JPH0448328B2 - - Google Patents
Info
- Publication number
- JPH0448328B2 JPH0448328B2 JP63032285A JP3228588A JPH0448328B2 JP H0448328 B2 JPH0448328 B2 JP H0448328B2 JP 63032285 A JP63032285 A JP 63032285A JP 3228588 A JP3228588 A JP 3228588A JP H0448328 B2 JPH0448328 B2 JP H0448328B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- prepreg
- resin
- metal plate
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011521 glass Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
本発明は、金属板を基板として用いた多層の電
気積層板に関するものである。
The present invention relates to a multilayer electrical laminate using a metal plate as a substrate.
金属板を基板とする電気積層板においては、ス
ルーホールを形成するために孔明きの金属板が基
板として用いられる。すなわち、金属板にスルー
ホールを形成すべき箇所においてスルーホールの
径よりも大きな通孔を設けておき、この複数枚の
金属板をプリプレグを介して重ねて加熱加圧成形
をおこなうことによつて、プリプレグに含浸した
樹脂を硬化させて各金属板を積層接着すると共に
プリプレグに含浸した樹脂を金属板の各通孔に流
入充填させて硬化させる。そしてこの通孔に充填
させた樹脂の部分においてスルーホールを穿孔加
工することによつて、樹脂で金属板との間の絶縁
性が確保されたスルーホールを形成することがで
きるのである。
そしてプリプレグは一般的に、ガラスクロス
（ガラス織布）を基材として用い、これにエポキ
シ樹脂などを含浸させて加熱乾燥することによつ
て作成されている。
In an electrical laminate using a metal plate as a substrate, a perforated metal plate is used as the substrate to form through holes. In other words, a through hole larger than the diameter of the through hole is provided at the location where the through hole is to be formed in the metal plate, and by stacking these multiple metal plates with prepreg interposed therebetween and performing heat and pressure forming. Then, the resin impregnated in the prepreg is cured to bond the respective metal plates in a laminated manner, and the resin impregnated in the prepreg is flowed and filled into each through hole of the metal plate and cured. By drilling a through hole in the portion of the resin filled in the through hole, it is possible to form a through hole in which insulation between the resin and the metal plate is ensured. Prepreg is generally created by using glass cloth (glass woven fabric) as a base material, impregnating it with epoxy resin, etc., and then heating and drying the impregnated material.
しかし、ガラスクロスはガラス繊維を織つたも
のであるために組織が密であり、含浸される樹脂
を十分な量で保有することができず、このために
ガラスクロスを基材とするプリプレグはレジンコ
ンテントが低い。従つてこのプリプレグを用いて
金属板を積層する際に、プリプレグに含浸される
樹脂で金属板の通孔を十分に充填させることがで
きず、通孔内にボイドが発生するおそれがある。
そしてこのように充填不良でボイドが通孔内に発
生すると通孔に充填した樹脂の部分において加工
したスルーホールと金属板とがボイドを介して連
通し、スルーホールと金属板との間の絶縁性を確
保することができなくなる。
本発明は上記の点に鑑みて為されたものであ
り、充填不良になるおそれなく通孔内を樹脂で充
填することができ、スルーホールと金属板との間
の絶縁性を確保することができる電気積層板の製
造方法を提供することを目的とするものである。
However, since glass cloth is woven from glass fibers, it has a dense structure and cannot hold a sufficient amount of resin to be impregnated with it. Content is low. Therefore, when metal plates are laminated using this prepreg, the resin impregnated into the prepreg cannot sufficiently fill the through holes of the metal plates, and there is a risk that voids may occur in the through holes.
If a void occurs in the through hole due to incomplete filling, the through hole processed in the resin filled in the through hole and the metal plate will communicate via the void, and the insulation between the through hole and the metal plate will be interrupted. It becomes impossible to secure sex. The present invention has been made in view of the above points, and it is possible to fill the inside of the through hole with resin without fear of filling defects, and to ensure insulation between the through hole and the metal plate. The object of the present invention is to provide a method for manufacturing an electrical laminate that can be manufactured using the following methods.
