 比較実施例 2 実施例2において、石油樹脂を44部として、ジ
エチレントリアミンを使用しないで、同様にワニ
ス化、インキ化を行ない、インキEを得た。 上述の実施例および比較実施例で得られたイン
キA〜Eについて、それぞれの方法でインキ特性
および印刷特性を評価し、結果を表1に示した。 (インキ特性および評価方法) 版胴に温水を通じて版面を昇温できるように改
良した印刷機に、シリコーンゴムよりなる非粘着
性層を有する水なし平版を取り付け、湿し水を供
給することなしに、版面を昇温しながら印刷し、
一定のベタ濃度において印刷物に地汚れが発生し
た際の表面温度を地汚れ発生温度とした。地汚れ
発生温度の高いインキほど実用印刷においても地
汚れが発生しにくい。 次に30℃においてこれらのインキの流動性(フ
ロー値)をスプレツドメーターで測定し、インコ
メーターでタツク値を測定した。また、インキの
それぞれについて、水なし平版を用いて印刷を行
ない、マクベス反射濃度計で印刷物のベタ濃度
0.95のところの光沢値を60度鏡面反射光沢計で測
定した。 この結果から、本発明に基づくインキA、Cは
ブランクインキDに比較して、また、インキB
は、ブランクインキEに比較して、地汚れ発生温
度が高く、タツク値が低い等の点で優れているこ
とがわかる。 実用印刷テストにおいても、インキA,Cをイ
ンキDと、またインキBをインキEと比較したと
ころ、インキA、B、Cはいずれも、紙面の汚れ
の発生もなく、パイリング、紙むけなどの印刷ト
(Industrial Application Field) The present invention relates to an ink composition for waterless lithographic printing which has good background stain resistance and excellent printability in waterless lithographic printing. (Prior art) In contrast to the current mainstream printing method, which uses the ink repellency of dampening water, a waterless planographic printing method that uses a planographic printing method that does not require dampening water has been proposed. In particular, a method of printing using a lithographic printing plate having silicone rubber in the non-printing area has been put into practical use. It is known that when conventional oil-based ink is used in such waterless planographic printing, scumming occurs, which is undesirable. The phenomenon of scumming in waterless planographic printing is caused by the friction of the printing press's drive unit and rollers during printing, which causes the temperature of the plate surface to rise and the cohesive force of the ink itself to decrease, which is due to the fact that the ink itself is not naturally repellent. The ink adheres to the non-image area where it should be. Such a phenomenon does not need to be considered at all in conventional lithographic printing using dampening water, and is a problem unique to waterless lithographic printing plates. This is because in the case of conventional lithographic printing that uses dampening water, the ink repulsion mechanism is different, and the increase in plate surface temperature is considerably suppressed by the evaporation of dampening water, so there is no need to take this scumming phenomenon into consideration. It is said that it is preferable for the ink to have a small cohesive force. In order to improve this problem, it is possible to consider a method of increasing the molecular weight of the binder resin component to increase the cohesive force and improve the dirt resistance. However, even if the resin component in oil-based ink is made to have a high molecular weight using conventional methods, it still has good stain resistance and printability.
Furthermore, it is difficult to obtain waterless lithographic inks that give good printed matter. (Problems to be Solved by the Invention) The present invention was devised in view of the various shortcomings of the prior art, and its purpose is to create an ink composition for waterless planography that has excellent background stain resistance and printability. It's about providing things. (Means for Solving the Problems) The object of the present invention is to dissolve a phenolic resin, a rosin-modified phenol, and a phenolic resin in a mixture of a hydrocarbon solvent having a boiling point of 200° C. or more and a drying oil or a semi-drying oil while heating and stirring. By an ink composition for waterless lithographic printing, comprising a modified resin obtained by elongating the molecular chain of at least one member selected from the group of resins, epoxy resins, and xylene resins with an amine compound containing active hydrogen. achieved. Hydrocarbon solvents with a boiling point of 200°C or higher used in the present invention include aliphatic and alicyclic solvents having 12 or more carbon atoms;
A wide range of aromatic hydrocarbons can be used, but petroleum solvents with a boiling point of 200 to 350°C, which are commonly used as oil-based ink solvents, are preferably used, such as paraffinic, isoparaffinic, α-olefinic, and naphthenic solvents. Examples include high boiling point petroleum solvents such as aromatic and aromatic paraffinic solvents. In the present invention, the drying oil has an iodine value of 130
