JPH0377442U - - Google Patents
Info
- Publication number
- JPH0377442U JPH0377442U JP1989138983U JP13898389U JPH0377442U JP H0377442 U JPH0377442 U JP H0377442U JP 1989138983 U JP1989138983 U JP 1989138983U JP 13898389 U JP13898389 U JP 13898389U JP H0377442 U JPH0377442 U JP H0377442U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead frame
- supply device
- tape
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138983U JPH0377442U (enExample) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138983U JPH0377442U (enExample) | 1989-11-30 | 1989-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377442U true JPH0377442U (enExample) | 1991-08-05 |
Family
ID=31686056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989138983U Pending JPH0377442U (enExample) | 1989-11-30 | 1989-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377442U (enExample) |
-
1989
- 1989-11-30 JP JP1989138983U patent/JPH0377442U/ja active Pending
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