JPH0443825Y2 - - Google Patents

Description

[Detailed description of the invention] (Industrial application field) This invention relates to an IC guide device.
The present invention relates to an IC guide device suitable for use in an automatic IC inspection device that automatically inspects the quality of IC elements at high speed.

(Prior Art) In recent years, the internal circuits of all electronic devices have been converted to ICs. The reason for this is that improvements in semiconductor technology have made it possible to supply high-performance ICs of uniform quality in large quantities. At the same time, it has become necessary for IC manufacturers to automatically identify these ICs, which are produced in large quantities, at high speed. Types of automatic determination include determination of pass/fail (GO/NOGO), performance rank, and the like. IC automatic inspection equipment is a device that automatically identifies ICs at high speed for this purpose.

ICs tested by such automatic IC testing equipment are
It has a dual inline package (DIP) shape as shown in Figure 6. That is, as shown in the figure, L-shaped terminal pins for signal input/output are attached to both ends of the IC element. In order to automatically identify ICs having such a shape at high speed using the IC automatic inspection apparatus shown in FIG. 5, a rail-shaped guide is required to quickly send the ICs one by one to the measuring section. FIG. 7 is a diagram showing an example of a conventional guide, and numeral 10 in the figure is a columnar IC guide. It is designed to slide on this guide in the direction of the arrow by external force or its own weight and to be sent to the measuring section.

Incidentally, IC elements are manufactured in various sizes. Currently, three types of ICs are being manufactured, in which the distance between opposing terminal pins of the IC element is 0.3 inches, 0.4 inches, and 0.6 inches. Therefore, if you use a guide rail as shown in the figure, it will be easier to inspect.
The guide rail must be replaced each time depending on the type of IC. Therefore, an IC guide rail was devised that did not require replacement each time the type of IC being inspected changed (publication number 768 of 1982).
FIG. 8 is a diagram showing the cross-sectional shape of the IC guide rail. It is clear from the figure that the guide rail body 1
By forming two grooves 12 and 13 on one surface of IC 1 and placing them as shown in FIG. 9 A to C according to the type of IC element, three types of IC elements IC ₁
~IC ₃ can now be applied to all.

(Problem to be solved by the invention) In the case of the guide rail shown in Figure 8, the IC to be inspected
There is no problem if the terminal pins of the device are aligned, but if the terminal pins are bent or the IC device is not placed on the guide correctly, the terminal pins may come into contact with the side wall ( (once) it quickly stops flowing. As shown in FIG. 9C, since the largest element IC ₃ straddles both sides of the guide rail main body 11, there is a certain restriction on the overall width a. Therefore, the distance b between the two grooves cannot be set so wide, and the terminal pin is likely to get stuck in the case shown in FIG. 9B. Therefore, if an attempt is made to increase the width b, it becomes impossible to increase the thickness of the first and third convex portions 14 and 16.

In addition, the IC element entrance at the end of the guide rail main body 11 is designed so that the IC element can be inserted smoothly.
Chamfering as shown in FIG. 10 is performed. Since the wall thickness of the convex portions 14 and 16 at both ends is small, the chamfer size cannot be increased. Therefore, if such chamfering is performed, alignment becomes difficult when connecting two or three guide rails vertically. Also, the 8th
In the case of the guide rail shown in the figure, two grooves 12, 1
Among the convex surfaces 14, 15, 16 divided into three parts by 3, the widths of 14, 16 on both sides are narrow, and the strength is weak, resulting in a problem of being easily bent by external force.

The present invention was developed in view of these points, and its purpose is to provide a strong IC guide device that can be quickly flowed even when the terminal pin of an IC element is bent. It is about realization.

(Means for Solving the Problems) The present invention to solve the above-mentioned problems is to form at least two grooves on one smooth surface of a columnar body of a predetermined length, and the first groove is The width of the groove is narrowed so that the terminal pin provided on one side of the IC can be inserted and its position controlled, and the second and subsequent grooves are narrowed so that the terminal pin provided on the other side of the IC can be inserted. The groove is characterized in that the width of the groove is wider than that of the first groove so as to absorb changes in the position of the terminal pin based on the difference in the facing distance between the grooves.

(Function) According to the present invention, at least two grooves having different widths are formed on one smooth surface of the guide rail body which is a columnar body.

(Embodiments) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the present invention. In the figure, 21 is a columnar guide rail body, and 22 and 23 are two grooves formed in one smooth surface of the guide rail body. First groove 2
2 is narrower than the width of the second groove 23. 24 to 26 are protrusions divided into three parts by these grooves, and protrusions 24a and 26a are formed at the tips of the first and third protrusions 24 and 26, respectively. IC ₁
IC 3 to IC ₃ are IC elements of different sizes placed on the guide rail. The device configured as described above will be explained as follows.

The first groove 22 is made sufficiently narrower in width than the second groove 23. Moreover, the upper end of the groove is connected to the second protrusion 25 and the protrusion 24a of the first protrusion 24.
The width is further narrowed. This allows the first
The groove 22 regulates the position of the IC element to be placed.
For example, IC elements IC ₁ with different dimensions as shown in the figure
Even if ~ ₃ ICs are mounted, one terminal pin of these IC elements will enter the first groove 22 and the pin positions will be aligned. That is, positioning can be performed using the first groove 22. Furthermore, the first groove 22 has a recess that is larger on the outside than on the inside. Generally IC
Since the terminal pins of the element expand outward, if the recesses on the outside of the groove are made large, the terminal pins will not catch on the inner wall of the groove and will be able to move smoothly.

