JPH0444377U - - Google Patents
Info
- Publication number
- JPH0444377U JPH0444377U JP8603290U JP8603290U JPH0444377U JP H0444377 U JPH0444377 U JP H0444377U JP 8603290 U JP8603290 U JP 8603290U JP 8603290 U JP8603290 U JP 8603290U JP H0444377 U JPH0444377 U JP H0444377U
- Authority
- JP
- Japan
- Prior art keywords
- voltage
- diaphragm
- reference voltage
- detection means
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 230000005856 abnormality Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第1図は本考案の一実施例を示す系統図、第2
図は陽極と隔膜とを一体化した変形例を示す図、
第3図、第4図は従来メツキ装置を示す図であつ
て第3図は溶解性陽極を用いた場合および第4図
は不溶解性陽極を用いた場合を示すものである。
1……メツキ槽、3……不溶解性陽極、5……
メツキ対象物(陰極)、7……隔膜、8……電源
装置、10……自動隔膜異常検出装置、11……
電圧検出手段、12……基準電圧設定手段、13
……信号発生手段、14……ブザー、15……記
録計。
Figure 1 is a system diagram showing one embodiment of the present invention;
The figure shows a modified example in which the anode and the diaphragm are integrated;
FIGS. 3 and 4 are views showing conventional plating equipment, with FIG. 3 showing the case using a soluble anode and FIG. 4 showing the case using an insoluble anode. 1... Plating tank, 3... Insoluble anode, 5...
Plating object (cathode), 7... diaphragm, 8... power supply device, 10... automatic diaphragm abnormality detection device, 11...
Voltage detection means, 12...Reference voltage setting means, 13
... Signal generating means, 14 ... Buzzer, 15 ... Recorder.
Claims (1)
設したメツキ装置において、 前記不溶解性陽極とメツキ対象物との極間電圧
を直接または間接的に検出する電圧検出手段と、
基準電圧設定手段と、この基準電圧設定手段で設
定された基準電圧と電圧検出手段で検出した極間
電圧とを比較して前記隔膜等の異常検出信号を出
力する信号発生手段とからなる自動電圧異常検出
手段を設けたことを特徴とするメツキ装置。[Claims for Utility Model Registration] In a plating device in which a diaphragm is provided between an insoluble anode and an object to be plated, the voltage between the electrodes of the insoluble anode and the object to be plated is directly or indirectly detected. a voltage detection means for
An automatic voltage generator comprising a reference voltage setting means, and a signal generating means for comparing the reference voltage set by the reference voltage setting means and the voltage between electrodes detected by the voltage detection means and outputting an abnormality detection signal for the diaphragm, etc. A plating device characterized by being provided with an abnormality detection means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8603290U JPH0444377U (en) | 1990-08-15 | 1990-08-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8603290U JPH0444377U (en) | 1990-08-15 | 1990-08-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0444377U true JPH0444377U (en) | 1992-04-15 |
Family
ID=31817478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8603290U Pending JPH0444377U (en) | 1990-08-15 | 1990-08-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0444377U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011153351A (en) * | 2010-01-27 | 2011-08-11 | Nitto Denko Corp | Plating apparatus and wire inspection method of the same |
JP2014129591A (en) * | 2012-12-28 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Electrolytic plating device |
JP2017218625A (en) * | 2016-06-07 | 2017-12-14 | 株式会社荏原製作所 | Plating apparatus, plating method, and recording medium |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01297884A (en) * | 1988-05-25 | 1989-11-30 | Permelec Electrode Ltd | Copper plating of printed board |
-
1990
- 1990-08-15 JP JP8603290U patent/JPH0444377U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01297884A (en) * | 1988-05-25 | 1989-11-30 | Permelec Electrode Ltd | Copper plating of printed board |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011153351A (en) * | 2010-01-27 | 2011-08-11 | Nitto Denko Corp | Plating apparatus and wire inspection method of the same |
US8858773B2 (en) | 2010-01-27 | 2014-10-14 | Nitto Denko Corporation | Plating apparatus and wire inspection method of the same |
JP2014129591A (en) * | 2012-12-28 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Electrolytic plating device |
JP2017218625A (en) * | 2016-06-07 | 2017-12-14 | 株式会社荏原製作所 | Plating apparatus, plating method, and recording medium |
WO2017212785A1 (en) * | 2016-06-07 | 2017-12-14 | 株式会社荏原製作所 | Plating apparatus, plating method, and recording medium |
US10633757B2 (en) | 2016-06-07 | 2020-04-28 | Ebara Corporation | Plating apparatus, plating method, and recording medium |