JPH0439813A - Inner layer conductor paste for low temperature baked multiple layer substrate - Google Patents
Inner layer conductor paste for low temperature baked multiple layer substrateInfo
- Publication number
- JPH0439813A JPH0439813A JP14709390A JP14709390A JPH0439813A JP H0439813 A JPH0439813 A JP H0439813A JP 14709390 A JP14709390 A JP 14709390A JP 14709390 A JP14709390 A JP 14709390A JP H0439813 A JPH0439813 A JP H0439813A
- Authority
- JP
- Japan
- Prior art keywords
- glass powder
- pts
- conductor paste
- delamination
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 title abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 25
- 239000011521 glass Substances 0.000 claims abstract description 23
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000010304 firing Methods 0.000 claims description 7
- 230000032798 delamination Effects 0.000 abstract description 16
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 230000001939 inductive effect Effects 0.000 abstract 1
- 238000005245 sintering Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、低温焼成多層基板用の内層導体ペーストに関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an inner layer conductor paste for a low temperature fired multilayer board.
従来の多層Ｍ板はグリーンシート上にＭｏやＷ等の導体
ペーストを印刷して乾燥し、このようなグリーンシート
を多数積層して加熱圧着した後、焼成するものである。A conventional multilayer M board is produced by printing a conductive paste such as Mo or W on a green sheet, drying it, stacking a large number of such green sheets, heat-pressing them, and then firing them.
このグリーンシートとしては、主成分をアルミナ粉末と
し、焼結助剤としてＹ２Ｏ３を２〜３％含み、その他の
配合剤を所定量配合したものが用いられ、その焼成温度
は１３００〜１６００℃が一般的であった。This green sheet is made of alumina powder as the main component, contains 2 to 3% Y2O3 as a sintering aid, and contains a predetermined amount of other additives, and the firing temperature is generally 1300 to 1600°C. It was a target.
しかし、近年８００〜１０００℃の低温で焼成可能なグ
リーンシートが開発され、それに適合する導体ペースト
が求められている。However, in recent years, green sheets that can be fired at low temperatures of 800 to 1000° C. have been developed, and there is a need for conductive pastes that are compatible with the green sheets.
この８００〜１０００℃で焼成可能なグリーンシートは
、一般にアルミナ粉末にほぼ等量のガラス粉末を配合し
、バインダー樹脂、可塑剤、溶剤等を所定量添加混合し
てスラリー状態とした後、ポリエチレンテレフタレート
のフィルムにドクターブレードで薄く引き伸ばすことに
より得るものである。This green sheet, which can be fired at 800 to 1000 degrees Celsius, is generally made by blending glass powder in an approximately equal amount with alumina powder, adding and mixing a predetermined amount of binder resin, plasticizer, solvent, etc. to form a slurry, and then forming a slurry with polyethylene terephthalate. It is obtained by stretching the film thinly with a doctor blade.
ところで、上記のようにして得たグリーンシート上に従
来のアルミナ基板を用いるハイブリッドＩＣに用いられ
ていたＡｇやＡｇとＰｄの化合物やＡｇとＰｔ、の化合
物やＡｕまたはＣｕ等のペーストを印刷して乾燥し、所
定の処理をして多層基板を作製しようとする場合、以下
のような問題が発生する。By the way, on the green sheet obtained as described above, a paste of Ag, a compound of Ag and Pd, a compound of Ag and Pt, or a paste of Au or Cu used in a conventional hybrid IC using an alumina substrate was printed. When attempting to fabricate a multilayer substrate by drying and performing predetermined processing, the following problems occur.
その主なものは、眉間の剥離現象、いわゆる“デラミネ
ーション”の発生であり、他に基板の“反り”や“ふく
れパも発生しやすくなる。The main problem is the phenomenon of peeling between the eyebrows, so-called "delamination," and the board also tends to "warp" and "bulge."
