JPH044760U - - Google Patents

Info

Publication number
JPH044760U
JPH044760U JP4415190U JP4415190U JPH044760U JP H044760 U JPH044760 U JP H044760U JP 4415190 U JP4415190 U JP 4415190U JP 4415190 U JP4415190 U JP 4415190U JP H044760 U JPH044760 U JP H044760U
Authority
JP
Japan
Prior art keywords
semiconductor device
terminals
package
terminal
row
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4415190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4415190U priority Critical patent/JPH044760U/ja
Publication of JPH044760U publication Critical patent/JPH044760U/ja
Pending legal-status Critical Current

Links

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案実施例の構成斜視図、第2図、
第3図は短絡バーの接続状態を表した第1図の正
面図、およびその内部結線図、第4図は本考案の
実施対象となる半導体装置の従来構成の斜視図、
第5図は第4図の内部結線図である。図において
、 1……パツケージケース、2……端子フレーム
、4……外部接続用端子、5,5a,5b……バ
リア、6……短絡バー。
Fig. 1 is a perspective view of the configuration of the embodiment of the present invention; Fig. 2;
3 is a front view of FIG. 1 showing the connection state of the shorting bar, and its internal wiring diagram; FIG. 4 is a perspective view of the conventional configuration of a semiconductor device to which the present invention is applied;
FIG. 5 is an internal wiring diagram of FIG. 4. In the figure, 1...Package case, 2...Terminal frame, 4...External connection terminal, 5, 5a, 5b...Barrier, 6...Short-circuit bar.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一つのパツケージ内に複数組の半導体デバイス
を組み込み、かつ各半導体デバイスより引出した
外部接続用の端子を同一平面に並べてパツケージ
上面に配置するとともに、各端子の間を隔離して
パツケージ上面にバリアを形成した電力用半導体
装置において、各半導体デバイスの端子を種類別
に分けた上で同種の端子同士を一列に配列すると
ともに、各端子を同種の端子列内に並ぶバリアよ
りも高い位置に設置したことを特徴とする電力用
半導体装置。
Multiple sets of semiconductor devices are built into one package, and the external connection terminals drawn out from each semiconductor device are arranged on the same plane on the top of the package, and a barrier is placed on the top of the package to isolate each terminal. In the formed power semiconductor device, the terminals of each semiconductor device are separated by type, and the terminals of the same type are arranged in a row, and each terminal is installed at a higher position than the barrier lined up in the row of terminals of the same type. A power semiconductor device characterized by:
JP4415190U 1990-04-25 1990-04-25 Pending JPH044760U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4415190U JPH044760U (en) 1990-04-25 1990-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4415190U JPH044760U (en) 1990-04-25 1990-04-25

Publications (1)

Publication Number Publication Date
JPH044760U true JPH044760U (en) 1992-01-16

Family

ID=31557196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4415190U Pending JPH044760U (en) 1990-04-25 1990-04-25

Country Status (1)

Country Link
JP (1) JPH044760U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019031140A1 (en) * 2017-08-10 2019-02-14 Koa株式会社 Current measurement device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019031140A1 (en) * 2017-08-10 2019-02-14 Koa株式会社 Current measurement device
JP2019035610A (en) * 2017-08-10 2019-03-07 Koa株式会社 Current measurement device
CN111183361A (en) * 2017-08-10 2020-05-19 Koa株式会社 Current measuring device

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