JPH0444373U - - Google Patents
Info
- Publication number
- JPH0444373U JPH0444373U JP8603590U JP8603590U JPH0444373U JP H0444373 U JPH0444373 U JP H0444373U JP 8603590 U JP8603590 U JP 8603590U JP 8603590 U JP8603590 U JP 8603590U JP H0444373 U JPH0444373 U JP H0444373U
- Authority
- JP
- Japan
- Prior art keywords
- anode
- plated
- frame body
- insoluble
- perforated plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8603590U JPH0444373U (de) | 1990-08-15 | 1990-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8603590U JPH0444373U (de) | 1990-08-15 | 1990-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444373U true JPH0444373U (de) | 1992-04-15 |
Family
ID=31817482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8603590U Pending JPH0444373U (de) | 1990-08-15 | 1990-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444373U (de) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009120939A (ja) * | 2007-11-14 | 2009-06-04 | Samsung Electro Mech Co Ltd | メッキ装置 |
| JP2013064202A (ja) * | 2007-12-04 | 2013-04-11 | Ebara Corp | めっき装置 |
| JP7233793B1 (ja) * | 2021-12-02 | 2023-03-07 | ディップソール株式会社 | 金属で物品を電気めっきする方法及びシステム |
| WO2023100381A1 (ja) * | 2021-12-02 | 2023-06-08 | ディップソール株式会社 | 金属で物品を電気めっきする方法及びシステム |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5633500A (en) * | 1979-08-28 | 1981-04-03 | Fujitsu Ltd | Averaging apparatus of distribution of plating electric current |
| JPS609973B2 (ja) * | 1976-01-30 | 1985-03-14 | ビルキントン・ブラザ−ス・リミテツド | ホトクロミツク硼珪酸塩ガラス |
| JPS63176500A (ja) * | 1987-01-16 | 1988-07-20 | Shinko Electric Ind Co Ltd | 電気めつき用遮蔽板 |
-
1990
- 1990-08-15 JP JP8603590U patent/JPH0444373U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS609973B2 (ja) * | 1976-01-30 | 1985-03-14 | ビルキントン・ブラザ−ス・リミテツド | ホトクロミツク硼珪酸塩ガラス |
| JPS5633500A (en) * | 1979-08-28 | 1981-04-03 | Fujitsu Ltd | Averaging apparatus of distribution of plating electric current |
| JPS63176500A (ja) * | 1987-01-16 | 1988-07-20 | Shinko Electric Ind Co Ltd | 電気めつき用遮蔽板 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009120939A (ja) * | 2007-11-14 | 2009-06-04 | Samsung Electro Mech Co Ltd | メッキ装置 |
| JP2013064202A (ja) * | 2007-12-04 | 2013-04-11 | Ebara Corp | めっき装置 |
| JP7233793B1 (ja) * | 2021-12-02 | 2023-03-07 | ディップソール株式会社 | 金属で物品を電気めっきする方法及びシステム |
| WO2023100381A1 (ja) * | 2021-12-02 | 2023-06-08 | ディップソール株式会社 | 金属で物品を電気めっきする方法及びシステム |