JPH0442909Y2 - - Google Patents
Info
- Publication number
- JPH0442909Y2 JPH0442909Y2 JP1984046455U JP4645584U JPH0442909Y2 JP H0442909 Y2 JPH0442909 Y2 JP H0442909Y2 JP 1984046455 U JP1984046455 U JP 1984046455U JP 4645584 U JP4645584 U JP 4645584U JP H0442909 Y2 JPH0442909 Y2 JP H0442909Y2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- liquid supply
- filter
- nozzle
- supply means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 104
- 239000000758 substrate Substances 0.000 claims description 21
- 230000002265 prevention Effects 0.000 claims description 10
- 238000004381 surface treatment Methods 0.000 claims description 10
- 244000208734 Pisonia aculeata Species 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 5
- 239000011882 ultra-fine particle Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000011814 protection agent Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Photographic Processing Devices Using Wet Methods (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、例えばフオトレジスト液や、表面保
護剤などの表面処理液を濾過した後、半導体基板
の表面に供給する装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an apparatus for filtering a surface treatment liquid such as a photoresist liquid or a surface protection agent, and then supplying the filtered liquid to the surface of a semiconductor substrate.
半導体基板やフオトマスク基板の表面処理工程
においては、スピンナー塗布機の回転台上に載置
した基板に対し、表面処理液を滴下して基板の表
面処理を行うが、かかる表面処理に際し、所定量
の処理液を完全に滴下した後に、回転台を回転さ
せるようにしなければ基板上の膜厚が変動した
り、回転途中で処理液が滴すると塗布ムラが生じ
る、という問題がある。かかる問題を解消するた
め、表面処理液を所定量滴下し、回転台を回転し
始めると、その表面処理液が再度滴下するのを防
止する装置が知られている。
In the surface treatment process of semiconductor substrates and photomask substrates, a surface treatment liquid is dropped onto the substrate placed on the rotary table of a spinner coating machine to treat the surface of the substrate. If the rotating table is not rotated after the processing liquid is completely dropped, there is a problem that the film thickness on the substrate will change, and if the processing liquid is dropped during rotation, uneven coating will occur. In order to solve this problem, an apparatus is known that prevents the surface treatment liquid from dropping again when a predetermined amount of the surface treatment liquid is dropped and the turntable starts rotating.
一方、近年、半導体基板のパターンが高密度化
したため、基板の表面処理に際して、処理液中の
微細な異物（例えば、0.5μ径前後のゴミ）の存在
が問題となつている。 On the other hand, in recent years, as semiconductor substrate patterns have become denser, the presence of fine foreign matter (for example, dust with a diameter of about 0.5 μm) in the processing solution has become a problem when processing the surface of the substrate.
かかる問題を解決するため、前述の再度滴下を
防ぐ装置に、濾過器を付設した装置が実開昭58−
98641号公報としてすでに提案されている。当該
装置は、濾過器を迂回した逆流専用のバイパス管
を設け、ノズル内に残留した処理液を吸戻し機能
を備えた液供給ポンプにより、引き戻す装置であ
るが、かかる装置の場合、ノズルと液供給ポンプ
との間にバイパス管を設けたことにより、液供給
ポンプと濾過器との間に逆流防止弁（同公報中、
符号17）を介在させることとなり、したがつて、
濾過器の入口側に残留している処理液の圧力を低
下できず、処理液の供給を停止してノズルの配管
内の処理液を、前記液供給ポンプの吸戻しにより
一定量引き戻した後でも、濾過器入口側の残留液
の圧力で、処理液は、徐々に濾過器出口側へ流出
し、ついにはノズルから滴下するという不都合が
ある。殊に、最近濾過器は超微粒子を濾過する構
造となり、かつ、処理液の粘度は高く、その上、
かかる装置の場合、バイパスと液供給ポンプとの
間には流量調節ネジ（同公報中、符号24）で引戻
し量を微量に制限していることから、濾過器近傍
（たとえ、出口側でも）の残留液の圧力は低下せ
ず（仮に、液供給ポンプで濾過器入口側の残留液
をバイパスを介して引戻ししようとしても、ノズ
ルから空気が逆流し、濾過器入口側は依然とし
て、圧力低下はしない。）、この残留液が徐々に流
出し、ついにはノズルから滴下するのである。 In order to solve this problem, a device was developed in 1982 that added a filter to the device to prevent dripping again.
