JPH0442135Y2 - - Google Patents

Description

[Detailed description of the invention] (Technical field to which the invention pertains) This invention particularly relates to a vertical line thermal head for performing thermal printing or thermal transfer printing by being sensitive to heat generated by a heating element of the head.

(Technical background of the invention and its problems) A conventional thermal head will be explained using drawings.

FIG. 3 shows a perspective view of a conventional vertical line thermal head.

As shown in Utility Model Publication No. 57-34049, the vertical line thermal head takes up less space in the paper feed direction than the flat head that preceded it, removing barriers to printer design. It has features that make it easy to apply to thermal transfer type, multi-head type, and flat plate-like hard objects to be printed. As shown in FIG. 3, its structure is such that a cylindrical insulating base 5 is placed on the tip of a flat supporting plate/external connection wiring board 8, and a heating element 6 is placed on the outer surface of the insulating base 5.
are arranged in a row, and electrode terminals 7 are arranged in a row sandwiching them. On the other hand, there is an external connection wiring section 10 on the surface of the support plate/external connection wiring board 8, and electrode terminals 9 are arranged in a row on the cylindrical insulating substrate 5 side of the external connection wiring section 10, each of which It is paired with the electrode terminal 7 of the cylindrical insulator 5. The electrode terminals 7 of the cylindrical insulating substrate 5 and the electrode terminals 9 of the supporting plate/external connection wiring board 8, which are each a pair, are connected by inter-terminal connection leads 11. However, although glass, ceramic, etc. have been considered for the cylindrical insulating substrate 5, when ceramic is used as the cylindrical insulating substrate 5, heat dissipation is too large, so there is a problem that a lot of energy is required for printing. It was hot. Therefore, what was actually used for the columnar insulating substrate 5 was glass.

For the above reasons, the glass round rod is used as the cylindrical insulating substrate 5.
It was used as. However, glass has the disadvantage that heat dissipation is too low, which tends to cause heat accumulation, and print quality deteriorates quickly due to heat accumulation, and in particular, it is difficult to respond to higher pixel densities and trackability during high-speed driving. was.

(Purpose of the invention) The object of this invention is to provide a vertical line thermal head in which the amount of heat dissipated by the vertical line thermal head is the most suitable for printing.

(Summary of the invention) The present invention, which was made to achieve the above object, is a thermal head in which a large number of heat generating elements are formed in a row in the axial direction on the surface of a cylindrical insulating base. The present invention relates to a thermal head in which the surface of a highly conductive ceramic substrate is coated with a heat insulating layer.

(Detailed Description of the Invention) Since the present invention can be implemented in various ways, the present invention will be described in detail using several embodiments with reference to the drawings.

Hereinafter, FIG. 1 shows a perspective view of the basic structure of the embodiment.

In the structure of the embodiment, a cylindrical insulating substrate 5 is placed on the tip of a flat support plate/external connection wiring board 8.
Heat generating elements 6 are arranged in rows on the outer surface side, and electrode terminals 7 are arranged in rows sandwiching the heat generating elements 6. On the other hand, there is an external connection wiring section 10 on the surface of the support plate/external connection wiring board 8, and electrode terminals 9 are arranged in a row on the side of the cylindrical insulating substrate 5 of the external connection wiring section 10. Electrode terminal 7 of insulating base 5
Paired with. The electrode terminals 7 of each cylindrical insulating substrate 5 are connected to the electrode terminals 9 of the supporting plate/external connection wiring board 8 forming a pair by inter-terminal connection leads 11. The cylindrical insulating base 5 is composed of a cylindrical ceramic base 5a serving as a core and a heat retaining layer 5b serving as an outer skin. In this case, the cylindrical ceramic base 5
A is an alumina round bar with a diameter of 3 to 5 mm, and the heat insulating layer 5b is a glass layer with a thickness of 30 to 50 μm.

Incidentally, the method for manufacturing the cylindrical insulating substrate 5 will be described. A glass paste without alkali additives is uniformly coated onto the cylindrical ceramic substrate 5a by a constant speed dipping and pulling method, followed by drying and firing.

FIG. 2 represents a perspective view of the embodiment.

The structure of the embodiment is based on the embodiment, and further includes thermally conductive connecting members 12 and 13. The thermally conductive connecting members 12, 13 are located on at least one side of the head. However, in this embodiment, there are thermally conductive connecting members 12, 13 at both ends. This has the effect of receiving and dissipating the heat of the cylindrical ceramic substrate 5a, and further transmitting the heat to the support plate/external connection wiring board 8, thereby effectively widening the heat dissipation area.

Incidentally, the formation of the thermally conductive connecting members 12 and 13 in manufacturing the embodiment may be performed almost at the final step of mounting, and does not impose any restrictions on the conventional process.
In this case, the thermally conductive connection members 12 and 13 are connected to the cylindrical ceramic base 5a and the support plate/external connection wiring board 8.
Examples of methods for attaching the material include adhesion using a highly heat-resistant adhesive, partial resin fixation, and pressure bonding by applying pressure from the outside.

In addition, in the embodiment of the present invention, the wiring board is installed at a specific part of the support plate, but the present invention is not limited to this.

In addition, it goes without saying that the present invention can be modified in various ways without departing from the gist of the present invention.

(Effects of the invention) With this invention, the amount of heat dissipated from the vertical line thermal head becomes the most suitable amount for printing, making it difficult to cause deterioration of printing quality, and enabling higher pixel density and faster driving. Become.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the basic structure of the present invention, FIG. 2 is a perspective view showing an embodiment of the present invention, and FIG. 3 is a perspective view showing a conventional embodiment. 5...Cylindrical insulating base, 5a...Cylindrical ceramic base, 5b...Heat retaining layer, 6...Heating element, 7
... Electrode terminal, 8 ... Support plate and external connection wiring board,
9... Electrode terminal, 10... External connection wiring section, 11
... Lead between terminals, 12, 13 ... Heat conductive connection member.

Claims (1)

[Scope of utility model registration request] In a vertical thermal head in which a large number of heating elements are formed in the axial direction on the surface of a cylindrical insulating base,
The cylindrical insulating substrate is characterized in that the surface of a highly thermally conductive ceramic substrate is coated with a heat insulating layer, and at least one side is provided with a thermally conductive connecting member connected to the ceramic substrate. thermal head.