JPH0445596A - Wiring device of electric circuit - Google Patents
Wiring device of electric circuitInfo
- Publication number
- JPH0445596A JPH0445596A JP15281090A JP15281090A JPH0445596A JP H0445596 A JPH0445596 A JP H0445596A JP 15281090 A JP15281090 A JP 15281090A JP 15281090 A JP15281090 A JP 15281090A JP H0445596 A JPH0445596 A JP H0445596A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- printed circuit
- conductor
- wiring device
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241000345998 Calamus manan Species 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 235000012950 rattan cane Nutrition 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子機器等に使用されるモールド7レームに
導電体を埋込み、該層設導電体を機器内配線として使用
するようにした7レー五一体温配線構造をとる電気回路
の配Im!装置に置部る。[Detailed Description of the Invention] [Industrial Application Field] The present invention is a mold 7 frame used for electronic equipment, etc., in which a conductor is embedded, and the layered conductor is used as wiring inside the equipment. Layout of an electric circuit with a body temperature wiring structure Im! Place it on the device.
従来の電子機器においては、機器本体内の各部に配設さ
れる電気回路(例えばプリント基板)間の接続は、絶縁
被覆を施したリード線を用いて行われるのが一般的であ
り、この種の接続構造は例えば実公昭45−51428
号公報に開示されている。In conventional electronic devices, connections between electrical circuits (e.g. printed circuit boards) arranged in various parts of the device body are generally made using insulated lead wires. For example, the connection structure of
It is disclosed in the publication No.
上記し九ように、電気回路(プリント基M)間の接続を
リード線にて行った場合、例えば第6図に示すように、
グラスチック製の7レーム!1に配設された1りント基
板22.23上の電気回路同志は、コネタタ24などを
介してリード!I(絶縁被覆導線)25によって電気的
に接続される。As mentioned above, when the connection between the electric circuits (printed board M) is made using lead wires, for example, as shown in FIG.
7 frames made of glass! The electrical circuits on the printed circuit boards 22 and 23 arranged on the board 1 are connected to each other via the connector 24, etc. It is electrically connected by I (insulated conductive wire) 25.
この場合、同図に示すようにリード線2sとプリント基
板22.250接続作業0他に、リード線25の所定部
位を固定具24で7レ一ム21内壁面等に沿わせて固定
した夛、複数0リード纏25同志をバンド等で結束する
作業が必要とな夛、且り、7レーム21内の狭い隙間を
縫うよ5Kしてリード線25を引を回すことが求められ
るため。In this case, as shown in the figure, in addition to the connection work between the lead wire 2s and the printed circuit board 22, 250, a predetermined portion of the lead wire 25 is fixed along the inner wall surface of the 7th frame 21 with a fixture 24. This is because it is necessary to bind the plurality of 0-lead bundles 25 together with a band or the like, and it is also required to thread the lead wires 25 through a narrow gap within the 7-frame 21.
トータルとしての接続作業性が悪iという問題があった
。また、リード線25の引き回しスペースを、他の部材
0邪魔になうないようにフレーム21内に確保する必要
性がToシ、プリント基板や機構部材の配置の自由度を
損なう要因の1つともなりていた。There was a problem in that the overall connection workability was poor. In addition, the need to secure space for the lead wires 25 within the frame 21 so as not to interfere with other components is one of the factors that impairs the degree of freedom in arranging printed circuit boards and mechanical components. It was becoming.
本発明の目的は、上記した従来技術のもつ問題点を解消
し、機器本体内における電気回路間の接続作業性を改善
できると共に、スペース7アタターのよい配線構造をと
〕得、機器の小屋化に寄与可能な電気回路O配線装置を
提供することにある。The purpose of the present invention is to solve the problems of the above-mentioned prior art, to improve the workability of connecting electrical circuits within the equipment body, to obtain a wiring structure with good space 7 attachment, and to make the equipment into a shed. The object of the present invention is to provide an electric circuit O wiring device that can contribute to
本発明は上記した目的を達成するため、絶縁性ヲ有する
プラスチック製の7レー五に、相離れた電気回路間を中
継・接続するための導電体をインサートモールドによっ
て厘込み・配設した、7レ一ム一体Miの配線構造をと
るようにされる。In order to achieve the above-mentioned object, the present invention includes a 7-wire 5 made of plastic with insulating properties, and a conductor for relaying and connecting separate electric circuits inserted and disposed therein by insert molding. A wiring structure of one frame and one Mi is adopted.
