JPH0442730U - - Google Patents

Info

Publication number
JPH0442730U
JPH0442730U JP1990083515U JP8351590U JPH0442730U JP H0442730 U JPH0442730 U JP H0442730U JP 1990083515 U JP1990083515 U JP 1990083515U JP 8351590 U JP8351590 U JP 8351590U JP H0442730 U JPH0442730 U JP H0442730U
Authority
JP
Japan
Prior art keywords
power semiconductor
die
bonded
semiconductor element
heat spreader
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990083515U
Other languages
English (en)
Japanese (ja)
Other versions
JP2505195Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990083515U priority Critical patent/JP2505195Y2/ja
Publication of JPH0442730U publication Critical patent/JPH0442730U/ja
Application granted granted Critical
Publication of JP2505195Y2 publication Critical patent/JP2505195Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
JP1990083515U 1990-08-06 1990-08-06 電力半導体装置 Expired - Fee Related JP2505195Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990083515U JP2505195Y2 (ja) 1990-08-06 1990-08-06 電力半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990083515U JP2505195Y2 (ja) 1990-08-06 1990-08-06 電力半導体装置

Publications (2)

Publication Number Publication Date
JPH0442730U true JPH0442730U (cg-RX-API-DMAC10.html) 1992-04-10
JP2505195Y2 JP2505195Y2 (ja) 1996-07-24

Family

ID=31631246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990083515U Expired - Fee Related JP2505195Y2 (ja) 1990-08-06 1990-08-06 電力半導体装置

Country Status (1)

Country Link
JP (1) JP2505195Y2 (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JP2505195Y2 (ja) 1996-07-24

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees