JPH0447967Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a hybrid circuit formed by connecting a circuit, such as a delay line, whose components mainly include a coil and a capacitor to the outside of an integrated circuit.

[Prior art and its problems]

Recently, most electronic circuits have tended to be integrated circuits, but there are some circuits that include inductance, such as delay line circuits made up of a combination of coils and capacitors, which are difficult to integrate.
If such a circuit is included in the overall circuit, it will be necessary to connect it to the outside of the integrated circuit. This also applies to the case where a saturated logic circuit using TTL elements is combined with a delay line to form a puffed delay line.

Then, a delay line circuit is constructed by arranging coils and capacitors on a printed circuit board, the board is placed on an integrated circuit package, and the delay line circuit and the integrated circuit are connected through the terminals of the package. Connect external terminals to dual inline package (hereinafter referred to as DIP)
The hybrid circuit exposed to the outside of the
This method is already known from Japanese Utility Model Application No. 89953 and Japanese Utility Model Application Publication No. 59-67947.

However, in such hybrid circuits, many small circuit elements are attached and connected at predetermined positions on a narrow board that is placed on the integrated circuit package, and it is not automatic to configure another circuit outside the integrated circuit. Since it is difficult to use machines sufficiently, there is a lot of manual labor and assembly man-hours are required. Moreover, using a substrate to fix the mutual positions of circuit elements increases the number of components of the hybrid circuit, which is wasteful.

〔the purpose〕

The purpose of this invention is to use a plate-shaped capacitor block as a board for configuring another circuit in addition to the integrated circuit, and to eliminate the need to attach the capacitor to the board, thereby simplifying the assembly work of hybrid circuits. It's about making it easier.

[Technical means to solve problems]

The hybrid circuit of the present invention has a plurality of independent capacitors formed inside, and a plate-shaped capacitor block with the electrode end of each capacitor exposed on the side and an integrated circuit package are stacked on top of each other. A circuit element is fixed to the main surface of the capacitor, and the circuit element, the capacitor, and the integrated circuit are interconnected using terminals of the integrated circuit.

〔Example〕

Taking as an example the circuit diagram of the packed delay line shown in FIG. 5, whose configuration is simplified for ease of understanding, the embodiments of the hybrid circuit of the present invention will be described with reference to FIGS. 1 to 4. I will explain while doing so. Figure 1 is a perspective view of the hybrid circuit, Figure 2 is a longitudinal front view of Figure 1, Figure 3 is an enlarged cross-sectional view of the capacitor block, and Figure 4 shows the delay line circuit and integrated circuit. An explanatory diagram of the connections is shown respectively. Note that FIG. 1 shows the state without external terminals.

In Fig. 5, G1 to G4 are TTL elements,
1 is an input terminal, 2 and 3 are output terminals, V _C is a power supply terminal, and E is an earth terminal. The part surrounded by the dotted line constitutes a delay line, and is connected from element G1 to element G4.
are configured within an integrated circuit.

The capacitor block 10 is formed by stacking dielectric sheets, such as ceramic green sheets, on which electrodes 12 are formed, and two capacitors C1 and C2 shown in FIG. 5 are formed inside. As shown in FIG.
2A and 12B are present, and their ends are exposed in the grooves on the sides to form electrode terminals. In the embodiment, since both sides of the capacitors C1 and C2 are grounded, the ends of the electrodes 12B on the ground side are commonly exposed in the groove 13E to form the electrode terminals 14E, and the ends of the two sets of electrodes 12A on the hot side are exposed in common to the groove 13E. groove 13A and groove 13B
Electrode terminals 14A and 14B are formed by exposing them separately. Figure 3 shows grooves 13 on opposite sides.
A is a cross-sectional view between grooves 13C. Capacitor C
1, another groove in which no electrode terminal of C2 is formed;
In other words, terminals 15 are also formed from groove 13C to groove 13J, excluding groove 13E, and unlike electrode terminals that are directly connected to the electrodes of the capacitor, the conductor pattern 1 formed on the main surface 16 of the capacitor block 10
7 and the terminals of the flat package 11 of the integrated circuit.

The conductor pattern 17 is connected to each electrode terminal 1 of the grooves 13A, 13B, and 13E as shown in FIGS.
4A, 14B, 14E and groove 13C
Connect to the terminal 15 from the groove 13J to the groove 13J. Groove 13
G and the terminal 15 of the groove 13J are connected by a conductor pattern 17 on the main surface 16 on the back side. and the fifth
Circuit elements corresponding to the coils L1, L2 and terminating resistors R1, R2 in the figure are fixed to the main surface 16 while being connected to the conductor pattern 17, and the delay line circuit shown surrounded by dotted lines in FIG. It is formed on the capacitor block 10.