The above animal and vegetable oils can be used, such as linseed oil, oiticica oil, eno oil, tung oil, dehydrated castor oil, etc., and polymers thereof; semi-drying oils include animal and vegetable oils with an iodine value of 100 to 130; Examples include cottonseed oil, soybean oil, sesame oil, rapeseed oil, and polymers thereof. The vehicle resin used in the present invention includes at least one selected from the group of phenolic resins, rosin-modified phenolic resins, epoxy resins, and xylene resins, and these may be used alone or in a mixture of two or more. I can do it. The amine compounds containing active hydrogen used as molecular chain extenders in the present invention include monoamines such as ethylamine, n-propylamine, n-butylamine, hexylamine, laurylamine, stearylamine, ethanolamine, allylamine, ethylenediamine, Diamines such as trimethylene diamine, tetramethylene diamine, pentamethylene diamine, and hexamethylene diamine, polyamines such as diethylene triamine, triethylene tetramine, and bishydroxydiethylene triamine, and amine adducts can be effectively used. In addition, amide compounds as amine derivatives include formic acid, acetic acid, propionic acid, itaconic acid,
Monocarboxylic acids such as caprylic acid, glycolic acid, acrylic acid, lauric acid, myristic acid, palmitic acid, stearic acid, oleic acid, linoleic acid, linoleic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, Organic dicarboxylic acids such as speric acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, dimer acid, organic tricarboxylic acids such as trimellitic acid, 3,9-bis(2carboxyalkyl)2,4,8,10-tetra Examples include condensates of organic carboxylic acids such as oxaspiroundecane and the above-mentioned amines, diamines, polyamines, and the like. The active hydrogen-containing amine compound used in the present invention has the above-mentioned structural composition, but
In consideration of handling, safety, etc., polyamide resins are preferred, and polyamide resins composed of an acid having 6 to 60 carbon atoms and a polyamine are particularly preferably used in view of compatibility with the resin and solvent. The molecular weight of the above polyamide resin is 500~
The range is preferably 20000, more preferably 500~
The range is 10000. The modified resin of the present invention contains a vehicle resin or a mixture thereof and active hydrogen, which is dissolved under heating and stirring in a hydrocarbon solvent with a boiling point of 200°C or higher, in a drying oil or a semi-drying oil, or in a mixture thereof. It is obtained by reacting an amine compound, but the reaction conditions are usually at a temperature of 70~70℃.
The range is preferably 200℃, more preferably 100~
The temperature is 170℃, and the concentration of reactants is usually 5 to 80℃.
% by weight is desirable, more preferably 20-70% by weight
is good. This reaction can be carried out in the manufacturing process of a varnish composition for printing ink. First, the resin component, drying oil, and solvent are added and dissolved by heating. Then, an amine compound containing active hydrogen is added at a predetermined temperature, and the reaction is carried out. It is something that forces you to do something. In addition, these reaction systems may contain a polar solvent or the like as an ink varnish composition component, and if necessary,
It can also contain other ingredients. The reaction time can be arbitrarily selected depending on the required characteristics of the desired ink varnish composition, but is usually 0.1 to 3 hours, preferably 0.3 to 2 hours. The composition containing the modified resin according to the present invention is made into an ink by adding other known ink components conventionally used for lithographic printing. Such components include resin components added as necessary, such as phenolic resins, rosin-modified phenolic resins, alkyd resins, rosin esters, petroleum resins, maleic acid resins, and drying oils, semi-drying oils, etc. These may be simply added, or may be combined with the resin composition obtained in the present invention. Furthermore, known gelling agents such as organoaluminum compounds can be used. In addition, as a coloring agent when used as an ink, those used in conventional ink compositions, such as inorganic or organic pigments, are used. Furthermore, for example, wax, desiccant, grease,
