JPH044745U - - Google Patents

Info

Publication number
JPH044745U
JPH044745U JP4539290U JP4539290U JPH044745U JP H044745 U JPH044745 U JP H044745U JP 4539290 U JP4539290 U JP 4539290U JP 4539290 U JP4539290 U JP 4539290U JP H044745 U JPH044745 U JP H044745U
Authority
JP
Japan
Prior art keywords
pellet
lead frame
conveyance path
semiconductor
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4539290U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4539290U priority Critical patent/JPH044745U/ja
Publication of JPH044745U publication Critical patent/JPH044745U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP4539290U 1990-04-26 1990-04-26 Pending JPH044745U (ar)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4539290U JPH044745U (ar) 1990-04-26 1990-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4539290U JPH044745U (ar) 1990-04-26 1990-04-26

Publications (1)

Publication Number Publication Date
JPH044745U true JPH044745U (ar) 1992-01-16

Family

ID=31559528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4539290U Pending JPH044745U (ar) 1990-04-26 1990-04-26

Country Status (1)

Country Link
JP (1) JPH044745U (ar)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60139590U (ja) * 1984-02-28 1985-09-14 大阪グリツプ化工株式会社 ハンドルのグリツプ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60139590U (ja) * 1984-02-28 1985-09-14 大阪グリツプ化工株式会社 ハンドルのグリツプ
JPH0310141Y2 (ar) * 1984-02-28 1991-03-13

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