It has already been proposed as Publication No. 98641. This device is equipped with a bypass pipe dedicated to backflow that bypasses the filter, and uses a liquid supply pump with a suction function to pull back the processing liquid remaining in the nozzle. By providing a bypass pipe between the supply pump and the liquid supply pump, a backflow prevention valve (in the same publication) is installed between the liquid supply pump and the filter.
17), and therefore,
Even after the pressure of the processing liquid remaining on the inlet side of the filter cannot be lowered and the supply of processing liquid is stopped and a certain amount of processing liquid in the nozzle piping is pulled back by suction by the liquid supply pump. Due to the pressure of the residual liquid on the filter inlet side, the treated liquid gradually flows out to the filter outlet side and finally drips from the nozzle. In particular, recently, filters have been designed to filter ultrafine particles, and the viscosity of the processing liquid is high.
In the case of such a device, the amount of pullback is limited to a very small amount by a flow rate adjustment screw (number 24 in the same publication) between the bypass and the liquid supply pump, so that The pressure of the residual liquid does not drop (even if the liquid supply pump tries to pull back the residual liquid on the filter inlet side via the bypass, air will flow back from the nozzle and the pressure will still not drop on the filter inlet side) ), this residual liquid gradually flows out and eventually drips from the nozzle.
本考案は、かかる従来装置における不都合を全
面的に解消しようとするもので、その要旨とする
ところは、高粘度の処理液が貯留された液貯留槽
１に、第１の逆流防止手段１３、吸戻し機能を備
えた液供給手段１４、および濾過器７が付設され
た配管５，５′を接続し、前記液供給手段１４に
より所定量の処理液を被処理基板１０上に、該被
処理基板１０に臨設したノズル９を介して供給す
る基板表面処理液供給装置において、前記液供給
手段１４とノズル９との間に、超微粒子を濾過す
るための濾過器７、該濾過器７から出た処理液が
液供給手段１４の方向へ逆流するのを防止する第
２の逆流防止手段１５、および前記液供給手段１
４に比べ微小容量の残留液引戻し手段８をそれぞ
れ付設し、前記液供給手段１４からノズル９まで
の間を、これらの濾過器７、第２の逆流防止手段
１５、および残留液引戻し手段８の当該順序で、
単一の配管５′にて直列状に接続したことを特徴
とする、基板表面処理液供給装置にある。
The present invention attempts to completely eliminate the inconveniences in the conventional apparatus, and its gist is that a first backflow prevention means 13, A liquid supply means 14 having a suction-back function and pipes 5 and 5' equipped with a filter 7 are connected, and the liquid supply means 14 supplies a predetermined amount of processing liquid onto the substrate 10 to be processed. In the substrate surface treatment liquid supply device which supplies the liquid through a nozzle 9 provided on the substrate 10, a filter 7 for filtering ultrafine particles is provided between the liquid supply means 14 and the nozzle 9; a second backflow prevention means 15 that prevents the processing liquid from flowing back in the direction of the liquid supply means 14; and the liquid supply means 1.
A residual liquid pull-back means 8 having a minute capacity compared to the filter 7, the second backflow prevention means 15, and the residual liquid pull-back means 8 is provided between the liquid supply means 14 and the nozzle 9. In that order,
The substrate surface treatment liquid supply apparatus is characterized in that the substrate surface treatment liquid supply apparatus is connected in series through a single pipe 5'.
本考案の構成を添付図面に示す実施例にもとづ
いて詳細に説明する。
The configuration of the present invention will be described in detail based on embodiments shown in the accompanying drawings.
第１図は本実施例の系統図を示すもので、液貯
留槽１に貯留された処理液２は、スピンナー１１
上に載置された被処理基板１０の表面にノズル９
によつて供給される。この処理液２の供給手段と
しては、往復動ポンプ１４を使用し、このポンプ
１４の吐出側に濾過器７および残留液引戻しポン
プ８を設けている。 FIG. 1 shows a system diagram of this embodiment, in which the processing liquid 2 stored in the liquid storage tank 1 is transferred to the spinner 11.
