JPH044744U - - Google Patents
Info
- Publication number
- JPH044744U JPH044744U JP1990044985U JP4498590U JPH044744U JP H044744 U JPH044744 U JP H044744U JP 1990044985 U JP1990044985 U JP 1990044985U JP 4498590 U JP4498590 U JP 4498590U JP H044744 U JPH044744 U JP H044744U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- die cutting
- die
- ribbon
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0113—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044985U JPH044744U (enExample) | 1990-04-26 | 1990-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044985U JPH044744U (enExample) | 1990-04-26 | 1990-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044744U true JPH044744U (enExample) | 1992-01-16 |
Family
ID=31558771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990044985U Pending JPH044744U (enExample) | 1990-04-26 | 1990-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044744U (enExample) |
-
1990
- 1990-04-26 JP JP1990044985U patent/JPH044744U/ja active Pending