JPH0445257Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Field of Application of the Invention) This invention relates to an optical semiconductor device used in, for example, an LED lamp.

(Prior art) Conventionally, in this type of optical semiconductor device, the first
As shown in the figure, when attaching a stabilizing resistor to one of the square leads 2, 2 hanging from the encapsulating resin part 1 of the light emitting element, a solid resistor 3 in the form of a round bar is used, The lead-out wire-shaped terminals 4, 4 were soldered to the middle of one of the leads 2.

(Problems with the prior art) At that time, because there is a difference between the thickness of the square leads 2 and the thickness of the radius of the solid resistor 3,
Under normal conditions, the positions of the terminals 4 and 4 and the leads 2 do not match, so a special jig with a recess for housing the lower part of the solid resistor is required.
There was a problem that the soldering work was complicated.

(Technical problem of the invention) The purpose of this invention is to provide an optical semiconductor device in which a resistor can be connected extremely easily to the middle part of the square lead hanging from the encapsulating resin part of the light emitting element. There is something to do.

(Technical means) In order to achieve the above-mentioned object, this invention has wire-like terminals at both ends in the middle part of one of a pair of square leads hanging from the encapsulating resin part of the light emitting element. In this case, a chip resistor is connected.

Further, in this invention, a wide connecting portion is provided in the portion of the lead to which the chip resistor is connected.

(Example) According to the drawings, in FIGS. 2 and 3, the encapsulating resin part 5 in which a pellet-shaped light emitting element such as GaAs or GaP is encapsulated is electrically connected to the light emitting element. A pair of horn-shaped leads 6, 6
One of the leads 6 is integrally provided with a terminal 6a at its lower end, while the other lead 6 is cut above the terminal 6a, and between this cutting, both ends are A flat chip resistor 7 having no wire terminals is bonded to the resistor 7 using, for example, solder cream.

In addition to the flat rectangular chip resistors like those in the example, there are also round bar-shaped chip resistors, and since these round bar-shaped chip resistors do not have wire-shaped terminals at both ends, they can be used as leads. 6, 6 and can be soldered, and even this resistor can be soldered more easily than a conventional resistor having wire terminals at both ends.

Incidentally, on the side of the lead 6 to which the chip resistor 7 is to be bonded, connection portions 9, 9 are formed by widening the bonding portion.

Therefore, according to this invention, since the chip resistor 7 having no wire-like terminals at both ends is used,
It has good stability for adhering this to lead 6,
In addition, since no special jig is required to correct errors in resistance and lead thickness, soldering work is easy, and bonding costs and work time can be significantly reduced compared to conventional methods. It is something. This means that even if conventional solid solder is used instead of solder cream for bonding, there is a significant improvement in work efficiency compared to conventional methods.

It has also been found that if the ends of the leads 6 to which the chip resistor 7 is welded are formed wide and the connecting portions 9, 9 are provided, there is an advantage that the chip resistor 7 can be connected more easily.

Further, the same effect could be achieved by using solder paste or other suitable conductive adhesive instead of solder cream, and the work was extremely simple, especially when a conductive adhesive was used. Either metallic or non-metallic resistors can be used, but when soldering non-metallic resistors, the adhesive surface should be vapor-deposited or coated with a conductive metal such as silver. It is necessary to use something.

Furthermore, according to this invention, as shown in FIG. 4, the chip resistor 7 can be easily attached to one of the leads 6 before separating the leads 6, 6 from the lead frame 10, so this operation can be simplified. We also found that it is extremely easy to do this automatically.

At this time, the leads 6 to which the chip resistor 7 is connected may be punched out in advance by a press leaving only the required interval, or they may be punched out by the required interval when connecting the chip resistor 7. It is something.

(Effects) As explained in detail above, according to this invention, the work of connecting the resistors is extremely simple and easy, and no special jigs are required, thereby significantly reducing costs. In addition to being able to
The advantageous effect is that the resistance can be easily connected using an automatic machine.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing a conventional optical semiconductor device, Fig. 2 is a plan view showing an optical semiconductor device according to this invention, Fig. 3 is a perspective view of the same part, and Fig. 4 is a lead for implementing this invention. FIG. 3 is a plan view of the frame. 1... Encapsulated resin part, 2, 2, 6, 6... Lead, 3... Solid resistor, 7... Chip resistor,
9, 9...connection section, 10...lead frame.

Claims (1)

[Claims for Utility Model Registration] (1) A chip resistor that does not have wire-like terminals at both ends is connected to the middle part of one of a pair of square leads hanging from the encapsulating resin part of a light emitting element. An optical semiconductor device characterized by: (2) An optical semiconductor device characterized in that a wide connecting portion is provided in a portion of the lead to which the chip resistor is connected.