Dispersants, fillers, and other known agents can be used as necessary. The ink kneaded using three rolls using the above-mentioned materials has a high scumming temperature, has excellent printability, and can be made into a well-balanced ink for waterless lithographic printing. (Example) The present invention will be specifically explained below using Examples, but the present invention is not limited thereto. Note that the numbers used in Examples and Comparative Examples are parts by weight. Example 1 37 parts of rosin-modified phenolic resin (weight average molecular weight based on polystyrene: 50,000), 20 parts of "Nippon Flax" No. 4 (drying oil manufactured by Toshin Yushi Co., Ltd.), No. 5 solvent (Nippon Oil Co., Ltd.) 40 parts of a hydrocarbon solvent (boiling point 270-310°C) were mixed under a nitrogen stream, heated and stirred at 200°C for 60 minutes, and then a condensate of dimer acid and diethylenetriamine (molar ratio 1:1) was mixed. Three parts of a polyamide compound (molecular weight: 5000) was added and reacted for 30 minutes. To 85 parts of the varnish thus obtained, 15 parts of "Seika First" Yellow 2340 (yellow pigment for ink manufactured by Dainichiseika Co., Ltd.) was added, and the mixture was kneaded with three rolls in a conventional manner. I got it. Example 2 42 parts of cyclopentadiene petroleum resin (weight average molecular weight 22,000), 16 parts of "Pure Marine Linseed Oil" No. 4, 5
After mixing 40 parts of No. No. Solvent under a nitrogen flow and heating to dissolve, 2 parts of diethylenetriamine was added while heating and stirring at 180°C, and the mixture was heated and stirred for 30 minutes. The ink varnish thus obtained was converted into an ink in the same manner as in Example 1 to obtain ink B. Example 3 In the composition of Example 1, a condensate of linoleic acid and hexamethylene diamine (molecular weight:
3000) to form a varnish and an ink in the same manner to obtain Ink C. Comparative Example 1 In Example 1, 40 parts of rosin-modified phenolic resin and no polyamide compound were used,
Ink D was obtained in the same manner as varnish and ink. Comparative Example 2 Ink E was obtained in the same manner as in Example 2 except that the petroleum resin was changed to 44 parts and diethylenetriamine was not used. Inks A to E obtained in the above Examples and Comparative Examples were evaluated for ink characteristics and printing characteristics using respective methods, and the results are shown in Table 1. (Ink characteristics and evaluation method) A waterless lithographic plate with a non-adhesive layer made of silicone rubber was attached to a printing machine that had been improved so that the temperature of the plate surface could be raised by passing hot water through the plate cylinder, and the printing machine was used to print a printing machine without supplying dampening water. , print while increasing the temperature of the printing plate,
The surface temperature at which background smear occurred on the printed matter at a constant solid density was defined as the background smear occurrence temperature. The higher the temperature at which background smear occurs, the more likely it is that smudge will occur in practical printing. Next, the fluidity (flow value) of these inks was measured using a spread meter at 30°C, and the tack value was measured using an inkometer. In addition, each ink was printed using a waterless lithographic plate, and the solid density of the printed matter was measured using a Macbeth reflection densitometer.
The gloss value at 0.95 was measured with a 60 degree specular reflection gloss meter. From this result, inks A and C based on the present invention were compared to blank ink D, and ink B
It can be seen that ink ink is superior to blank ink E in that it has a higher scumming temperature and a lower tack value. In practical printing tests, inks A and C were compared with ink D, and ink B was compared with ink E, and inks A, B, and C did not cause any stains on the paper surface, and did not cause any problems such as piling or peeling. Print

