JPH01249362A - Current supply type thermal transfer printing head - Google Patents
Current supply type thermal transfer printing headInfo
- Publication number
- JPH01249362A JPH01249362A JP7725388A JP7725388A JPH01249362A JP H01249362 A JPH01249362 A JP H01249362A JP 7725388 A JP7725388 A JP 7725388A JP 7725388 A JP7725388 A JP 7725388A JP H01249362 A JPH01249362 A JP H01249362A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- insulating substrate
- resistant
- resistant insulating
- thermal transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010023 transfer printing Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 16
- 229920001721 polyimide Polymers 0.000 claims abstract description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 230000003746 surface roughness Effects 0.000 abstract description 6
- 230000002411 adverse Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 2
- 239000009719 polyimide resin Substances 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000005361 soda-lime glass Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、通電熱転写プリントヘッドの構造に関Ｊ゛る
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the construction of electrically conductive thermal transfer printheads.
従来の通電熱転写プリントヘッドの構造は第３図、第４
図に示す様に、耐熱性絶縁基板として、アルミナ等のセ
ラミックやソーダライムガラス」二に直接薄膜電極を形
成するか、上記耐熱性絶縁基板上にガラス等のグレーズ
層を形成した後に薄膜電極を形成するというものであっ
た。The structure of a conventional electrical thermal transfer print head is shown in Figures 3 and 4.
As shown in the figure, as a heat-resistant insulating substrate, thin-film electrodes are formed directly on ceramics such as alumina or soda lime glass, or thin-film electrodes are formed after forming a glaze layer of glass or the like on the heat-resistant insulating substrate. The idea was to form.
しかし、従来のアルミナ等のセラミックの耐熱性絶縁基
板は、表面の面粗度が大きく、かつ、耐熱性絶縁基板の
そりの為に、耐熱性絶縁基板上に形成された電極と、イ
ンクフィルムとの接触面形伏がばらつき、画質にムラが
出る等の悪影フ１を与えていた。However, conventional heat-resistant insulating substrates made of ceramic such as alumina have large surface roughness, and due to warping of the heat-resistant insulating substrate, the electrodes formed on the heat-resistant insulating substrate and the ink film are The shape of the contact surface was uneven, giving negative effects such as uneven image quality.
又、アルミγ等のセラミックより、比較的面粗度の小さ
い、耐熱性絶縁基板上にガラス等のグレーズ層を形成し
たヘッドや、ソーダライムガラスを耐熱性絶縁基板とし
て使用したヘッドにおいても、耐熱性絶縁基板のそりの
影響は回連出来なかった。又、耐熱性絶縁基板の面粗度
やそりに関係無く、プリンタの記録紙の面粗度により、
画質にムラが出来るという問題点を有していた。Additionally, heads with a glaze layer of glass or other material formed on a heat-resistant insulating substrate, which has a relatively smaller surface roughness than ceramics such as aluminum γ, or heads that use soda lime glass as a heat-resistant insulating substrate, also have heat-resistant properties. The effects of warping of the insulating substrate could not be evaluated. Also, regardless of the surface roughness or warpage of the heat-resistant insulating substrate, depending on the surface roughness of the printer's recording paper,
This had the problem of uneven image quality.
上記問題点を解決する為に、本発明の通電熱転写プリン
トヘッドは、耐熱性絶縁基板−Ｌに耐熱性樹脂層を形成
しその上面に記録電極を形成した１にを特徴とする。In order to solve the above-mentioned problems, the current-carrying thermal transfer print head of the present invention is characterized in that a heat-resistant resin layer is formed on a heat-resistant insulating substrate-L, and recording electrodes are formed on the upper surface of the heat-resistant resin layer.
さらには、その耐熱性樹脂が、ポリイミドである事を特
徴とする。Furthermore, the heat-resistant resin is polyimide.
以下に、本発明に於ける実施例を図面にもとづいて説明
するが、本発明はこれに限定されるものではない。Embodiments of the present invention will be described below based on the drawings, but the present invention is not limited thereto.
第１図において、アルミナ等のセラミックや、ソーダラ
イムガラス等の耐熱性絶縁基板１の上に、液状ポリイミ
ド樹脂等の耐熱性樹脂を、スピナ一方式や、ロールコー
タ一方式、印刷方式等で塗布し、熱処理を加え、耐熱性
樹脂層２を形成する。その後、スパッタ、エツチング等
通常の８模形成工程もしくは印刷により記録１１！極３
を形成する。In Fig. 1, a heat-resistant resin such as liquid polyimide resin is applied onto a heat-resistant insulating substrate 1 made of ceramic such as alumina or soda lime glass using a spinner method, a roll coater method, a printing method, etc. Then, heat treatment is applied to form a heat-resistant resin layer 2. After that, recording 11! is performed using the usual 8 pattern forming processes such as sputtering and etching, or by printing. pole 3
form.
