JPH0441103Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a carrier for an IC package.

Prior Art As shown in U.S. Pat. No. 3,652,974 and U.S. Pat. No. 3,529,277, conventional IC carriers have a carrier main body formed of an integrally molded part, an IC housing window formed in the center, and an IC housing window formed around the IC housing window. An elastically displaceable locking pawl is integrally molded, and the IC package cage is fitted into the IC housing window while forcibly displacing the locking pawl, and the tip of the locking pawl is
The IC package is configured to be locked and held at the edge of the IC package, and when the IC package is taken out, the locking pawl is forcibly displaced outward again to release the locking of the tip.

Problems to be Solved by the Invention However, the IC carrier described above has a small fingertip that forcibly displaces the locking claw that captures the IC package cage to perform a locking/unlocking operation (inward/outward displacement operation), and it is difficult to handle thin small pieces. An IC package consisting of an IC
It takes a lot of effort to attach and detach from within the storage window, and there is a risk that the small tip of the locking pawl may be damaged during attachment and detachment, resulting in loss of holding function.

Therefore, in the present invention, the IC is
By stopping holding the package cage, and dividing the body of the IC carrier into two parts as described later, the two parts are connected by a telescopic spring consisting of a coil spring.
The IC storage space can be expanded or reduced freely.
To provide an IC carrier which allows the package cage to be easily attached and detached, and which allows the contraction force of the elastic spring to act in the direction of narrowing the interval between the IC housing parts to accurately hold the IC package. be. Therefore, the problems of the above-mentioned conventional example are effectively solved.

Means for Solving the Problems The present invention, as a means for solving the above-mentioned problems, divides the body of an IC carrier into two carrier forming bodies, and uses a coil spring that applies a tensile force in the direction of approach between both carrier forming bodies. By providing a guide member that guides the movement of both carrier forming bodies toward or away from each other, and moving both carrier forming bodies in the separating direction against the elastic spring material. The IC housing part formed between both bodies is enlarged to accommodate the IC package, and by moving in the approaching direction according to the elastic spring material, the IC housing part is contracted and placed between the two bodies.
It is configured to hold an IC package.

Function: The carrier forming body divided into two parts as described above moves in the direction of separation against the elasticity of the elastic spring member made of the coil spring, and moves in the direction of approach according to the same elasticity. At this time, the guide member guides the movement in the separating and approaching directions.

By moving both carrier forming bodies in the separating direction against the elastic spring material as described above, the IC accommodating part formed at the interval between both carrier forming bodies is expanded, and the IC package is accommodated in the IC accommodating part. .

Further, by moving both carrier forming bodies in the approaching direction according to the elastic spring members, the IC accommodating portion is reduced, and the IC package is elastically held between the two carrier forming bodies by the tensile force of the elastic spring members.

When taking out the IC package, both carrier forming bodies may be moved in the separating direction again against the elastic spring member.

Embodiments Hereinafter, the present invention will first be explained with reference to the embodiments shown in FIGS. 1 and 2A and 2B, and then with reference to other embodiments shown in FIGS. 3 and 4.

As mentioned above, the IC carrier consists of two carrier forming bodies 1A and 1B. The carrier forming bodies 1A and 1B are elastic spring materials S made of coil springs.
Connect at.

Both carrier forming bodies 1A and 1B move in the direction of separation by stretching the elastic spring material S against its elasticity, and by releasing the extension, contract by self-restoring force, causing both carrier forming bodies 1A and 1B to move apart. It moves in the approaching direction according to its elasticity.

In order to guide the linear movement in the separating and approaching directions, a guide member, for example a guide rod 3 as shown, connects the two carrier forming bodies. The guide rods 3 are arranged in parallel to both ends of the opposing surfaces of both carrier forming bodies 1A and 1B, and preferably, the above-mentioned elastic spring material S is suspended on each guide rod 3, and one end thereof is connected to one of the carrier forming bodies 1A. then connect the other end to the other carrier forming body.
Each is fixed to 1B.

Both carrier forming bodies 1A, 1B secure a linear movement trajectory by the guide rod 3, and in the linear movement trajectory, the expansion and contraction action of the elastic spring material S is applied to the carrier forming bodies 1A, 1B, so that the above-mentioned separation and approach are performed.

In order to set the maximum amount of movement of the carrier forming bodies 1A and 1B in the separating direction, that is, the maximum facing interval, and to prevent them from coming off the guide rod 3, the guide rod 3
Fix one end to one carrier forming body 1A,
Insert the other end into the other carrier forming body 1B,
Add a retaining means to the end. Also, both carrier forming bodies 1A and 1B are the spring force (tensile force) of the elastic spring material S.
The movement in the approaching direction due to the spring force is stopped at the position where S becomes zero, and beyond this point, by further compressing the elastic spring material S, it is possible to move closer. Therefore, both carrier forming bodies 1A and 1B maintain a constant distance in a steady state when the elastic spring member S is in the neutral position.

As an embodiment, in order to set the amount of movement of both carrier forming bodies 1A and 1B in the approaching direction, that is, the minimum facing distance, a stopper that abuts the carrier forming bodies is provided on the guide rod 3 and located at the same minimum facing distance. For example, make the guide rod 3 thicker at that part,
It is configured to abut against the edge of a guide hole provided in the carrier forming body.

Both carrier forming bodies 1A made as above,
The IC accommodating portions 7 are formed with a facing interval of 1B. The IC
When the carrier forming bodies 1A and 1B move in the separating direction against the elastic spring material S, the distance between the housing portions 7 is increased, and when the carrier forming bodies 1A and 1B move toward each other in the approaching direction according to the spring material S, the distance between them is reduced. . By increasing the interval between the IC housing parts 7, the IC package 5 can be accommodated as shown in FIG. 2A, and by decreasing the same interval, the second
The package 5 is held between opposing parts as shown in Figure B.