A nozzle 9 is attached to the surface of the substrate 10 to be processed placed on the substrate 10 to be processed.
Powered by. As a means for supplying the processing liquid 2, a reciprocating pump 14 is used, and a filter 7 and a residual liquid return pump 8 are provided on the discharge side of the pump 14.
往復動ポンプ１４は、ベローズ型またはダイヤ
フラム型等のポンプとし、その吸込側に逆止弁１
３を、吐出側に設けた限外濾過器（ウルトラフイ
ルター）７の出口側に逆止弁１５をそれぞれ介在
している。そして、この往復動ポンプ１４の駆動
は、エア圧力の作用で往復動するピストン１７に
より行われる。なお、図中の１６，１６′はエア
供給用の配管を示し、その供給に対する開閉は図
示しないが自動弁による。 The reciprocating pump 14 is a bellows type or diaphragm type pump, and has a check valve 1 on its suction side.
A check valve 15 is interposed on the outlet side of an ultrafilter 7 provided on the discharge side. The reciprocating pump 14 is driven by a piston 17 that reciprocates under the action of air pressure. Note that 16 and 16' in the figure indicate piping for supplying air, and the opening and closing of the supply is performed by automatic valves (not shown).
残留液引戻しポンプ８は、前記往復動ポンプ１
４と同様のポンプでもよいが、図示のものは、ダ
イヤフラム１９をピストン１８で往復動させ、ノ
ズル９内の残留液を一定量引き戻すようになつて
いる。なお、図中の１２，１２′はエア供給用の
配管を示す。 The residual liquid pull back pump 8 is connected to the reciprocating pump 1.
Although a pump similar to Nozzle 4 may be used, the one shown in the drawing is designed to reciprocate a diaphragm 19 with a piston 18 to draw back a fixed amount of the liquid remaining in the nozzle 9. Note that 12 and 12' in the figure indicate air supply piping.
次に、その作用を説明する。残留液引戻しポン
プ８内のダイヤフラム１９は常時、第１図の点線
で示すように、ピストン１８で押しつけられてい
る。ここにおいて、ピストン１７を往復動させる
と、ベローズが伸縮し、液貯留槽１の処理液２は
ノズル９を経て、被処理基板１０上に供給され
る。所定量の処理液２が供給されると、ノズル９
より余分な残留液が被処理基板１０に再度滴下し
ないように、残留液引戻しポンプ８のピストン１
８および往復動ポンプ１４のピストン１７を略同
時に図示するごとくシリンダの左側に移動させ
て、残留液引戻しポンプ８のダイヤフラム１９を
図示の点線状の位置から実線の位置に移し、か
つ、往復動ポンプ１４を吸引状態とする。 Next, its effect will be explained. The diaphragm 19 in the residual liquid return pump 8 is always pressed against the piston 18, as shown by the dotted line in FIG. Here, when the piston 17 is reciprocated, the bellows expands and contracts, and the processing liquid 2 in the liquid storage tank 1 is supplied onto the substrate 10 to be processed through the nozzle 9. When a predetermined amount of processing liquid 2 is supplied, the nozzle 9
To prevent excess residual liquid from dripping onto the substrate 10 to be processed again, the piston 1 of the residual liquid return pump 8 is
8 and the piston 17 of the reciprocating pump 14 are moved to the left side of the cylinder as shown, and the diaphragm 19 of the residual liquid return pump 8 is moved from the dotted line position shown in the figure to the solid line position, and the reciprocating pump 14 is placed in a suction state.
