JPH0444171U - - Google Patents

Info

Publication number
JPH0444171U
JPH0444171U JP8677290U JP8677290U JPH0444171U JP H0444171 U JPH0444171 U JP H0444171U JP 8677290 U JP8677290 U JP 8677290U JP 8677290 U JP8677290 U JP 8677290U JP H0444171 U JPH0444171 U JP H0444171U
Authority
JP
Japan
Prior art keywords
lead
narrow
semiconductor device
wide
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8677290U
Other languages
English (en)
Japanese (ja)
Other versions
JP2512626Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990086772U priority Critical patent/JP2512626Y2/ja
Publication of JPH0444171U publication Critical patent/JPH0444171U/ja
Application granted granted Critical
Publication of JP2512626Y2 publication Critical patent/JP2512626Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1990086772U 1990-08-21 1990-08-21 樹脂封止形光半導体装置 Expired - Fee Related JP2512626Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990086772U JP2512626Y2 (ja) 1990-08-21 1990-08-21 樹脂封止形光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990086772U JP2512626Y2 (ja) 1990-08-21 1990-08-21 樹脂封止形光半導体装置

Publications (2)

Publication Number Publication Date
JPH0444171U true JPH0444171U (OSRAM) 1992-04-15
JP2512626Y2 JP2512626Y2 (ja) 1996-10-02

Family

ID=31818609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990086772U Expired - Fee Related JP2512626Y2 (ja) 1990-08-21 1990-08-21 樹脂封止形光半導体装置

Country Status (1)

Country Link
JP (1) JP2512626Y2 (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
WO2003049207A1 (en) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Light-emitting diode, led light, and light apparatus
JP2007019153A (ja) * 2005-07-06 2007-01-25 Citizen Electronics Co Ltd 光リンクデバイス
JP2011249433A (ja) * 2010-05-25 2011-12-08 Nichia Chem Ind Ltd 発光装置及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174871U (OSRAM) * 1980-05-26 1981-12-23
JPH0247070U (OSRAM) * 1988-09-28 1990-03-30

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174871U (OSRAM) * 1980-05-26 1981-12-23
JPH0247070U (OSRAM) * 1988-09-28 1990-03-30

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003049207A1 (en) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Light-emitting diode, led light, and light apparatus
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
JP2007019153A (ja) * 2005-07-06 2007-01-25 Citizen Electronics Co Ltd 光リンクデバイス
JP2011249433A (ja) * 2010-05-25 2011-12-08 Nichia Chem Ind Ltd 発光装置及びその製造方法

Also Published As

Publication number Publication date
JP2512626Y2 (ja) 1996-10-02

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees