JPH0443457U - - Google Patents

Info

Publication number
JPH0443457U
JPH0443457U JP8469090U JP8469090U JPH0443457U JP H0443457 U JPH0443457 U JP H0443457U JP 8469090 U JP8469090 U JP 8469090U JP 8469090 U JP8469090 U JP 8469090U JP H0443457 U JPH0443457 U JP H0443457U
Authority
JP
Japan
Prior art keywords
solder
tank
arm
liquid level
pumping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8469090U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8469090U priority Critical patent/JPH0443457U/ja
Publication of JPH0443457U publication Critical patent/JPH0443457U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Molten Solder (AREA)
JP8469090U 1990-08-10 1990-08-10 Pending JPH0443457U (US20100056889A1-20100304-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8469090U JPH0443457U (US20100056889A1-20100304-C00004.png) 1990-08-10 1990-08-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8469090U JPH0443457U (US20100056889A1-20100304-C00004.png) 1990-08-10 1990-08-10

Publications (1)

Publication Number Publication Date
JPH0443457U true JPH0443457U (US20100056889A1-20100304-C00004.png) 1992-04-13

Family

ID=31633330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8469090U Pending JPH0443457U (US20100056889A1-20100304-C00004.png) 1990-08-10 1990-08-10

Country Status (1)

Country Link
JP (1) JPH0443457U (US20100056889A1-20100304-C00004.png)

Similar Documents

Publication Publication Date Title
US6099681A (en) Mounting apparatus for mounting small balls and mounting method thereof
US5711473A (en) Inert atmosphere soldering apparatus
JPH0443457U (US20100056889A1-20100304-C00004.png)
JPH10209208A (ja) 半導体製造方法および装置
JPH0669285A (ja) フラックス供給装置
CN217728772U (zh) 一种托平翻转装置
JPS5851951A (ja) フラックス塗布方法およびその塗布装置
CN220880871U (zh) 一种电子滤波器浸锡装置
JPH0582976B2 (US20100056889A1-20100304-C00004.png)
CN220604637U (zh) 一种晶圆弹夹升降装置
CN215316190U (zh) 一种电子设备辅助焊接装置
CN216028632U (zh) 自动沾锡设备
JPS6339483B2 (US20100056889A1-20100304-C00004.png)
CN216325711U (zh) 一种沾锡装置
JPS6344144Y2 (US20100056889A1-20100304-C00004.png)
JPH0222147Y2 (US20100056889A1-20100304-C00004.png)
JP3341632B2 (ja) 導電性ボールの搭載装置
JPH0481270A (ja) 半田ディップ装置
JPS6334790Y2 (US20100056889A1-20100304-C00004.png)
RU1646141C (ru) Способ пайки
JPS58131741A (ja) ペレットボンディング用フラックス付け装置
JPS5824460Y2 (ja) はんだ付け装置
JPS62188079U (US20100056889A1-20100304-C00004.png)
JPS5816943B2 (ja) 浸漬装置
CN113333901A (zh) 自动沾锡设备