電子機器本体内に配設されるプリント基板等の各回路系
や機構部材などを保持したシ、あるいは機器の主枠体を
構成するためのプラスチック製のフレームに、機器内配
線として用いるための導電体(導電線あるいは導電全域
薄板)をインサートモールドによって予めフレームに一
体に埋設しておく。この導電体は例えばその画趨におい
て7し一ムから露呈しており、この露呈部において例え
ばコネクタを介して7レームに保持さnたプリント基板
に接続される。斯様なフレーム一体型の配線構造をとれ
ば5機器本体(7レーム)内の狭い隙間を縫うようにし
てリード線を引き回す会費がなく、また、リード線の所
定部位の固定作業中リード線同志の結束作業も必要とし
ないので、組立作業性が向上する。また、リード線の引
き回しスペースを確保する必l!もないので機器内での
部材配置の自由度も高まシ、機器全体の小型化にも寄与
する。さらに、外付はリードiii接続に比して、作業
性が改善され量産性に冨んでいるので低価格化も可能と
なる。Conductive wire for use as wiring inside the device is placed on the plastic frame that holds various circuit systems and mechanical components such as printed circuit boards installed inside the main body of the electronic device, or the main frame of the device. The body (conductive wire or conductive thin plate) is embedded in the frame in advance by insert molding. This conductor is exposed from, for example, the 7th frame in its image direction, and is connected to the printed circuit board held at the 7th frame through, for example, a connector at this exposed portion. With such a frame-integrated wiring structure, there is no need to route the lead wires through narrow gaps in the 5 device bodies (7 frames), and the lead wires can be easily connected to each other while fixing the lead wires at specified locations. Since there is no need for binding work, assembly work efficiency is improved. Also, make sure you have enough space to route the lead wires! Since there are no parts, there is a high degree of freedom in arranging components within the device, which also contributes to miniaturization of the entire device. Furthermore, compared to the lead III connection, the external connection has improved workability and is suitable for mass production, making it possible to lower the cost.
以下、本発明を第1図〜@S図に示した1実施例によっ
て説明する。The present invention will be explained below with reference to an embodiment shown in FIGS.
!1図はフレーム一体型配Mill造をとる電気機器(
例えばVTR)のフレーム構造を示す簡略化した説明図
、!2図はg1図のA−A線断面図、第3図は第1図0
B−B線断面図、第4図は第1#Aoc−c線断面図、
第5図は第1図の要部拡大断面図である。。! Figure 1 shows electrical equipment with a frame-integrated mill structure (
For example, a simplified explanatory diagram showing the frame structure of a VTR)! Figure 2 is a sectional view taken along line A-A of Figure g1, Figure 3 is Figure 1 0
BB line sectional view, FIG. 4 is the 1st #Aoc-c line sectional view,
FIG. 5 is an enlarged sectional view of the main part of FIG. 1. .
図において、1は絶縁性を有するプラスチック製のフレ
ームで、インジ慕タシ璽ンモールドにようて所定形状に
成形されておシ、機器O主枠体を構成すると共に、各種
部材を支持するようになりている。2は7レーム1に置
設された例えばCu系の導電線で、7レーム1の成形時
にインサートモールドによりて所定位置KI[め込み配
設されて>)、その両端は7レーム1の接続用突部1m
において露呈するようにされている。なお、この導電線
2は良導電性の金属薄板よシなる細条等に代替すること
も可能である。また、前記7レーム1は、望ましくは離
燃性に優れ絶縁信頼性の高い材料で形成されるべきであ
るが、一般グレードのグラスチックであれば実用上問題
はなく、41にその材質にこだわるものではない。In the figure, 1 is an insulating plastic frame that is molded into a predetermined shape using an insulating mold.It forms the main frame of the equipment O and also supports various components. ing. 2 is a conductive wire, for example, made of Cu, placed on the 7th frame 1, which is inserted into a predetermined position KI (embedded and disposed>) by an insert mold during molding of the 7th frame 1, and its both ends are for connecting the 7th frame 1. Projection 1m
It is made to be exposed in. Incidentally, the conductive wire 2 may be replaced by a thin strip made of a highly conductive metal thin plate. In addition, the 7-frame 1 should preferably be made of a material with excellent flammability and high insulation reliability, but if it is made of general grade glass, there will be no practical problem, so it is important to be particular about the material used in 41. It's not a thing.
3はフレーム1に適宜手段を介して保持された$1のプ
リント基板、4は該第1のプリント基板墨と一体化され
たモータアッセンブリで、!11のプリント基板5には
例えばこのモータのための駆動回路が搭載されている。3 is a $1 printed circuit board held on the frame 1 via appropriate means, 4 is a motor assembly integrated with the first printed circuit board, and! For example, a drive circuit for this motor is mounted on the printed circuit board 11.
5は同じく7レーム1に適宜手段を介して保持された籐
20プリント基板で、この第2のプリント基板5には例
えば上記モータ駆動回路のための制御回路が搭載されて
いる。Reference numeral 5 denotes a rattan 20 printed circuit board which is similarly held on the seven frames 1 through appropriate means, and this second printed circuit board 5 is equipped with, for example, a control circuit for the motor drive circuit described above.
