JPH0444377U - - Google Patents
Info
- Publication number
- JPH0444377U JPH0444377U JP8603290U JP8603290U JPH0444377U JP H0444377 U JPH0444377 U JP H0444377U JP 8603290 U JP8603290 U JP 8603290U JP 8603290 U JP8603290 U JP 8603290U JP H0444377 U JPH0444377 U JP H0444377U
- Authority
- JP
- Japan
- Prior art keywords
- voltage
- diaphragm
- reference voltage
- detection means
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 230000005856 abnormality Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8603290U JPH0444377U (ko) | 1990-08-15 | 1990-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8603290U JPH0444377U (ko) | 1990-08-15 | 1990-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444377U true JPH0444377U (ko) | 1992-04-15 |
Family
ID=31817478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8603290U Pending JPH0444377U (ko) | 1990-08-15 | 1990-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444377U (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011153351A (ja) * | 2010-01-27 | 2011-08-11 | Nitto Denko Corp | めっき装置およびめっき装置の配線検査方法 |
| JP2014129591A (ja) * | 2012-12-28 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | 電解メッキ装置 |
| WO2017212785A1 (ja) * | 2016-06-07 | 2017-12-14 | 株式会社荏原製作所 | めっき装置、めっき方法、及び記録媒体 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01297884A (ja) * | 1988-05-25 | 1989-11-30 | Permelec Electrode Ltd | プリント基板の銅メッキ方法 |
-
1990
- 1990-08-15 JP JP8603290U patent/JPH0444377U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01297884A (ja) * | 1988-05-25 | 1989-11-30 | Permelec Electrode Ltd | プリント基板の銅メッキ方法 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011153351A (ja) * | 2010-01-27 | 2011-08-11 | Nitto Denko Corp | めっき装置およびめっき装置の配線検査方法 |
| US8858773B2 (en) | 2010-01-27 | 2014-10-14 | Nitto Denko Corporation | Plating apparatus and wire inspection method of the same |
| JP2014129591A (ja) * | 2012-12-28 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | 電解メッキ装置 |
| WO2017212785A1 (ja) * | 2016-06-07 | 2017-12-14 | 株式会社荏原製作所 | めっき装置、めっき方法、及び記録媒体 |
| JP2017218625A (ja) * | 2016-06-07 | 2017-12-14 | 株式会社荏原製作所 | めっき装置、めっき方法、及び記録媒体 |
| US10633757B2 (en) | 2016-06-07 | 2020-04-28 | Ebara Corporation | Plating apparatus, plating method, and recording medium |