As mentioned above, the tensile force of the elastic spring material S acts in the direction in which both carrier forming bodies 1A and 1B approach each other,
In the holding state of the IC package 5, the tensile force of the elastic spring material S is applied to both carrier forming bodies 1A,
It acts on 1B and firmly holds and captures the IC package 5 between the bodies.

As a means to ensure the capture of the IC package 5, as shown in the drawing, the IC package 5 is
Each carrier forming body 1A forming the housing part 7,
An IC fitting part 9 into which both ends of the IC package 5 are fitted is defined in the opposing part of 1B, and the bottom wall of the IC fitting part 9 is used as an IC support wall 8 to support the bottom surface of the IC package 5. .

In order to prevent the IC package 5 from coming off, a locking pawl 4 that engages with the edge of the IC package 5 is provided at the opposing portions of both carrier forming bodies 1A, 1B.

The locking pawl 4 is directed toward and locked at the edge of the IC package 5 as both carrier forming bodies 1A, 1B move toward each other.

As an example, the above-mentioned both carrier forming bodies 1A,
An IC lead receiving groove 2 extending in the moving direction of the carrier forming bodies 1A and 1B is provided on the surface of the carrier forming body 1B, and an IC lead 6 protruding to the side of the IC package 5 housed in the IC housing part 7 is inserted into the receiving groove 2. The IC lead receiving groove 2 is configured to receive and protect the IC lead.
Using the partition wall 2a, the end portion of the partition wall 2a is made to protrude toward the IC accommodating portion 7, that is, the IC accommodating portion 9, to form the locking claw 4. It is sufficient that the locking pawl 4 is locked at a key point on the IC package 5, and it may be provided on a part of the partition wall 2a.

As the carrier forming bodies 1A and 1B approach, the locking pawl 4 is directed toward the edge of the IC package 5 and locks therein, so its length can be ensured sufficiently to prevent the IC package from locking. Make it more reliable.

FIGS. 3 and 4 show other examples, and show an IC carrier that can carry two IC packages 5 by adopting the above configuration.

That is, the carrier forming bodies 1A and 1B, which are divided into two parts as described above, are connected by a telescopic spring material S, and are also connected by a guide rod 3, and under the guide of the guide rod 3, resist the elasticity of the telescopic spring material S. The carrier forming bodies 1A, 1B are provided with IC housing portions 7 on the upper surface side and the lower surface side of the gap between the two carrier forming bodies 1A, 1B.
IC lead receiving grooves 2 are formed on the upper and lower surfaces of the carrier forming bodies 1A and 1B, respectively, and an IC support wall 8 for supporting the bottom surface of the IC package 5 is provided in the center of the opposing parts of both carrier forming bodies 1A and 1B. IC fitting portions 9 into which both ends of the IC fitting portions 9 are fitted are provided on the top and bottom of each IC support wall 8, respectively, and the partition wall 2 of the IC lead receiving groove 2 is provided.
As shown in FIG. 4, the structure in which the locking pawl 4 protrudes from the IC package 5 is accommodated from the top and bottom sides of the carrier forming bodies 1A and 1B so that the IC package 5 can be captured in two stages. be.

Effects of the Invention As explained above, the present invention expands both carrier forming bodies against the elasticity of the telescopic spring material made of coil springs, moves both carrier forming bodies in the direction of separation, and expands the interval between the IC accommodating parts. This allows the IC package cage to be easily inserted and removed, and also allows both carrier forming bodies to move toward each other by themselves using the contraction force according to the elasticity of the elastic spring material, thereby reducing the interval between the IC housing parts. The IC package can be held, and the IC package can be inserted and removed and held very easily.

In addition, by applying the tensile force of the elastic spring material in the direction in which the two carrier forming bodies approach each other, that is, in the direction of narrowing the interval between the IC accommodating portions, the IC package can be firmly held and captured between the two carrier forming bodies.

By moving the two carrier forming bodies apart and toward each other, the area of the IC accommodating part can be changed and the IC package cage can be inserted and removed, similar to the case where the IC package cage is accommodated and captured in a conventional fixed IC accommodating part. This can be carried out without employing a mechanism for forcibly elastically displacing the locking pawl to engage and disengage it, effectively avoiding problems such as damage to the toe, and eliminating inconveniences such as opening and closing operations of the locking pawl.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an IC carrier showing an embodiment of the present invention, Fig. 2 A is a plan view of the IC carrier when it is expanded, Fig. B is a plan view of the IC carrier when it is reduced, and Fig. 3 shows another example. A perspective view of the IC carrier, and FIG. 4 is a sectional view thereof. 1A, 1B...Carrier forming body, 3...Guide rod, 5...IC package cage, 7...IC housing section, S
...Extensible spring material.

Claims (1)

[Scope of utility model registration request] The two carrier forming bodies are connected by an elastic spring member made of a coil spring, and both carrier forming bodies are moved apart by stretching against the elasticity of the elastic spring member, and contract according to the elasticity of the elastic spring member. At the same time as moving toward the approaching direction,
A guide member is provided between the two carrier forming bodies to guide the separation and approach movement, and at the opposing interval of the two carrier forming bodies, the gap is expanded by movement in the separating direction against the elastic spring member, and the IC package The interval is reduced by allowing the IC to fit together, and moving in the approaching direction according to the above-mentioned elastic spring material.
An IC carrier characterized by forming an IC housing part that holds a package.