この時、耐熱性樹脂層２は、第２図に示す様に、感光性
耐熱性樹脂を用い、エツチングにより薄膜電極３の直下
のみに形成しても同等の効果が得られる。At this time, as shown in FIG. 2, the heat-resistant resin layer 2 may be formed using a photosensitive heat-resistant resin and formed only directly under the thin film electrode 3 by etching, and the same effect can be obtained.
上記製法により製造した通電熱転１１プリントヘツドは
、第３図、第４図に示した従来のヘッドと比較し、
■） 耐熱性樹脂８２は、耐熱性樹脂層（仮の面粗度を
低減する役割を果たず。Compared with the conventional head shown in FIGS. 3 and 4, the energized heat transfer 11 print head manufactured by the above manufacturing method has the following characteristics: It doesn't fulfill its role.
２） 耐熱性樹脂層２は、従来のグレーズ層４と比較し
非常に柔かい為、記録電極３が紙の凸凹や、耐熱性絶縁
ＩＮ板自体の持つそりう＝対してもなじろ易（電極とフ
ィルム、紙との密着性が良くなり、これらの要素が画質
に与える影響を低減する事が可能となる。2) Since the heat-resistant resin layer 2 is much softer than the conventional glaze layer 4, the recording electrode 3 easily bends against the unevenness of the paper and the warpage of the heat-resistant insulating IN board itself (the electrode and Adhesion to film and paper is improved, making it possible to reduce the influence of these factors on image quality.
又、通電熱転写プリンタは、ヘッド自体は発シ為しない
ので、電極直下に熱伝導性がガラス等と比較して劣る樹
脂を使用しても、熱履歴の影響は、無視出来る程小さな
ものである。In addition, since the head itself of an electric thermal transfer printer does not emit radiation, even if a resin whose thermal conductivity is inferior to that of glass or the like is used directly under the electrode, the effect of thermal history is negligible. .
本発明は、以上説明した様に、耐熱性絶縁基板と、記録
電極の間に耐熱性樹脂層を形成するという［ｍ甲なヘッ
ド構造によって、耐熱性絶縁基板の表面１１１度、うね
り、又は、紙の粗度が画質に与える悪影響を低減する事
が出来る。As explained above, the present invention has a head structure in which a heat-resistant resin layer is formed between a heat-resistant insulating substrate and a recording electrode. It is possible to reduce the adverse effect that paper roughness has on image quality.
第１図、第２図は、本発明の通電熱転写プリントヘッド
の構造を示す断面図。
第３図、第４図は、従来のヘッドの構造を示す図。
１・・耐熱性絶縁基板
２・・・耐熱性樹脂層
３・・・記録型ｌｉ
４・・・グレーズ層
以 上
、−〜３
第２図1 and 2 are cross-sectional views showing the structure of the electrically conductive thermal transfer print head of the present invention. FIGS. 3 and 4 are diagrams showing the structure of a conventional head. 1...Heat-resistant insulating substrate 2...Heat-resistant resin layer 3...Recording mold li 4...Glaze layer and above, -~3 Fig. 2
Claims (2)
て成る通電熱転写プリントヘッドに於て、前記耐熱性絶
縁基板と、記録電極の間に耐熱性樹脂層を形成した事を
特徴とする通電熱転写プリントヘッド。(1) A current-carrying thermal transfer printhead comprising at least a thin film electrode arranged on a heat-resistant insulating substrate, characterized in that a heat-resistant resin layer is formed between the heat-resistant insulating substrate and the recording electrode. Electric thermal transfer print head.
請求項１記載の通電熱転写プリントヘッド。(2) The electrically conductive thermal transfer print head according to claim 1, wherein the heat-resistant resin is polyimide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7725388A JPH01249362A (en) | 1988-03-30 | 1988-03-30 | Current supply type thermal transfer printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7725388A JPH01249362A (en) | 1988-03-30 | 1988-03-30 | Current supply type thermal transfer printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01249362A true JPH01249362A (en) | 1989-10-04 |
Family
ID=13628692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7725388A Pending JPH01249362A (en) | 1988-03-30 | 1988-03-30 | Current supply type thermal transfer printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01249362A (en) |
-
1988
- 1988-03-30 JP JP7725388A patent/JPH01249362A/en active Pending
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