JPH0446221Y2 - - Google Patents
Info
- Publication number
- JPH0446221Y2 JPH0446221Y2 JP1985170032U JP17003285U JPH0446221Y2 JP H0446221 Y2 JPH0446221 Y2 JP H0446221Y2 JP 1985170032 U JP1985170032 U JP 1985170032U JP 17003285 U JP17003285 U JP 17003285U JP H0446221 Y2 JPH0446221 Y2 JP H0446221Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- frame
- conductive terminal
- jig
- inspection jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 210000002105 tongue Anatomy 0.000 claims description 51
- 238000007689 inspection Methods 0.000 claims description 48
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 239000011810 insulating material Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims 1
- 239000000523 sample Substances 0.000 description 9
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical class [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985170032U JPH0446221Y2 (US20080094685A1-20080424-C00004.png) | 1985-11-05 | 1985-11-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985170032U JPH0446221Y2 (US20080094685A1-20080424-C00004.png) | 1985-11-05 | 1985-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6279182U JPS6279182U (US20080094685A1-20080424-C00004.png) | 1987-05-20 |
JPH0446221Y2 true JPH0446221Y2 (US20080094685A1-20080424-C00004.png) | 1992-10-29 |
Family
ID=31104389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985170032U Expired JPH0446221Y2 (US20080094685A1-20080424-C00004.png) | 1985-11-05 | 1985-11-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0446221Y2 (US20080094685A1-20080424-C00004.png) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60213872A (ja) * | 1984-03-19 | 1985-10-26 | アイ・テイー・インダストリーズ、インコーポレーテツド | チツプキヤリアテストアダプタ |
-
1985
- 1985-11-05 JP JP1985170032U patent/JPH0446221Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60213872A (ja) * | 1984-03-19 | 1985-10-26 | アイ・テイー・インダストリーズ、インコーポレーテツド | チツプキヤリアテストアダプタ |
Also Published As
Publication number | Publication date |
---|---|
JPS6279182U (US20080094685A1-20080424-C00004.png) | 1987-05-20 |