JPH0446500A - Ultrasonic wave probe - Google Patents
Ultrasonic wave probeInfo
- Publication number
- JPH0446500A JPH0446500A JP2154775A JP15477590A JPH0446500A JP H0446500 A JPH0446500 A JP H0446500A JP 2154775 A JP2154775 A JP 2154775A JP 15477590 A JP15477590 A JP 15477590A JP H0446500 A JPH0446500 A JP H0446500A
- Authority
- JP
- Japan
- Prior art keywords
- cut
- conductor
- transducer
- conductor connection
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims description 19
- 239000004020 conductor Substances 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は例えば医療用超音波診断装置に用いられる電子
走査形の超音波探触子に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic scanning type ultrasound probe used, for example, in a medical ultrasound diagnostic device.
従来の技術
第7図乃至第9図は、この種の超音波探触子の構成を示
している。第7図乃至第9図において、1は電気信号を
機械的振動に変換する超音波振動子、2は超音波振動子
1の前面と一側端面および背面の一部を覆うように設け
られている負極電極、3は超音波振動子1の背面を覆う
ように設けられている正極電極、4は負極電極2に電気
fぎ号を供給する導体、5は正極電極3に電気信号を供
給する導体である。BACKGROUND ART FIGS. 7 to 9 show the configuration of this type of ultrasonic probe. In FIGS. 7 to 9, 1 is an ultrasonic transducer that converts electrical signals into mechanical vibrations, and 2 is provided so as to cover the front surface, one end surface, and a part of the back surface of the ultrasonic transducer 1. 3 is a positive electrode provided to cover the back surface of the ultrasonic transducer 1; 4 is a conductor that supplies an electric signal to the negative electrode 2; and 5 is a conductor that supplies an electric signal to the positive electrode 3. It is a conductor.
これらの導体4.5はエツチング加工された金属薄板ま
たはパターンニングされたフレキシブルプリント配線板
などが用いられ、負極電極2および正極電極3に半田付
けもしくは導体性接着剤などにより電気的導通をなすべ
く接続されている。These conductors 4.5 are made of etched thin metal plates or patterned flexible printed wiring boards, and are electrically connected to the negative electrode 2 and positive electrode 3 by soldering or conductive adhesive. It is connected.
特に、導体4は第10図に示すように、金属薄板4aの
一側縁に等間隔に形成した突片4bの中央に線状部4c
を形成した形状をしており、2点鎖線位1t4clから
賂直角に折り曲げ、その折り曲げ基部4eを第71!l
乃至第9図に示すように負極電2に導通性接着剤8で接
着した後、背面負荷材6に熱硬化性樹脂などにより接着
している。In particular, as shown in FIG. 10, the conductor 4 has a linear portion 4c at the center of protrusions 4b formed at equal intervals on one side edge of the thin metal plate 4a.
It has a shape in which it is bent at right angles from the two-dot chain line 1t4cl, and the bent base 4e is the 71st! l
As shown in FIGS. 9 to 9, it is bonded to the negative electrode 2 with a conductive adhesive 8, and then bonded to the back load material 6 with a thermosetting resin or the like.
この後、第7図に示すように、スライシングマシンなど
により高速回転する切断砥石(図示せず)によって超音
波振動子1、置局電極2、正極電[i13をスリット7
aで完全に切断するとともに、背面負荷材6と導体4.
5の一部も同時に切断し、しかも導体4を線状部4Cと
同ピツチ毎にスリット7aと同一の深さのスリット7b
で完全に切断することにより、l=気的グループ内に複
数個の超音波振動子を有する超音波振動子アレイを形成
している。After that, as shown in FIG.
While completely cutting at point a, the back load material 6 and conductor 4.
5 is also cut at the same time, and the conductor 4 is cut into slits 7b having the same depth as the slits 7a at the same pitch as the linear portion 4C.
By completely cutting at , an ultrasonic transducer array having a plurality of ultrasonic transducers in the l=air group is formed.
発明が解決しようとする課題 しかしながら、上記従来の超音波探触子では、。Problems that the invention aims to solve However, in the conventional ultrasonic probe described above.
