JPH0442925Y2 - - Google Patents
Info
- Publication number
- JPH0442925Y2 JPH0442925Y2 JP1986161236U JP16123686U JPH0442925Y2 JP H0442925 Y2 JPH0442925 Y2 JP H0442925Y2 JP 1986161236 U JP1986161236 U JP 1986161236U JP 16123686 U JP16123686 U JP 16123686U JP H0442925 Y2 JPH0442925 Y2 JP H0442925Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat spreader
- pattern
- transistor
- semiconductor device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986161236U JPH0442925Y2 (US06521211-20030218-C00004.png) | 1986-10-21 | 1986-10-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986161236U JPH0442925Y2 (US06521211-20030218-C00004.png) | 1986-10-21 | 1986-10-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6367255U JPS6367255U (US06521211-20030218-C00004.png) | 1988-05-06 |
JPH0442925Y2 true JPH0442925Y2 (US06521211-20030218-C00004.png) | 1992-10-12 |
Family
ID=31087359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986161236U Expired JPH0442925Y2 (US06521211-20030218-C00004.png) | 1986-10-21 | 1986-10-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0442925Y2 (US06521211-20030218-C00004.png) |
-
1986
- 1986-10-21 JP JP1986161236U patent/JPH0442925Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6367255U (US06521211-20030218-C00004.png) | 1988-05-06 |