上記の課題を解決するために本発明は、通孔１
を設けた複数枚の金属板２をプリプレグ３を介し
て重ね、加熱加圧成形したプリプレグ３に含浸し
た樹脂を硬化させて各金属板２を積層接着すると
共にプリプレグ３に含浸した樹脂を金属板２の各
通孔１に流入充填させて硬化させ、通孔１内の樹
脂４の部分においてスルーホール５を穿孔加工す
るにあたつて、プリプレグ３としてガラスペーパ
ーを基材として調製したものを用いるようにした
ことを特徴とするものである。
以下本発明を詳細に説明する。ガラスペーパー
（ガラス不織布）はガラス繊維を抄くなどするこ
とによつて形成されるために組織が疎であり、含
浸される樹脂を浸透させて十分な量で保有するこ
とができ、このためにガラスペーパーを基材とす
るプリプレグ３はレジンコンテントが高い。ガラ
スペーパーとガラスクロスとを比較した場合、同
じ厚みのプリプレグでは、ガラスクロスを基材と
するプリプレグではレジンコンテントが50〜60％
程度でも、ガラスペーパーを基材とするプリプレ
グではレジンコンテントを90％以上にすることが
できるのである。
しかしてこのようにガラスペーパーを基材とし
て調製したプリプレグ３を用いて、金属板２を基
板とする電気積層板を製造するにあたつては、第
１図ａ乃至ｅの手順でおこなうことができる。ま
ず、厚みｔが0.3〜0.8mm程度の銅板など金属板２
を用い、この金属板２にスルーホール５を形成す
る部分においてパンチ加工やドリル加工などで通
孔１を形成する。通孔１はスルーホール５の直径
よりも大きな直径、例えば1.0〜2.0mm程度の直径
φで形成されるものであり、第２図のようにピツ
チｐは一般的に1.5〜2.5mm程度に設定される。こ
のように通孔１を形成することによつて通孔１の
容積の合計は85〜400cm3／m2程度になる。そして
第１図ｃのようにプリプレグ３を介して金属板２
を５枚〜８枚重ね、さらに上下にプリプレグ３を
介して銅箔など金属箔９を重ねる。これを加熱加
圧成形することによつて、プリプレグ３に含浸し
た樹脂を硬化させて各金属板２を積層接着させる
と共に、プリプレグ３に含浸した樹脂の一部を金
属板２の各通孔１内に流入させて第１図ｄのよう
にこの樹脂４を通孔１内に充填させる。ここで、
プリプレグ３はガラスペーパーを基材として調製
されているためにレジンコンテントが高く、プリ
プレグ３に含浸されている樹脂４を十分に通孔１
内に流入させて、充填不良なく通孔１内に樹脂４
を充填させることができる。このようにして金属
板２の通孔１に樹脂４を充填させた状態で各金属
板２を積層すると共に上下にそれぞれ金属箔９を
積層したのちに、ドリル加工やパンチ加工などで
スルーホール５を穿孔加工する。スルーホール５
は第１図ｅに示すように、通孔１に充填した樹脂
４の部分において通孔１の直径よりも小さい直
径、例えば0.7〜0.9mm程度に形成されるものであ
り、従つてスルーホール５の内周と金属板２との
間の電気絶縁性は樹脂４によつて確保されること
になる。尚、スルーホール５のうち一部のものは
アースなどのために金属板２を貫通して形成され
ている。上記のようにスルーホール５を加工した
のちに、スルーホール５の内周にスルーホールメ
ツキを形成したり、金属箔９をエツチング処理し
て回路を形成したりして、金属板２を基板とした
電気積層板に仕上げるのである。このようにして
得られる電気積層板において、スルーホール５の
内周に形成されるスルーホールメツキと金属板２
との電気絶縁性は通孔１内に充填した樹脂４によ
つて確保されるものであり、また通孔１内に充填
不良なく樹脂４が充填されているために、ボイド
などによつてスルーホールメツキと金属板２とが
シヨートしたりするようなおそれはない。
In order to solve the above problems, the present invention provides through holes 1
A plurality of metal plates 2 provided with the above are stacked with prepregs 3 interposed therebetween, and the resin impregnated into the prepreg 3 formed by heating and pressure is cured to bond the metal plates 2 together in a laminated manner. The prepreg 3 prepared using glass paper as a base material is used to fill each through hole 1 of 2 and harden it, and to punch a through hole 5 in the resin 4 part of the through hole 1. It is characterized by the following. The present invention will be explained in detail below. Glass paper (glass non-woven fabric) is formed by cutting glass fibers, so it has a loose structure and can penetrate the impregnated resin and retain a sufficient amount. Prepreg 3 based on glass paper has a high resin content. When comparing glass paper and glass cloth, with the same thickness of prepreg, the resin content is 50 to 60% in prepreg with glass cloth as the base material.
Even if the resin content is 90% or more, prepreg based on glass paper can have a resin content of over 90%. However, when manufacturing an electrical laminate using the metal plate 2 as the substrate using the prepreg 3 prepared using glass paper as the base material, the steps shown in Fig. 1 a to e can be followed. can. First, a metal plate 2 such as a copper plate with a thickness t of about 0.3 to 0.8 mm.
The through hole 1 is formed in the metal plate 2 by punching, drilling, etc. in the portion where the through hole 5 is to be formed. The through hole 1 is formed with a diameter φ larger than the diameter of the through hole 5, for example, about 1.0 to 2.0 mm, and the pitch p is generally set to about 1.5 to 2.5 mm, as shown in Fig. 2. be done. By forming the through holes 1 in this manner, the total volume of the through holes 1 is approximately 85 to 400 cm 3 /m 2 . Then, as shown in Fig. 1c, the metal plate 2 is inserted through the prepreg 3.