超音波振動子lを切断分割する際に、導体4.5の一部
も同時に切断する必要があり、通常用いられるスライシ
ングマシン用の切断砥石では、その切断が非常に困難で
ある。また、砥石に対する目づまりなどが発生し、超音
波振動子1の切断に際し、その切削性が著しく低下する
。When cutting and dividing the ultrasonic transducer 1, it is necessary to also cut a part of the conductor 4.5 at the same time, and this cutting is extremely difficult with a cutting wheel for a commonly used slicing machine. Furthermore, clogging of the grindstone occurs, and the cutting performance of the ultrasonic vibrator 1 is significantly reduced.
その結果、超音波振動子1の割れ、欠け、電極2.3と
導体4.5との剥離などが発生してしまい、均一なピッ
チの超音波振動子アレイの形成は切断ピッチが細かくな
るに従い、より困難となる。このため、超音波振動子1
の高分解能化にともなう高精細ピッチの超音波振動子ア
レイの形成は非常に困難であるという問題があった。As a result, cracks and chips in the ultrasonic transducer 1, peeling between the electrode 2.3 and the conductor 4.5, etc. occur, and as the cutting pitch becomes finer, it becomes difficult to form an ultrasonic transducer array with a uniform pitch. , becomes more difficult. For this reason, the ultrasonic transducer 1
There has been a problem in that it is extremely difficult to form an ultrasonic transducer array with a high-definition pitch as the resolution becomes higher.
また、図示例のような導体形状の場合、導体4の切断位
置との位置合わせにおいて、高精度の位置合わせが必要
となり、製作上工数がかかる上に、導体4のピッチ精度
も高いものが要求されるという問題があった。In addition, in the case of a conductor shape like the illustrated example, highly accurate alignment is required in aligning the cut position of the conductor 4, which requires a lot of man-hours to manufacture, and also requires a high pitch accuracy of the conductor 4. There was a problem with being exposed.
本発明は、このような従来の問題を解決するものであり
、製作が容易で高精細ピッチの超音波振動子アレイを有
する高分解能な超音波探触子を提供することを目的とす
るものである。The present invention solves these conventional problems, and aims to provide a high-resolution ultrasonic probe that is easy to manufacture and has a high-definition pitch ultrasonic transducer array. be.
課題を解決するための手段
本発明は上記目的を達成するために、同一面上にその厚
さが他の部分の厚さより厚い一対の導体接続部分を形成
し、且つ両面にそれぞれ導体接続部分の一方に達する電
極を設けた超音波振動子と、導体接続部分に達した電極
に一定の間隔毎に接続され、且つこの電極に電気信号を
供給する多数の棒状導体とを備え、前記各棒状導体間の
中央において、前記超音波振動子を前記導体接続部分と
ともに電気的、機械的に完全に切断し、この切断された
超音波振動子を前記導体接続部分の途中まで機械的にの
み切断して、超音波振動子アレイを形成するようにした
。Means for Solving the Problems In order to achieve the above object, the present invention forms a pair of conductor connection parts on the same surface, the thickness of which is thicker than the thickness of the other parts, and also forms a pair of conductor connection parts on both sides. The ultrasonic transducer includes an ultrasonic transducer provided with an electrode reaching one side, and a large number of rod-shaped conductors that are connected at regular intervals to the electrodes that reach the conductor connection part and supply electrical signals to the electrodes, and each of the rod-shaped conductors The ultrasonic vibrator is electrically and mechanically completely cut off along with the conductor connection portion at the center between the two, and the cut ultrasonic vibrator is mechanically cut only halfway to the conductor connection portion. , to form an ultrasonic transducer array.
作用
したがって、本発明によれば、超音波振動子を一定間隔
毎に接続された棒状導体の各棒状導体間において、導体
接続部分とともに切断し、また、この導体接続部分ぼ途
中まで切断する段這い切断を行うことにより、高精細ピ
ッチの超音波振動子アレイを容易に形成することができ
、高分解能な超音波探触子を得ることができるという効
果を有する。Therefore, according to the present invention, the ultrasonic transducer is cut together with the conductor connection portion between each of the rod-like conductors connected at regular intervals, and the step cutting is performed in which the conductor connection portion is cut approximately halfway. By cutting, an ultrasonic transducer array with a high-definition pitch can be easily formed, and a high-resolution ultrasonic probe can be obtained.