The width of the second groove 23 is made large enough so that even if the other terminal pin of the IC elements IC ₁ and IC ₂ is inserted therein, the second groove 23 does not catch on the inner wall. That is, two types of
The width is sufficient to absorb changes in the position of the terminal pins due to differences in the facing distance between the terminal pins of the IC element. The other terminal pin of the largest IC element IC ₃ is exposed to the outside of the third convex portion 26 .

According to the present invention, since the first groove 22 is used for positioning, the width of the second groove 23 can be set to a size that takes into account variations in the terminal pins within a range where the pins do not get stuck. Further, since the thickness of the first convex portion 24 is not limited to the groove interval b, it can be set to any desired thickness. or. The thickness of the third convex portion 26 is also the maximum of the IC element.
It can be made thicker as long as the terminal pins of IC ₃ do not come in contact with each other. Therefore, unlike conventional devices, it does not bend even when subjected to external force, and its strength is improved.
Since the thickness of the protrusions 24 and 26 at both ends can be made large, the chamfering of the guide rail ends can be made large, making alignment easier even when connecting guide rails vertically, and reducing the chance of terminal pins getting stuck. .

FIG. 2 is a sectional view showing another embodiment of the present invention. In the embodiment shown in the figure, a depression 25a is provided in the center of the second convex portion 25 in the plane. By providing such a recess, the contact area with the bottom surface of the IC element is reduced, so that the IC element can be moved more smoothly. Furthermore, even if there is a protrusion or the like on the bottom surface of the IC element, the recess 25a allows the IC element to escape contact with the protrusion, allowing smooth movement. For the same reason, the third protrusion 26 can also be provided with a depression. This allows for maximum size IC elements.
IC ₃ moves smoothly.

FIG. 3 is a sectional view showing another embodiment of the present invention. In the embodiment shown in the figure, depressions are also provided on both sides of the second convex portion 25 so that even if the terminal pins of the IC element bend inward, they will not hit the inner wall. It is.

FIG. 4 is a sectional view showing an example of application of the present invention. In the application example shown in the figure, the second and third convex portions 25,
Heat generating elements 31 and 32 are embedded in the test tube 26 to heat the mounted IC element from the bottom, and the test is conducted under a predetermined operating temperature environment setting state.

In the above description, the case where two grooves are formed is taken as an example, but the number is not limited to two, and three or more grooves may be provided. However, it is necessary to use the outermost groove among these as a positioning groove. If three or more grooves are provided, it can be used not only for IC elements with the three types of dimensions mentioned above, but also for IC elements with larger dimensions that will be developed in the future, or IC elements with custom-made dimensions.
It can also be applied to IC elements.

Furthermore, in the above explanation, we have explained the case where a DIP type IC is guided as the IC to be tested, but the IC to be tested does not necessarily have to be limited to a DIP type. It can also be applied to other ICs. In this case, a groove for the SIP type IC guide may be formed in the second convex portion 25 of the IC guide device shown in FIG. 1, as shown in FIG. 5. In Figure 5, 40
is a SIP type IC, and 41 is a pin arranged inline. 25′a is formed on the second convex portion 25
The first groove 25'b is for the SIP type IC guide.
This is a second groove for guiding a pin formed at the bottom of the groove 25'a. By providing the groove in the second convex portion 25 in this way, it is possible to realize an IC guide device that can also guide a SIP type IC.

(Effects of the invention) As explained in detail above, according to the invention, at least two
The first groove has a narrow width for positioning, and the second and subsequent grooves are for absorbing changes in the position of the terminal pins due to differences in the opposing spacing of the terminal pins. By making the width of the groove wider than that of the first groove, it is possible to realize an IC guide device that can smoothly move different types of IC elements, which is extremely large in practical use.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention;
Figures 2 and 3 are cross-sectional diagrams showing other embodiments of the present invention, Figures 4 and 5 are cross-sectional diagrams showing application examples of the present invention, and Figure 6 is an example of the external configuration of an IC element. 7 is a diagram showing the moving state of the IC device, FIG. 8 is a diagram showing an example of a conventional device, FIG. 9 is a diagram showing the mounting state of the IC device, and FIG. 10 is a diagram showing the state of the guide rail.
FIG. 3 is a diagram showing chamfering of an IC element entrance portion. 10...IC guide, 11, 21...Guide rail body, 12, 13, 22, 23...Groove, 14
~16, 24~26...Convex portion, 24a, 26a...
...protrusion, 25a... recess, 25'a, 25'b...
Groove, 31, 32... heating element, 40... SIP type IC,
41...Pin, IC ₁ to _{IC 3} ...IC element.

Claims (1)

[Scope of utility model registration request] At least two smooth surfaces of a columnar body of a predetermined length.
The width of the first groove is narrow so that the terminal pin provided on one side of the IC can be inserted and its position can be controlled, and the second and subsequent grooves are formed on the other side of the IC. An IC guide device having a width wider than a first groove so as to absorb a change in the position of a terminal pin based on a difference in the facing interval of the terminal pins when the provided terminal pins are inserted.