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Priority to JP1990042672UpriorityCriticalpatent/JPH0616905Y2/ja
Publication of JPH044036UpublicationCriticalpatent/JPH044036U/ja
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Publication of JPH0616905Y2publicationCriticalpatent/JPH0616905Y2/ja
Method of moulding heat-expandable thermoplastic polymeric resinous granules involving enhanced distribution of the hot gaseous medium in the mold cavity