実施例
第1図乃至第3図は本発明の一実施例の構成を示すもの
である。第1図乃至第31!lにおいて、11は、同一
面に一対の導体接続部分112.11bを他の部分の厚
さよりも厚くなるように形成した超音波振動子、12は
超音波振動子11の前面と一側端面を覆い背面の導体接
続部分11aに達するように設けられた負極電極である
。Embodiment FIGS. 1 to 3 show the structure of an embodiment of the present invention. Figures 1 to 31! 1, 11 is an ultrasonic transducer in which a pair of conductor connection parts 112.11b are formed on the same surface to be thicker than the other parts; 12 is an ultrasonic transducer having a front surface and one end surface of the ultrasonic transducer 11; This is a negative electrode provided so as to reach the conductor connection portion 11a on the back surface of the cover.
13は超音波振動子11の背面を覆い導体接続部分11
bに達するように設けられている正極電橋、14は負極
電極12に電気信号を供給する導体、15は正極電挟1
3に電気信号を供給すう導体であり、特に導体14は第
4図に示すように、電極接続端部まで電気的に分離され
た形状、つまり棒状導体であり、ピッチ18の間隔で接
続されている。13 is a conductor connecting portion 11 that covers the back surface of the ultrasonic transducer 11;
14 is a conductor that supplies an electric signal to the negative electrode 12, and 15 is a positive electrode bridge 1 that is provided to reach b.
In particular, the conductor 14 is a rod-shaped conductor that is electrically separated up to the electrode connection end, as shown in FIG. 4, and is connected at a pitch of 18. There is.
上記導体14.15は負極電極12、正極電極13に半
田付けもしくは導体性接着剤23による接着など電気的
導通を得るように接続する。The conductors 14 and 15 are connected to the negative electrode 12 and the positive electrode 13 by soldering or adhesion with a conductive adhesive 23 to obtain electrical continuity.
16は上記超音波振動子11の背面および導体14.1
5の一部に熱硬化性樹脂などにより接着形成した背面負
荷材であり、超音波振動子11と導体14.15の間に
段差19が生じる。16 is the back surface of the ultrasonic transducer 11 and the conductor 14.1
5 is a backside load material that is adhesively formed with a thermosetting resin or the like on a part of the ultrasonic transducer 11 and the conductor 14.
上記超音波振動子11は、前期従来の超音波振動子と同
様に、スライシングマシンなどで切断加工するが、この
場合、上記各棒状導体間の中央において上記導体接続部
分とともに電気的、機械的に完全にスリット17aで切
断し、この切断された超音波振動子を上記導体接続部分
の途中まで機械的にのみスリット17bで切断して段違
いの切断を行い、超音波振動子アレイを形成する。The ultrasonic transducer 11 is cut using a slicing machine or the like in the same manner as the earlier conventional ultrasonic transducer. The ultrasonic transducers are completely cut with the slits 17a, and the cut ultrasonic transducers are mechanically cut with the slits 17b only up to the middle of the conductor connection portion to perform uneven cutting, thereby forming an ultrasonic transducer array.
この段這い接断により、スライシングマシンによって切
断分割すべき材質は、超音波振動子11と背面負荷材1
6の一部のみとなり、同一電気グループ内の超音波振動
子はその一部が導体接続部分11aによって接続された
ままという状態となる。Through this stepwise cutting, the materials to be cut and divided by the slicing machine are the ultrasonic vibrator 11 and the back load material 1.
6, and some of the ultrasonic transducers in the same electrical group remain connected by the conductor connection portion 11a.
このように、超音波振動子11と背面負荷材16の一部
のみ切断することにより、切断困難な銅ハタなどの導体
14を切断する必要がなく、高精細な超音波振動子アレ
イを割れ、欠けや負極電極12、正極電極13と導体1
4.15との剥離などを生ずることなく得ることができ
る。In this way, by cutting only part of the ultrasonic transducer 11 and the back load material 16, there is no need to cut the conductor 14, such as copper wire, which is difficult to cut, and a high-definition ultrasonic transducer array can be broken. Chips, negative electrode 12, positive electrode 13 and conductor 1
4.15 can be obtained without causing any peeling or the like.