5 to 8 sheets are stacked, and metal foils 9 such as copper foils are further stacked on top and bottom with prepregs 3 interposed therebetween. By heating and press-molding this, the resin impregnated into the prepreg 3 is cured and each metal plate 2 is laminated and bonded, and a part of the resin impregnated into the prepreg 3 is applied to each through hole of the metal plate 2. The resin 4 is caused to flow into the through hole 1 as shown in FIG. 1d. here,
Since the prepreg 3 is prepared using glass paper as a base material, the resin content is high, and the resin 4 impregnated in the prepreg 3 can be sufficiently penetrated through the holes 1.
The resin 4 flows into the through hole 1 without filling defects.
can be filled with. In this way, each metal plate 2 is laminated with the resin 4 filled in the through hole 1 of the metal plate 2, and metal foils 9 are laminated on the upper and lower sides, and then the through hole 5 is formed by drilling or punching. perforate. Through hole 5
As shown in FIG. 1e, the through hole 5 is formed to have a smaller diameter than the diameter of the through hole 1, for example, about 0.7 to 0.9 mm, in the portion of the resin 4 filled in the through hole 1. Electrical insulation between the inner periphery of the metal plate 2 and the metal plate 2 is ensured by the resin 4. Note that some of the through holes 5 are formed to penetrate the metal plate 2 for grounding purposes. After processing the through-holes 5 as described above, through-hole plating is formed on the inner periphery of the through-holes 5, and a circuit is formed by etching the metal foil 9, thereby converting the metal plate 2 into a substrate. The final step is to create an electrical laminate. In the electrical laminate thus obtained, the through-hole plating formed on the inner periphery of the through-hole 5 and the metal plate 2
Electrical insulation with the resin 4 is ensured by the resin 4 filled in the through hole 1, and since the resin 4 is filled in the through hole 1 without any filling defects, there is no through-hole due to voids etc. There is no fear that the hole plating and the metal plate 2 will be shot.
以下本発明を実施例によつて具体的に説明す
る。
実施例
ガラスペーパーとして日本バイリーン製
EP4075（かさ密度75ｇ／m2）を用い、これをビス
フエノールＡ型エポキシ樹脂85重量部、フエノー
ルボラツク型エポキシ樹脂15重量部、ジシアンジ
アミド１当量、ベンジルジメチルジアミン１当
量、MEK20重量部の配合のエポキシ樹脂（FR−
４）に浸漬し、次いで乾燥することによつて、厚
み0.2mmのプリプレグを作成した。ここで乾燥の
条件はプリプレグ中の樹脂の熔融粘度が500ポイ
ズになるように設定した。このプリプレグのレジ
ンコンテントは91〜92重量％であつた。
次ぎに、厚みが0.5mmで直径が1.5mmの通孔を多
数設けた銅板をプリプレグを介して６枚重ねると
共に上下にプリプレグを介して銅箔を重ね、20
Kg／cm2の加圧条件で140℃で20分間、170℃で90分
間加熱して積層成形をおこなつた。こののちに金
属板の通孔の部分において直径が0.8mmのスルー
ホールをドリル加工し、スルーホールの内周にス
ルーホールメツキを施した。このものにあつて、
スルーホールの内周にはボイドが全くなくスルー
ホールメツキと金属板との間の絶縁不良は発生し
なつた。
比較例
ガラスペーパーの代わりにガラスクロス（旭ヘ
ーベル株式会社製7628タイプ；打ち込み本数縦42
本、横34本、かさ密度205ｇ／m2）を用い、実施
例の場合と同様にしてこれにエポキシ樹脂を含浸
させて乾燥することによつて、厚みが2.0mmのプ
リプレグを調製した。このプリプレグのレジンコ
ンテントは40〜45重量％であつた。そしてこのプ
リプレグを用いてあとは実施例と同様にして積層
成形をおこなうと共にスルーホールを加工し、さ
らにスルーホールメツキを施した。このものにあ
つて、スルーホールの内周にボイドが発生し、ス
ルーホールメツキと金属板との間に絶縁不良が発
生した。
The present invention will be specifically explained below using examples. Example: Made by Nippon Vilene as glass paper
Using EP4075 (bulk density 75 g/m 2 ), it was mixed with 85 parts by weight of bisphenol A epoxy resin, 15 parts by weight of phenol volak epoxy resin, 1 equivalent of dicyandiamide, 1 equivalent of benzyldimethyldiamine, and 20 parts by weight of MEK. Epoxy resin (FR-
A prepreg with a thickness of 0.2 mm was prepared by dipping in 4) and then drying. Here, the drying conditions were set so that the melt viscosity of the resin in the prepreg was 500 poise. The resin content of this prepreg was 91-92% by weight. Next, six copper plates with a thickness of 0.5 mm and a number of holes of 1.5 mm in diameter were stacked with prepreg in between, and copper foil was stacked on top and bottom with prepreg in between.