6.6は上記N1.第2のプリント基板5,5にそれぞ
れ固設されたコネクタで、纂5図に示すように、該;ネ
クタ6のコネクタハウジング6畠内の導体片6bが、前
記接続用突部1aにおいて前記導電線2と弾接するよう
にされてお夛、これKより、前記#11のプリント基板
5上のモータ駆動回路と前記第2のプリント基板5上の
制御回路とが7レーム1に埋設された導電線2によって
電気的に接続されるようになっている。6.6 is the above N1. As shown in Fig. 5, the conductor piece 6b in the connector housing 6 of the connector 6 is connected to the conductor at the connection protrusion 1a. The motor drive circuit on the #11 printed circuit board 5 and the control circuit on the second printed circuit board 5 are connected to the conductive wire 2 embedded in the 7th frame 1. They are electrically connected by line 2.
斯様な構成をとる本実施例においては、$1゜第2のプ
リント基板5.5間の接続を図るに際し。In this embodiment having such a configuration, the connection between the second printed circuit boards 5 and 5 is $1.
従来のようにフレーム1内の狭い隙間を縫うようにして
リード線を引き回したシ、リード線の所定部位をフレー
ム1に固定したシする所顛スタイル取りのための作業が
なくなるので、組立作業性が向上し、量産性にも優れて
いるのでコスト的にも有利である。まえ、リード線の引
き回しスペースを確保する必要もないので機器内で0部
材配置の自由度も高t)1機器全体の小屋化にも寄与で
きる。Assembly work is improved because there is no need to sew the lead wire through a narrow gap in the frame 1 as in the past, or to fix the lead wire at a predetermined part to the frame 1. It is also advantageous in terms of cost because it improves mass productivity and is suitable for mass production. In addition, there is no need to secure a space for routing lead wires, so there is a high degree of freedom in arranging components within the device.t) 1) It can also contribute to making the entire device a shed.
以上のように本発明によれば1機器本体内における電気
回路間の接続作業性を改善できると共に、スペースファ
クターのよい配線構造をとル得て機器の小屋化にも寄与
する電気回路の配線装置を提供でき、その価値は多大で
ある。As described above, according to the present invention, an electrical circuit wiring device that can improve the workability of connecting electrical circuits within a single equipment body, and also achieves a wiring structure with a good space factor and contributes to the construction of equipment as a shed. can be provided, and its value is enormous.
第1図〜1g5図は本発明の1実施例に係シ、第1図は
フレーム一体型配線構造をとる電気機器のフレーム構造
を示す簡略化した説明図、II2図は第1図のA−A線
断面図、第3図は#11図OB −B線断面図、第4図
は第1図のC−C線断面図、第5図は第1図の要部拡大
断面図、第6図は従来の配線構造を示す説明図である。
1・・・フレーム、1a・・・接続用突部、!−・・導
電線、5・・・J[1のプリント基板、4・・・モータ
アッセンブリ、5・・・第2のプリント基板、6・・・
コネクタ、6a・・・コネクタハウジング、6b・・・
導体片。Figures 1 to 1g5 relate to one embodiment of the present invention, Figure 1 is a simplified explanatory diagram showing the frame structure of an electrical device having a frame-integrated wiring structure, and Figure II2 is A--A of Figure 1. 3 is a sectional view taken along line #11 OB-B, FIG. 4 is a sectional view taken along line C-C of FIG. 1, FIG. 5 is an enlarged sectional view of the main part of FIG. The figure is an explanatory diagram showing a conventional wiring structure. 1... Frame, 1a... Connection protrusion,! - Conductive wire, 5... J [1 printed circuit board, 4... Motor assembly, 5... Second printed circuit board, 6...
Connector, 6a... Connector housing, 6b...
conductor piece.
Claims (1)
れた電気回路間を中継・接続するための導電体をインサ
ートモールドによつて埋込み・配設したことを特徴とす
る電気回路の配線装置。1. An electric circuit wiring device characterized in that a conductor for relaying and connecting separate electric circuits is embedded and arranged in an insulating plastic frame by insert molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15281090A JPH0445596A (en) | 1990-06-13 | 1990-06-13 | Wiring device of electric circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15281090A JPH0445596A (en) | 1990-06-13 | 1990-06-13 | Wiring device of electric circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0445596A true JPH0445596A (en) | 1992-02-14 |
Family
ID=15548650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15281090A Pending JPH0445596A (en) | 1990-06-13 | 1990-06-13 | Wiring device of electric circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0445596A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009268542A (en) * | 2008-04-30 | 2009-11-19 | Newgin Co Ltd | Game machine |
JP2009268543A (en) * | 2008-04-30 | 2009-11-19 | Newgin Co Ltd | Game machine |
-
1990
- 1990-06-13 JP JP15281090A patent/JPH0445596A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009268542A (en) * | 2008-04-30 | 2009-11-19 | Newgin Co Ltd | Game machine |
JP2009268543A (en) * | 2008-04-30 | 2009-11-19 | Newgin Co Ltd | Game machine |
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