また、導体接続部部分11a、llbで超音波振動子1
1の一部がつながったままという状態となるため、アレ
イは倒れ、傾きなどを生じることなく形成することがで
きるという利点を有する。In addition, the ultrasonic transducer 1 is connected to the conductor connection portions 11a and llb.
1 remain connected, so the array has the advantage that it can be formed without collapsing or tilting.
第2図は本発明の第2の実施例を示す要部構成図であり
、平板状の超音波振動子11の前面と一側端面を覆い背
面の側縁部に達するように負極電極12を設け、超音波
振動子11の背面を覆うように正極電極13を設けた後
、周面に導通性処理24が施された棒材20を半田付け
もしくは導通性接着剤などにより、超音波振動子11の
背面両側縁部に固着して、この背面両側線部を他の部分
より厚く形成して導体接続部分11a、llbとする。FIG. 2 is a main part configuration diagram showing a second embodiment of the present invention, in which a negative electrode 12 is arranged so as to cover the front surface and one end surface of a flat ultrasonic transducer 11 and reach the side edge of the back surface. After providing the positive electrode 13 so as to cover the back surface of the ultrasonic vibrator 11, the bar 20 whose peripheral surface has been subjected to conductive treatment 24 is attached to the ultrasonic vibrator by soldering or using a conductive adhesive. The conductor connection portions 11a and llb are fixed to both side edges of the back surface of the conductor connection portion 11, and the line portions on both sides of the back surface are formed thicker than other portions.
この場合、上記棒材20の材質としては、超音波振動子
11と同程度の切断性を有するものが望ましく、超音波
振動子11と同材質または異種材質であってもよい。In this case, the material of the bar 20 is desirably one that has the same degree of cuttability as the ultrasonic transducer 11, and may be the same material as the ultrasonic transducer 11 or a different material.
第3図は本発明の第3の実施例を示す要部構成図であり
、負極型[112、正極電極13を形成する以前の超音
波振動子11の背面両側縁にあらかじめ棒材21を固着
し、しかる後に、超音波振動子11の前面と一側端面お
よび棒材21の背面を覆うように負極電極12を設け、
超音波振動子11の背面と棒材21の背面を覆うように
正極電極13を設け、超音波振動子11の背面両側縁部
を他より厚く形成して導体m続部分11a、llbとし
ている。この場合、超音波振動子llと棒材21を固着
する際の固着材22は導通性を有する必要はない。FIG. 3 is a block diagram showing the main parts of a third embodiment of the present invention, in which bars 21 are fixed in advance to both sides of the back side of the ultrasonic transducer 11 before forming the negative electrode type [112 and the positive electrode 13]. After that, a negative electrode 12 is provided so as to cover the front surface and one end surface of the ultrasonic vibrator 11 and the back surface of the bar 21,
A positive electrode 13 is provided so as to cover the back surface of the ultrasonic vibrator 11 and the back surface of the bar 21, and both side edges of the back surface of the ultrasonic vibrator 11 are formed thicker than the other edges to form conductor m-connected portions 11a and llb. In this case, the fixing material 22 used to fix the ultrasonic transducer ll and the bar 21 does not need to have electrical conductivity.
以上の各実施例のように形成された超音波振動子11に
前記第1の実施例と同様に棒状導体を一定間隔毎に接続
し、切断分割を行った場合においても、第1の実施例を
同様の効果を有する。Even in the case where the ultrasonic transducer 11 formed as in each of the above embodiments is connected to rod-shaped conductors at regular intervals in the same way as in the first embodiment and is cut and divided, the first embodiment has a similar effect.
また、第2の実施例においては、棒材2oは絶縁体であ
るという前提で説明したが、導電体であってもよい。導
電体の場合には、棒材に対する導電性処理は不要である
。Furthermore, although the second embodiment has been described on the assumption that the bar 2o is an insulator, it may be a conductor. In the case of a conductor, conductivity treatment for the bar is not necessary.