【表】 ラブルが抑制されたものとなつていた。また印刷
物の光沢を測定したところ、インキA、B、C、
は耐地汚れ性が高いにもかかわらず、ブランクイ
ンキと同等で光沢のある印刷物が得られた。 (発明の効果) 本発明による分子鎖伸長樹脂をバインダー樹脂
成分として含有する水なし平版用インキ組成物
は、耐地汚れ性が良好で、かつ印刷適性の優れた
ものとなる。
[Table] Rubble was suppressed. Also, when we measured the gloss of printed matter, we found that ink A, B, C,
Even though the ink had high stain resistance, it produced glossy printed matter equivalent to that of blank ink. (Effects of the Invention) A waterless lithographic ink composition containing the molecular chain extension resin according to the present invention as a binder resin component has good background stain resistance and excellent printability.

Claims (1)

【特許請求の範囲】[Claims] 1 沸点200℃以上の炭化水素溶媒と、乾性油な
いし半乾性油との混合物中で加熱撹拌溶解下に、
フエノール樹脂、ロジン変性フエノール樹脂、エ
ポキシ樹脂およびキシレン樹脂の群から選ばれる
少なくとも1種を活性水素を含有するアミン化合
物で分子鎖伸長せしめて得られた変性樹脂を含有
することを特徴とする水なし平版用インキ組成
物。
1. Dissolved with heating and stirring in a mixture of a hydrocarbon solvent with a boiling point of 200°C or higher and a drying oil or a semi-drying oil,
A water-free product characterized by containing a modified resin obtained by elongating the molecular chain of at least one member selected from the group of phenolic resin, rosin-modified phenolic resin, epoxy resin, and xylene resin with an amine compound containing active hydrogen. Lithographic ink composition.
JP61267950A 1986-11-11 1986-11-11 Ink composition for dry lithographic plate use Granted JPS63120779A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61267950A JPS63120779A (en) 1986-11-11 1986-11-11 Ink composition for dry lithographic plate use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61267950A JPS63120779A (en) 1986-11-11 1986-11-11 Ink composition for dry lithographic plate use

Publications (2)

Publication Number Publication Date
JPS63120779A JPS63120779A (en) 1988-05-25
JPH04507B2 true JPH04507B2 (en) 1992-01-07

Family

ID=17451850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61267950A Granted JPS63120779A (en) 1986-11-11 1986-11-11 Ink composition for dry lithographic plate use

Country Status (1)

Country Link
JP (1) JPS63120779A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2230691A2 (en) 2009-03-19 2010-09-22 Sony Corporation Semiconductor device and method of manufacturing the same, and electronic apparatus
EP2317558A2 (en) 2009-10-29 2011-05-04 Sony Corporation Semiconductor device, manufacturing method thereof, and electronic apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2223771A4 (en) * 2007-11-27 2012-09-26 Harima Chemicals Inc Flux for soldering and soldering paste composition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014561A (en) * 1973-05-03 1975-02-15
JPS575273A (en) * 1980-06-13 1982-01-12 Meidensha Electric Mfg Co Ltd Metal-halogen battery
JPS5837069A (en) * 1981-08-28 1983-03-04 Ricoh Co Ltd Litho printing ink which does not require dampening water
JPS59196374A (en) * 1983-04-21 1984-11-07 Toray Ind Inc Dry lithographic ink composition
JPS6059269A (en) * 1983-06-17 1985-04-05 ブイジユ Concrete structural member and its production method and apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014561A (en) * 1973-05-03 1975-02-15
JPS575273A (en) * 1980-06-13 1982-01-12 Meidensha Electric Mfg Co Ltd Metal-halogen battery
JPS5837069A (en) * 1981-08-28 1983-03-04 Ricoh Co Ltd Litho printing ink which does not require dampening water
JPS59196374A (en) * 1983-04-21 1984-11-07 Toray Ind Inc Dry lithographic ink composition
JPS6059269A (en) * 1983-06-17 1985-04-05 ブイジユ Concrete structural member and its production method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2230691A2 (en) 2009-03-19 2010-09-22 Sony Corporation Semiconductor device and method of manufacturing the same, and electronic apparatus
EP2317558A2 (en) 2009-10-29 2011-05-04 Sony Corporation Semiconductor device, manufacturing method thereof, and electronic apparatus

Also Published As

Publication number Publication date
JPS63120779A (en) 1988-05-25

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