JPH0442931Y2 - - Google Patents
Info
- Publication number
- JPH0442931Y2 JPH0442931Y2 JP11923386U JP11923386U JPH0442931Y2 JP H0442931 Y2 JPH0442931 Y2 JP H0442931Y2 JP 11923386 U JP11923386 U JP 11923386U JP 11923386 U JP11923386 U JP 11923386U JP H0442931 Y2 JPH0442931 Y2 JP H0442931Y2
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- cooling
- lsi
- circuit board
- reservoir
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003507 refrigerant Substances 0.000 claims description 36
- 238000001816 cooling Methods 0.000 claims description 33
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000002826 coolant Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 2
- 238000009835 boiling Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11923386U JPH0442931Y2 (zh) | 1986-08-02 | 1986-08-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11923386U JPH0442931Y2 (zh) | 1986-08-02 | 1986-08-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6327052U JPS6327052U (zh) | 1988-02-22 |
| JPH0442931Y2 true JPH0442931Y2 (zh) | 1992-10-12 |
Family
ID=31006408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11923386U Expired JPH0442931Y2 (zh) | 1986-08-02 | 1986-08-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442931Y2 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010204A (ja) * | 2008-06-24 | 2010-01-14 | Toyota Industries Corp | 沸騰冷却装置 |
| JP5874935B2 (ja) * | 2011-05-20 | 2016-03-02 | 日本電気株式会社 | 平板型冷却装置及びその使用方法 |
| WO2018179162A1 (ja) * | 2017-03-29 | 2018-10-04 | 日本電気株式会社 | 冷却装置 |
-
1986
- 1986-08-02 JP JP11923386U patent/JPH0442931Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6327052U (zh) | 1988-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW495660B (en) | Micro cooling device | |
| US8490418B2 (en) | Method and apparatus for cooling electronics with a coolant at a subambient pressure | |
| EP0251836B1 (en) | Integral heat pipe module | |
| US20130139998A1 (en) | Cooling system, electronic equipment, and method for cooling heating element | |
| JP2007533944A (ja) | コンピュータおよび他の電子機器用の熱サイフォンベースの薄型冷却システム | |
| US20080236795A1 (en) | Low-profile heat-spreading liquid chamber using boiling | |
| JP6833012B2 (ja) | 電子デバイスに埋め込まれた多相熱放散デバイス | |
| JPH04233259A (ja) | 熱除去装置 | |
| US20050121180A1 (en) | Use of graphite foam materials in pumped liquid, two phase cooling, cold plates | |
| JP2008227150A (ja) | 電子機器 | |
| JP2007010211A (ja) | 電子機器の冷却装置 | |
| KR20020093897A (ko) | 마이크로 열 교환기를 장착한 파워 전자 장치의 부품냉각을 위한 냉각장치 | |
| CN114003111A (zh) | 一种用于计算机芯片的散热设备 | |
| JPH0442931Y2 (zh) | ||
| JPH02114597A (ja) | 電子素子の冷却方法 | |
| US9763359B2 (en) | Heat pipe with near-azeotropic binary fluid | |
| JPH04147657A (ja) | 電子部品冷却機構 | |
| JPS6285449A (ja) | 半導体装置の冷却構造 | |
| JPH0320070B2 (zh) | ||
| JPH10227585A (ja) | ヒートスプレッダとそれを用いた冷却器 | |
| JPH0632409B2 (ja) | 電子素子の冷却装置 | |
| JP5860728B2 (ja) | 電子機器の冷却システム | |
| JPS59232448A (ja) | 液冷容器 | |
| JP2746938B2 (ja) | 電源回路基板用冷却装置 | |
| CN216566086U (zh) | 液冷散热装置、液冷散热系统及电子装置 |