なお、上記各実施例では、リニアアレイ型の超音波探触
子について説明したが、湾曲したアレイ、例えば、コン
ベクス型超音波探触子などについても、同様の構成によ
り同様の効果を得ることができる。In each of the above embodiments, a linear array type ultrasonic probe was described, but the same effect can be obtained with a similar configuration for a curved array, such as a convex type ultrasonic probe. can.
発明の効果
本発明は上記実施例により明らかなように、同一面上に
その厚さが他の部分の厚さより厚い一対の導体接続部分
を形成し、且つ両面にそれぞれ導体接続部分の一方に達
する電極を設けた超音波振動子と、導体接続部分に達し
た電極に一定の間隔毎に接続され、且つこの電極に電気
信号を供給する多数の棒状導体とを備え、前記各棒状導
体間の中央において、前記超音波振動子を前記導体接続
部分とともに電気的、機械的に完全に切断し、この切断
された超音波振動子を前記導体接続部分の途中まで機械
的にのみ切断して、超音波振動子アレイを形成するよう
にしたので、超音波振動子を一定間隔毎に接続された棒
状導体の各棒状導体間において、導体接続部分とともに
切断し、また、この導体接続部分ぼ途中まで切断する段
違い切断を行うことにより、高精細ピッチの超音波振動
子アレイを容易に形成することができ、高分解能な超音
波探触子を得ることができる。Effects of the Invention As is clear from the above embodiments, the present invention forms a pair of conductor connection portions on the same surface, each of which is thicker than the other portions, and each reaches one of the conductor connection portions on both surfaces. An ultrasonic transducer provided with an electrode, and a large number of rod-shaped conductors that are connected at regular intervals to the electrodes that reach the conductor connection portion and supply electrical signals to the electrodes, and a center between each of the rod-shaped conductors. In this step, the ultrasonic vibrator is completely electrically and mechanically cut off along with the conductor connection part, and the cut ultrasonic vibrator is mechanically cut only halfway to the conductor connection part, and the ultrasonic transducer is Since a transducer array is formed, the ultrasonic transducers are cut together with the conductor connection portions between the rod-shaped conductors connected at regular intervals, and the conductor connection portions are also cut approximately halfway. By performing uneven cutting, an array of ultrasonic transducers with a high-definition pitch can be easily formed, and a high-resolution ultrasonic probe can be obtained.
第1図はこの実施例における超音波探触子の側面図、第
2図はこの超音波探触子の製作途中の側面図、第3(!
lは第21!1m−III線に沿う横断面図、第4図は
その超音波探触子の構成要素である導体の正面図、第5
図、第6図は本発明の超音波探触子の構成要素である超
音波振動子の横断面図、第7図は従来の超音波探触子の
側面図、第8図は従来の超音波探触子の製作途中の側面
図、第9図は第8図IX−IX線に沿う横断面図、第1
0図は従来の超音波探触子の構成要素である導体の正面
図である。
11・・・超音波振動子、lla、llb・・・導体接
続部分、12・・・負極電極、13・・・正極電極、1
4 、 1 5 =・ 導 体 、 17a、
17b−ス リ ッ ト 、 20.21−・・
棒材。
第
図
第
図Fig. 1 is a side view of the ultrasonic probe in this embodiment, Fig. 2 is a side view of the ultrasonic probe in the process of being manufactured, and Fig. 3 (!) is a side view of the ultrasonic probe in this embodiment.
1 is a cross-sectional view taken along line 21!1m-III, FIG. 4 is a front view of the conductor that is a component of the ultrasonic probe, and FIG.
6 is a cross-sectional view of an ultrasonic transducer which is a component of the ultrasonic probe of the present invention, FIG. 7 is a side view of a conventional ultrasonic probe, and FIG. 8 is a cross-sectional view of a conventional ultrasonic probe. Figure 9 is a side view of the sonic probe in the process of being manufactured;
Figure 0 is a front view of a conductor that is a component of a conventional ultrasound probe. DESCRIPTION OF SYMBOLS 11... Ultrasonic vibrator, lla, llb... Conductor connection part, 12... Negative electrode, 13... Positive electrode, 1
4, 15 = Conductor, 17a,
17b-slit, 20.21-...
