JPH044745U - - Google Patents
Info
- Publication number
- JPH044745U JPH044745U JP4539290U JP4539290U JPH044745U JP H044745 U JPH044745 U JP H044745U JP 4539290 U JP4539290 U JP 4539290U JP 4539290 U JP4539290 U JP 4539290U JP H044745 U JPH044745 U JP H044745U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- lead frame
- conveyance path
- semiconductor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4539290U JPH044745U (de) | 1990-04-26 | 1990-04-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4539290U JPH044745U (de) | 1990-04-26 | 1990-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH044745U true JPH044745U (de) | 1992-01-16 |
Family
ID=31559528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4539290U Pending JPH044745U (de) | 1990-04-26 | 1990-04-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH044745U (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60139590U (ja) * | 1984-02-28 | 1985-09-14 | 大阪グリツプ化工株式会社 | ハンドルのグリツプ |
-
1990
- 1990-04-26 JP JP4539290U patent/JPH044745U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60139590U (ja) * | 1984-02-28 | 1985-09-14 | 大阪グリツプ化工株式会社 | ハンドルのグリツプ |
JPH0310141Y2 (de) * | 1984-02-28 | 1991-03-13 |
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