JPH0442931Y2 - - Google Patents
Info
- Publication number
- JPH0442931Y2 JPH0442931Y2 JP11923386U JP11923386U JPH0442931Y2 JP H0442931 Y2 JPH0442931 Y2 JP H0442931Y2 JP 11923386 U JP11923386 U JP 11923386U JP 11923386 U JP11923386 U JP 11923386U JP H0442931 Y2 JPH0442931 Y2 JP H0442931Y2
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- cooling
- lsi
- circuit board
- reservoir
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003507 refrigerant Substances 0.000 claims description 36
- 238000001816 cooling Methods 0.000 claims description 33
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000002826 coolant Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 2
- 238000009835 boiling Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11923386U JPH0442931Y2 (US06168776-20010102-C00028.png) | 1986-08-02 | 1986-08-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11923386U JPH0442931Y2 (US06168776-20010102-C00028.png) | 1986-08-02 | 1986-08-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6327052U JPS6327052U (US06168776-20010102-C00028.png) | 1988-02-22 |
| JPH0442931Y2 true JPH0442931Y2 (US06168776-20010102-C00028.png) | 1992-10-12 |
Family
ID=31006408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11923386U Expired JPH0442931Y2 (US06168776-20010102-C00028.png) | 1986-08-02 | 1986-08-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442931Y2 (US06168776-20010102-C00028.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010204A (ja) * | 2008-06-24 | 2010-01-14 | Toyota Industries Corp | 沸騰冷却装置 |
| JP5874935B2 (ja) * | 2011-05-20 | 2016-03-02 | 日本電気株式会社 | 平板型冷却装置及びその使用方法 |
| WO2018179162A1 (ja) * | 2017-03-29 | 2018-10-04 | 日本電気株式会社 | 冷却装置 |
-
1986
- 1986-08-02 JP JP11923386U patent/JPH0442931Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6327052U (US06168776-20010102-C00028.png) | 1988-02-22 |
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