JPH0448634U - - Google Patents
Info
- Publication number
- JPH0448634U JPH0448634U JP9044690U JP9044690U JPH0448634U JP H0448634 U JPH0448634 U JP H0448634U JP 9044690 U JP9044690 U JP 9044690U JP 9044690 U JP9044690 U JP 9044690U JP H0448634 U JPH0448634 U JP H0448634U
- Authority
- JP
- Japan
- Prior art keywords
- notch
- mounting surface
- fixing
- type semiconductor
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 4
Description
第１図は本考案の一実施例を示す構成斜視図、
第２図はボデイを連結した状態を説明する構成斜
視図、第３図は本考案の変形実施例の説明図であ
る。
１０，１２……取付け面、１４……連結面、１
６……固定部、２０……クリツプ、３０……連結
具。
FIG. 1 is a perspective view showing an embodiment of the present invention;
FIG. 2 is a perspective view of the structure in which the bodies are connected, and FIG. 3 is an explanatory view of a modified embodiment of the present invention. 10, 12...Mounting surface, 14...Connection surface, 1
6... Fixed part, 20... Clip, 30... Connector.
Claims (1)
け面１０、この第１取付け面と所定間隔で対向す
るＴＯ−３Ｐ固定用の切込みを有する第２取付け
面１２、第１及び第２取付け面の両側端面に設け
られると共に上端部及び下端部に切欠を有する連
結面１４、この連結面の下端部切欠に着脱自在に
取付けられるプリント基板接続用の固定部１６を
有するボデイと、 この第１取付け面に圧接するＴＯ−２２０型半
導体、若しくはこの第２取付け面に圧接するＴＯ
−３Ｐ型半導体を、当該取付け面の切込みに一端
が係合して当該半導体を当該ボデイに取付けるク
リツプ２０と、 前記連結面の上端部切欠に取付けられて、複数
のボデイを連結面を用いて連結する連結具３０と
、 を有することを特徴とするヒートシンク。[Claims for Utility Model Registration] A first mounting surface 10 having a notch for fixing TO-220, a second mounting surface 12 having a notch for fixing TO-3P facing this first mounting surface at a predetermined interval, and a first mounting surface 10 having a notch for fixing TO-3P. A body having a connecting surface 14 provided on both end surfaces of the first and second mounting surfaces and having notches at the upper and lower ends, and a fixing part 16 for connecting a printed circuit board that is detachably attached to the lower end notch of the connecting surface. and a TO-220 type semiconductor that is press-contacted to this first mounting surface, or a TO-220 type semiconductor that is press-contacted to this second mounting surface.
- a clip 20 for attaching a 3P type semiconductor to the body by engaging a notch in the attachment surface at one end, and a clip 20 for attaching the semiconductor to the body by engaging the notch in the attachment surface; A heat sink characterized in that it has a connector 30 for connecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9044690U JPH0448634U (en) | 1990-08-29 | 1990-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9044690U JPH0448634U (en) | 1990-08-29 | 1990-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448634U true JPH0448634U (en) | 1992-04-24 |
Family
ID=31825209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9044690U Pending JPH0448634U (en) | 1990-08-29 | 1990-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448634U (en) |
-
1990
- 1990-08-29 JP JP9044690U patent/JPH0448634U/ja active Pending
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