一方、濾過器７は、例えば、0.2μ径以上のゴミ
を濾過するためのもので、しかも、濾過すべき処
理液２の粘度は一般的に高いので、この濾過器７
に処理液２を、特に急速に通過させるには、極め
て大きな抵抗を生じる。そのため、濾過器７の出
口側からノズル９間の配管５′の残留液を、残留
液引戻しポンプ８により一定量引き戻し、同時
に、往復動ポンプ１４により、濾過器７の入口側
から、液貯留槽１までの配管５内、および液貯留
槽１の処理液２を吸引した場合、残留液引戻しポ
ンプ８により残留液引き戻し量に比べ、往復動ポ
ンプ１４による吸引量がはるかに、大きいため
（例えば前者が１サイクルにつき２／1000c.c.、後
者が１サイクルにつき５c.c.）、残留液引戻しポン
プ８の作動により、濾過器７の入口側の処理液２
が、その出口側に流出することは阻止され、余分
な処理液２をノズル９から滴下することはない。 On the other hand, the filter 7 is for filtering out dust with a diameter of 0.2μ or more, and since the viscosity of the processing liquid 2 to be filtered is generally high, this filter 7
In order to allow the processing liquid 2 to pass particularly rapidly, an extremely large resistance is generated. Therefore, a certain amount of residual liquid in the pipe 5' between the outlet side of the filter 7 and the nozzle 9 is pulled back by the residual liquid pull-back pump 8, and at the same time, a certain amount of residual liquid is pulled back from the inlet side of the filter 7 by the reciprocating pump 14 into the liquid storage tank. 1 and the processing liquid 2 in the liquid storage tank 1, the suction amount by the reciprocating pump 14 is much larger than the amount of residual liquid pulled back by the residual liquid pull-back pump 8 (for example, the former is 2/1000 c.c. per cycle, and the latter is 5 c.c. per cycle), and the treated liquid 2 on the inlet side of the filter 7 is
However, the processing liquid 2 is prevented from flowing out to the outlet side, and the excess processing liquid 2 is not dropped from the nozzle 9.
本考案によれば、
吸戻し機能を備えた液供給手段１４からノズ
ル９に至る単一の配管５′に、濾過器７、第２
の逆流防止手段１５、および残留液引戻し手段
８をこの順序で設けたので、ノズル９に最も近
い残留液引戻し手段８によりノズル９の残留液
を直接、引戻すことができ、したがつて、確実
な引戻しができる。
According to the present invention, the filter 7 and the second
Since the backflow prevention means 15 and the residual liquid pulling back means 8 are provided in this order, the residual liquid in the nozzle 9 can be directly pulled back by the residual liquid pulling means 8 closest to the nozzle 9. Can be pulled back.
濾過器７の出口側も含め、その近傍の残留液
は、第２の逆流防止手段１５を付設したことに
より、吸戻し機能を備えた液供給手段１４によ
つてその残圧を低下させることができ、したが
つて、濾過器７における濾過抵抗のため高めら
れた濾過器７の入口側の残圧によつて残留液が
経時後に（スピンナー塗布中に）、徐々にノズ
ル９へ流出し再度ノズル９から滴下するという
ことは、防止できる。 The remaining liquid in the vicinity of the filter 7, including the outlet side, can be reduced in residual pressure by the liquid supply means 14 having a suction function by providing the second backflow prevention means 15. Therefore, due to the residual pressure on the inlet side of the filter 7 which has been increased due to the filtration resistance in the filter 7, the residual liquid gradually flows out to the nozzle 9 after a period of time (during spinner application) and is re-injected into the nozzle. Dripping from 9 can be prevented.
残留液引戻し手段８は、液供給手段１４に比
べ小容量としているので、残留液引戻し手段８
が動作する場合には、より以上の吸引力で液供
給手段１４が吸戻し作用をしていることから、
第２の逆流防止手段１５は閉塞し、残留液引戻
し手段８によりこれを超えて残留液を引戻すこ
とはなく、したがつて、残留液引戻し手段８
は、他の部分の残留液を引戻しせず、ノズル９
内の残留液のみを確実に引戻すことができる。 Since the residual liquid pulling means 8 has a smaller capacity than the liquid supplying means 14, the residual liquid pulling means 8 has a smaller capacity than the liquid supply means 14.
When the liquid supply means 14 operates, the liquid supply means 14 is suctioning back with a higher suction force.
The second backflow prevention means 15 is closed and the residual liquid is not pulled back beyond this by the residual liquid withdrawal means 8. Therefore, the residual liquid withdrawal means 8
The remaining liquid in other parts is not pulled back and the nozzle 9
Only the residual liquid inside can be reliably pulled back.