Capacitor block 10 configured in this way
and the integrated circuit flat package 11 in which TTL elements G1 to G4 are formed are stacked together as shown in FIG. Then, the terminals protruding horizontally from the sides of the package 11 are bent vertically to form a capacitor block 1 with the same alphabetic characters.
Fit it into the groove of 0 and solder it to the electrode terminal or terminal. For example, the terminal 18A is fitted into the groove 13A, the terminal 18B is fitted into the groove 13B, the terminal 18C is fitted into the groove 13C, and the electrode terminal 14A, electrode terminal 14B,
Connect to terminal 15. In Figure 4, package 11
The grooves into which the terminals fit are shown by arrows. The terminals 18X and 18Y of the package 11 are connected to the external terminals 19X and 19Y, respectively, under the capacitor block 10 without being fitted into the grooves. The terminal 18D, the terminal 18E, and the terminal 18G, which is a power supply terminal for the integrated circuit, are also connected to the external terminal 19.
D, connected to external terminal 19E and external terminal 19G. The external terminals are indicated by circles in Figure 4,
As shown in Figure 1, it has an L-shaped horizontal part whose tip is bent downward, and the vertical part of the terminal of the package cage 11 is fitted into the groove 20 provided at the tip and connected by soldering. . Figure 2 shows the state in which the external terminals are connected to the terminals of the package 11, but in the end, the whole is sealed with resin to form a DIP, as shown by the dashed line, and only the external terminals are connected to the terminals. A structure that is exposed to the outside is desirable.

When the hybrid circuit configured in this way corresponds to Fig. 5, the external terminal 19D is the input terminal 1, the external terminal 19E is the ground terminal E, the external terminal 19G is the power supply terminal V _c , and the external terminals 19X and 19Y are the output terminals. They serve as terminal 2 and output terminal 3, respectively. The coils L1 and L2 used in the embodiment are so-called chip-type coils in which wires are wound around a drum-shaped core, and electrodes for direct surface connection to the conductor pattern 17 are provided on flanges at both ends. Furthermore, the terminating resistors R1 and R2 are also formed for surface connection. Various types of these small circuit elements are known, but there is no need to limit the shape in particular. Further, in the embodiment, the external terminal for connecting the hybrid circuit to an external circuit is connected to the terminal of the integrated circuit, but if necessary, the external terminal can be connected to the side of the capacitor block. Connections between integrated circuit terminals and external terminals may also be made using other known techniques for connecting two metal terminals. As described above, the method of connecting the external terminals for leading out the hybrid circuit to the outside involves many modifications within the scope of the present invention. Furthermore, the package of the integrated circuit may be other than a flat package.

It is clear that other circuits such as LC filters can be constructed in the capacitor block based on the same technical idea as in the embodiments, and various hybrid circuits can be constructed by combining with the integrated circuit.

〔effect〕

As described above, the hybrid circuit of the present invention consists of a circuit connected to an integrated circuit using a circuit element fixed to the main surface of a capacitor block and an internal capacitor, which is superimposed on the integrated circuit package, and the circuit element is superimposed on the integrated circuit package. There is no need for a board to fix the position, and there is no need to attach the capacitor to the board. Therefore, it is possible to save assembly man-hours when connecting circuits outside the integrated circuit, and by not using a substrate, it is possible to easily obtain a hybrid circuit that is cheaper than the conventional one.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the hybrid circuit of the present invention, FIG. 2 is a front view from the longitudinal direction of FIG. 1, FIG. 3 is an enlarged cross-sectional view of a capacitor block, and FIG.
The figure is an explanatory diagram of connections in the embodiment, and FIG. 5 is a circuit diagram of the embodiment. 1...Input terminal, 2, 3...Output terminal, V _C ...
...Power terminal, E...Earth terminal, 10...Capacitor block, 11...Flat package, 1
2A, 12B... Electrode, 13A, 13B, 13C
... Groove, 14A, 14B, 14E ... Electrode terminal,
15...Terminal, 16...Main surface, 17...Conductor pattern, 18A, 18B, 18C...Terminal, 19
D, 19E, 19G, 19X, 19Y...external terminal, 20...groove.

Claims (1)

[Scope of utility model registration request] A plate-shaped capacitor block, in which multiple independent capacitors are formed inside, and the ends of the electrodes of each capacitor are exposed on the sides, is stacked on an integrated circuit package, and the circuit elements are placed on the main surface of the capacitor block. The circuit element, the capacitor, and the integrated circuit are connected to each other using the terminals of the integrated circuit fixed to the sides of the capacitor block, and the external terminals connected to the terminals of the integrated circuit are connected to each other. A hybrid circuit characterized by being exposed outside the resin-sealed part of the circuit.