Bar material. Figure Figure
Claims (1)
導体接続部分を形成し、且つ両面にそれぞれ導体接続部
分の一方に達する電極を設けた超音波振動子と、導体接
続部分に達した電極に一定の間隔毎に接続され、且つこ
の電極に電気信号を供給する多数の棒状導体とを備え、
前記各棒状導体間の中央において、前記超音波振動子を
前記導体接続部分とともに電気的、機械的に完全に切断
し、この切断された超音波振動子を前記導体接続部分の
途中まで機械的にのみ切断して、超音波振動子アレイを
形成した超音波探触子。An ultrasonic transducer has a pair of conductor connection parts that are thicker than the other parts on the same surface, and has electrodes on both sides that reach one of the conductor connection parts. A large number of rod-shaped conductors are connected to the electrodes at regular intervals and supply electrical signals to the electrodes,
The ultrasonic vibrator is electrically and mechanically completely cut off along with the conductor connecting portion at the center between each of the rod-shaped conductors, and the cut ultrasonic vibrator is mechanically cut halfway to the conductor connecting portion. An ultrasonic probe that is cut to form an ultrasonic transducer array.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2154775A JP2512209B2 (en) | 1990-06-13 | 1990-06-13 | Ultrasonic probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2154775A JP2512209B2 (en) | 1990-06-13 | 1990-06-13 | Ultrasonic probe |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0446500A true JPH0446500A (en) | 1992-02-17 |
JP2512209B2 JP2512209B2 (en) | 1996-07-03 |
Family
ID=15591624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2154775A Expired - Lifetime JP2512209B2 (en) | 1990-06-13 | 1990-06-13 | Ultrasonic probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2512209B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11226012A (en) * | 1998-02-12 | 1999-08-24 | Hitachi Medical Corp | Ultrasonic wave probe |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102374007B1 (en) * | 2017-09-15 | 2022-03-14 | 지멘스 메디컬 솔루션즈 유에스에이, 인크. | Ultrasound transducer and manufacturing method thereof |
-
1990
- 1990-06-13 JP JP2154775A patent/JP2512209B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11226012A (en) * | 1998-02-12 | 1999-08-24 | Hitachi Medical Corp | Ultrasonic wave probe |
Also Published As
Publication number | Publication date |
---|---|
JP2512209B2 (en) | 1996-07-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0872285B1 (en) | Connective backing block for composite transducer | |
EP0379229A2 (en) | Ultrasonic probe | |
US4773140A (en) | Phased array transducer construction | |
JPS5920240B2 (en) | Ultrasonic probe and method for manufacturing the ultrasonic probe | |
JP3673035B2 (en) | Ultrasonic transducer | |
JPH0446500A (en) | Ultrasonic wave probe | |
JPS58118739A (en) | Ultasonic probe and production thereof | |
JPH09215095A (en) | Ultrasonic wave transducer and its manufacture | |
JP2615517B2 (en) | Ultrasonic probe manufacturing method | |
JP4153576B2 (en) | Ultrasonic transducer | |
JPH10112899A (en) | Ultrasonic wave probe | |
JPH04119800A (en) | Ultrasonic wave probe | |
JPH07131896A (en) | Ultrasonic probe and its production | |
JP2945978B2 (en) | Array type ultrasonic probe | |
JPS63276400A (en) | Ultrasonic probe and its manufacture | |
JP3431275B2 (en) | Ultrasonic transducer and manufacturing method thereof | |
JP2990884B2 (en) | Array transducer | |
JPH0553119B2 (en) | ||
JPS644332Y2 (en) | ||
JPH0641708U (en) | Ultrasonic probe | |
JPH0523040Y2 (en) | ||
JPS63212299A (en) | Ultrasonic wave probe and its production | |
JP2004328099A (en) | Conductive board and ultrasonic probe employing the same | |
JPH11276479A (en) | Ultrasonic probe, ultrasonograph having ultrasonic probe and manufacture of ultrasonic probe | |
JP2935550B2 (en) | Ultrasonic probe |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080416 Year of fee payment: 12 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090416 Year of fee payment: 13 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100416 Year of fee payment: 14 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110416 Year of fee payment: 15 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110416 Year of fee payment: 15 |