かなりの量の処理液がノズル９と液供給手段
１４との間に介在していて、液供給手段１４に
よる送液の遅延を生じさせる傾向にあるが、前
記によりノズル９内の残留液のみを引戻して
いるので、その引戻し作用や次回の送液の伝達
が迅速にできる。 Although a considerable amount of processing liquid is interposed between the nozzle 9 and the liquid supply means 14 and tends to cause a delay in liquid feeding by the liquid supply means 14, it is possible to remove only the residual liquid in the nozzle 9 as described above. Since it is pulled back, the pulling back action and the next liquid feeding can be transmitted quickly.
第１図は本考案の実施例の系統図である。
１……液貯留槽、２……処理液、５，５′……
配管、７……濾過器、８……残留液引戻しポン
プ、９……ノズル、１１……スピンナー、１４…
…往復動ポンプ。
FIG. 1 is a system diagram of an embodiment of the present invention. 1...Liquid storage tank, 2...Processing liquid, 5,5'...
Piping, 7... Filter, 8... Residual liquid pull back pump, 9... Nozzle, 11... Spinner, 14...
...reciprocating pump.
Claims (1)
１の逆流防止手段１３、吸戻し機能を備えた液供
給手段１４、および濾過器７が付設された配管
５，５′を接続し、前記液供給手段１４により所
定量の処理液を被処理基板１０上に、該被処理基
板１０に臨設したノズル９を介して供給する基板
表面処理液供給装置において、 前記液供給手段１４とノズル９との間に、超微
粒子を濾過するための濾過器７、該濾過器７から
出た処理液が液供給手段１４の方向へ逆流するの
を防止する第２の逆流防止手段１５、および前記
液供給手段１４に比べ微小容量の残留液引戻し手
段８をそれぞれ付設し、前記液供給手段１４から
ノズル９までの間を、これらの濾過器７、第２の
逆流防止手段１５、および残留液戻し手段８の当
該順序で、単一の配管５′にて直列状に接続した
ことを特徴とする、基板表面処理液供給装置。[Claims for Utility Model Registration] A first backflow prevention means 13, a liquid supply means 14 with a suction-back function, and a filter 7 are attached to a liquid storage tank 1 in which a high-viscosity processing liquid is stored. In a substrate surface treatment liquid supply device in which the pipes 5 and 5' are connected and the liquid supply means 14 supplies a predetermined amount of treatment liquid onto the substrate 10 to be processed through a nozzle 9 provided on the substrate 10 to be processed. , a filter 7 for filtering ultrafine particles is provided between the liquid supply means 14 and the nozzle 9, and a second filter for preventing the processing liquid discharged from the filter 7 from flowing back toward the liquid supply means 14. A backflow prevention means 15 and a residual liquid pullback means 8 having a minute capacity compared to the liquid supply means 14 are respectively attached, and these filters 7 and a second backflow are provided between the liquid supply means 14 and the nozzle 9. A substrate surface treatment liquid supply device characterized in that a prevention means 15 and a residual liquid return means 8 are connected in series in this order through a single pipe 5'.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4645584U JPS60158734U (en) | 1984-03-29 | 1984-03-29 | Substrate surface treatment liquid supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4645584U JPS60158734U (en) | 1984-03-29 | 1984-03-29 | Substrate surface treatment liquid supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60158734U JPS60158734U (en) | 1985-10-22 |
| JPH0442909Y2 true JPH0442909Y2 (en) | 1992-10-12 |
Family
ID=30560862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4645584U Granted JPS60158734U (en) | 1984-03-29 | 1984-03-29 | Substrate surface treatment liquid supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60158734U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0356040Y2 (en) * | 1987-01-30 | 1991-12-16 | ||
| JP2558490B2 (en) * | 1988-03-07 | 1996-11-27 | 東京エレクトロン株式会社 | Development device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5898641U (en) * | 1981-12-25 | 1983-07-05 | 凸版印刷株式会社 | resist supply device |
-
1984
- 1984-03-29 JP JP4645584U patent/JPS60158734U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60158734U (en) | 1985-10-22 |
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