Laminate molding was carried out by heating at 140°C for 20 minutes and at 170°C for 90 minutes under pressure conditions of Kg/cm 2 . After this, a through hole with a diameter of 0.8 mm was drilled in the through hole part of the metal plate, and the inner periphery of the through hole was plated. Regarding this thing,
There were no voids at all on the inner periphery of the through hole, and no insulation failure occurred between the through hole plating and the metal plate. Comparative example Glass cloth instead of glass paper (7628 type manufactured by Asahi Hebel Co., Ltd.; number of strands vertically 42)
A prepreg with a thickness of 2.0 mm was prepared by impregnating it with epoxy resin and drying it in the same manner as in the example. The resin content of this prepreg was 40-45% by weight. Then, using this prepreg, lamination molding was carried out in the same manner as in the example, and through-holes were processed and through-hole plating was performed. In this case, voids were generated on the inner periphery of the through hole, and poor insulation occurred between the through hole plating and the metal plate.
上述のように本発明にあつては、プリプレグと
してガラスペーパーを基材として調製したものを
用いるようにしたので、ガラスペーパーは樹脂の
含浸性が良くガラスペーパーを基材として調製し
たプリプレグはレジンコンテントを高く形成する
ことができるものであり、プリプレグに多量に含
有させた樹脂を金属板の通孔に充填不良なく十分
に充填させることができ、通孔において加工した
スルーホールと金属板との間の絶縁性がボイドな
どの発生で低下するようなおそれがないものであ
る。
As mentioned above, in the present invention, prepreg prepared using glass paper as a base material is used, so glass paper has good resin impregnation properties, and prepreg prepared using glass paper as a base material has a resin content. It is possible to form a large amount of resin in the prepreg into the through hole of the metal plate without any filling defects, and the gap between the through hole processed in the through hole and the metal plate can be sufficiently filled. There is no risk that the insulation properties of the material will deteriorate due to the occurrence of voids, etc.
第１図ａ乃至ｅは電気積層板の製造の各工程を
示す断面図、第２図は同上に用いる金属板の拡大
断面図である。
１は通孔、２は金属板、３はプリプレグ、４は
通孔内の樹脂である。
FIGS. 1a to 1e are cross-sectional views showing each step of manufacturing the electrical laminate, and FIG. 2 is an enlarged cross-sectional view of a metal plate used in the same. 1 is a through hole, 2 is a metal plate, 3 is a prepreg, and 4 is a resin inside the through hole.
Claims (1)
介して重ね、加熱加圧成形してプリプレグに含浸
した樹脂を硬化させて各金属板を積層接着すると
共にプリプレグに含浸した樹脂を金属板の各通孔
に流入充填させて硬化させ、通孔内の樹脂の部分
においてスルーホールを穿孔加工するにあたつ
て、プリプレグとしてガラスペーパーを基材とし
て調製したものを用いることを特徴とする電気積
層板の製造方法。1 Layer multiple metal plates with through holes through prepreg, heat and pressure mold them to harden the resin impregnated in the prepreg, and bond each metal plate in a laminated manner. Electrical lamination characterized in that a prepreg prepared using glass paper as a base material is used as a prepreg when the resin is injected into each through hole and cured, and when a through hole is punched in the resin part in the through hole. Method of manufacturing the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63032285A JPH01208109A (en) | 1988-02-15 | 1988-02-15 | Manufacture of electric laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63032285A JPH01208109A (en) | 1988-02-15 | 1988-02-15 | Manufacture of electric laminated sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01208109A JPH01208109A (en) | 1989-08-22 |
| JPH0448328B2 true JPH0448328B2 (en) | 1992-08-06 |
Family
ID=12354691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63032285A Granted JPH01208109A (en) | 1988-02-15 | 1988-02-15 | Manufacture of electric laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01208109A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4851377B2 (en) * | 2007-03-23 | 2012-01-11 | 古河電気工業株式会社 | Printed wiring board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601892A (en) * | 1983-06-18 | 1985-01-08 | 三菱電機株式会社 | Method of producing metal core printed circuit board |
| JPS60236293A (en) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | Metal base circuit board |
-
1988
- 1988-02-15 JP JP63032285A patent/JPH01208109A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601892A (en) * | 1983-06-18 | 1985-01-08 | 三菱電機株式会社 | Method of producing metal core printed circuit board |
| JPS60236293A (en) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | Metal base circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01208109A (en) | 1989-08-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |