JPH0444377U - - Google Patents

Info

Publication number
JPH0444377U
JPH0444377U JP8603290U JP8603290U JPH0444377U JP H0444377 U JPH0444377 U JP H0444377U JP 8603290 U JP8603290 U JP 8603290U JP 8603290 U JP8603290 U JP 8603290U JP H0444377 U JPH0444377 U JP H0444377U
Authority
JP
Japan
Prior art keywords
voltage
diaphragm
reference voltage
detection means
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8603290U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8603290U priority Critical patent/JPH0444377U/ja
Publication of JPH0444377U publication Critical patent/JPH0444377U/ja
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す系統図、第2
図は陽極と隔膜とを一体化した変形例を示す図、
第3図、第4図は従来メツキ装置を示す図であつ
て第3図は溶解性陽極を用いた場合および第4図
は不溶解性陽極を用いた場合を示すものである。 1……メツキ槽、3……不溶解性陽極、5……
メツキ対象物(陰極)、7……隔膜、8……電源
装置、10……自動隔膜異常検出装置、11……
電圧検出手段、12……基準電圧設定手段、13
……信号発生手段、14……ブザー、15……記
録計。
Figure 1 is a system diagram showing one embodiment of the present invention;
The figure shows a modified example in which the anode and the diaphragm are integrated;
FIGS. 3 and 4 are views showing conventional plating equipment, with FIG. 3 showing the case using a soluble anode and FIG. 4 showing the case using an insoluble anode. 1... Plating tank, 3... Insoluble anode, 5...
Plating object (cathode), 7... diaphragm, 8... power supply device, 10... automatic diaphragm abnormality detection device, 11...
Voltage detection means, 12...Reference voltage setting means, 13
... Signal generating means, 14 ... Buzzer, 15 ... Recorder.

Claims (1)

【実用新案登録請求の範囲】 不溶解性陽極とメツキ対象物との間に隔膜を配
設したメツキ装置において、 前記不溶解性陽極とメツキ対象物との極間電圧
を直接または間接的に検出する電圧検出手段と、
基準電圧設定手段と、この基準電圧設定手段で設
定された基準電圧と電圧検出手段で検出した極間
電圧とを比較して前記隔膜等の異常検出信号を出
力する信号発生手段とからなる自動電圧異常検出
手段を設けたことを特徴とするメツキ装置。
[Claims for Utility Model Registration] In a plating device in which a diaphragm is provided between an insoluble anode and an object to be plated, the voltage between the electrodes of the insoluble anode and the object to be plated is directly or indirectly detected. a voltage detection means for
An automatic voltage generator comprising a reference voltage setting means, and a signal generating means for comparing the reference voltage set by the reference voltage setting means and the voltage between electrodes detected by the voltage detection means and outputting an abnormality detection signal for the diaphragm, etc. A plating device characterized by being provided with an abnormality detection means.
JP8603290U 1990-08-15 1990-08-15 Pending JPH0444377U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8603290U JPH0444377U (en) 1990-08-15 1990-08-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8603290U JPH0444377U (en) 1990-08-15 1990-08-15

Publications (1)

Publication Number Publication Date
JPH0444377U true JPH0444377U (en) 1992-04-15

Family

ID=31817478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8603290U Pending JPH0444377U (en) 1990-08-15 1990-08-15

Country Status (1)

Country Link
JP (1) JPH0444377U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011153351A (en) * 2010-01-27 2011-08-11 Nitto Denko Corp Plating apparatus and wire inspection method of the same
JP2014129591A (en) * 2012-12-28 2014-07-10 Samsung Electro-Mechanics Co Ltd Electrolytic plating device
JP2017218625A (en) * 2016-06-07 2017-12-14 株式会社荏原製作所 Plating apparatus, plating method, and recording medium

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297884A (en) * 1988-05-25 1989-11-30 Permelec Electrode Ltd Copper plating of printed board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297884A (en) * 1988-05-25 1989-11-30 Permelec Electrode Ltd Copper plating of printed board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011153351A (en) * 2010-01-27 2011-08-11 Nitto Denko Corp Plating apparatus and wire inspection method of the same
US8858773B2 (en) 2010-01-27 2014-10-14 Nitto Denko Corporation Plating apparatus and wire inspection method of the same
JP2014129591A (en) * 2012-12-28 2014-07-10 Samsung Electro-Mechanics Co Ltd Electrolytic plating device
JP2017218625A (en) * 2016-06-07 2017-12-14 株式会社荏原製作所 Plating apparatus, plating method, and recording medium
WO2017212785A1 (en) * 2016-06-07 2017-12-14 株式会社荏原製作所 Plating apparatus, plating method, and recording medium
US10633757B2 (en) 2016-06-07 2020-04-28 Ebara Corporation Plating apparatus, plating method, and recording medium

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