JPH044744U - - Google Patents

Info

Publication number
JPH044744U
JPH044744U JP4498590U JP4498590U JPH044744U JP H044744 U JPH044744 U JP H044744U JP 4498590 U JP4498590 U JP 4498590U JP 4498590 U JP4498590 U JP 4498590U JP H044744 U JPH044744 U JP H044744U
Authority
JP
Japan
Prior art keywords
solder
die cutting
die
ribbon
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4498590U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4498590U priority Critical patent/JPH044744U/ja
Publication of JPH044744U publication Critical patent/JPH044744U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の実施例を示す斜視図、第２
図は、実施例におけるマウントノズルの断面図、
第３図は、マウントノズルの動作を説明する断面
図、第４図は、従来例を示す構成図である。 １……ソルダー供給装置、２……ソルダー、２
ａ……ソルダー片、３……型抜台、４……ソルダ
ー送り機構、５……マウントノズル、６……ロボ
ツトハンド、４３……マウントベース。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプをマウントする加熱されたステム
    のマウントベース上に、マウント用のソルダーを
    供給する装置において、 リボン状のソルダーを型抜台の上面に添わせて
    送る手段と、 上記型抜台上のリボン状ソルダーからソルダー
    片を型抜するとともにその型抜したソルダー片を
    保持、解放する手段と、 上記型抜手段を移動させる手段とを備えたこと
    を特徴とするソルダー供給装置。
JP4498590U 1990-04-26 1990-04-26 Pending JPH044744U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4498590U JPH044744U (ja) 1990-04-26 1990-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4498590U JPH044744U (ja) 1990-04-26 1990-04-26

Publications (1)

Publication Number Publication Date
JPH044744U true JPH044744U (ja) 1992-01-16

Family

ID=31558771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4498590U Pending JPH044744U (ja) 1990-04-26 1990-04-26

Country Status (1)

Country Link
JP (1) JPH044744U (ja)

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