これらの問題は、シート材料と導体材料の焼結温度が異
なることによって焼結時期が合致しないために起こる現
象である。These problems occur because the sintering times of the sheet material and the conductor material do not match due to different sintering temperatures.
本発明は従来の技術の有するこのような問題点に鑑みて
なされたものであり、その目的は、シート材料と導体材
料の焼結時期がずれることなく、デラミネーションや基
板の反り等の発生することのない低温焼成多層基板用の
内層導体ペーストを提供することにある。The present invention has been made in view of the problems of the conventional technology, and its purpose is to prevent the occurrence of delamination, warping of the substrate, etc., without causing a sintering timing difference between the sheet material and the conductor material. An object of the present invention is to provide an inner layer conductor paste for a multilayer board fired at a low temperature.
〔課題を解決するための手段］
上記目的を達成するために本発明の要旨は、銀粉末とガ
ラス粉末を含有する低温焼成多層基板用の内層導体ペー
ストにおいて、銀粉末１００重量部に対して軟化点が５
８０℃以上のガラス粉末を３〜１８重量部配合したこと
を特徴とする低温焼成多層基板用の内層導体ペーストに
ある。[Means for Solving the Problems] In order to achieve the above object, the gist of the present invention is to provide an inner layer conductor paste for a low-temperature fired multilayer board containing silver powder and glass powder that softens with respect to 100 parts by weight of silver powder. 5 points
An inner layer conductor paste for a low-temperature fired multilayer board is characterized by blending 3 to 18 parts by weight of glass powder at 80°C or higher.
銀粉末は平均粒径が０．１〜１０μのものが好ましく、
０．３〜５μのものがより好ましい。銀粉末の形状は特
に限定されるものではなく、例えば、球状、フレーク状
等のものを用いることができる。The silver powder preferably has an average particle size of 0.1 to 10μ,
More preferably, the thickness is 0.3 to 5μ. The shape of the silver powder is not particularly limited, and for example, spherical, flake, etc. can be used.
ガラス粉末としては、軟化点が５８０℃以上のものであ
れば特に限定されるものではな（、例えば、ＰｂＯＢ２
Ｏ３５ｉＯｚ系、ＺｎＯＢｚＯｚ ５ｉＯｚ系、Ｐｂ
Ｏ−Ｚｎ０−ＢｚＯｚ ５ｉ０２系等のものを用いる
ことができる。さらに、これらにＣａＯ，ＴｉＯ□、Ａ
又２０３、ＢａＯ等の無機物を添加したものや、Ｓ ｉ
Ｏｚにこれら無機物を添加したものも用いることがで
きる。The glass powder is not particularly limited as long as it has a softening point of 580°C or higher (for example, PbOB2
O35iOz series, ZnOBzOz 5iOz series, Pb
O-Zn0-BzOz 5i02 series or the like can be used. Furthermore, these include CaO, TiO□, A
In addition, 203, those to which inorganic substances such as BaO are added, and Si
Those obtained by adding these inorganic substances to Oz can also be used.
低温焼成多層基板のグリーンシートに用いられているガ
ラス粉末の軟化点は、通常６５０℃以上であるため、軟
化点が５８０℃未満のガラス粉末を導体ペーストに配合
すると、導体ペーストの焼結の方がグリーンシートより
田当早く進マチし、グリーンシートと導体ペーストの焼
結時期が合致しなくなる。その結果、デラミネーション
や基板の反りか発生しやすくなるので、導体ペーストの
ガラス粉末の軟化点は５８０℃以上が好ましい。The softening point of the glass powder used in the green sheets of low-temperature firing multilayer boards is usually 650°C or higher, so if glass powder with a softening point of less than 580°C is added to the conductor paste, the sintering of the conductor paste will be slower. The sintering progresses faster than the green sheet, and the sintering times of the green sheet and conductor paste do not match. As a result, delamination or warping of the substrate is likely to occur, so the softening point of the glass powder of the conductive paste is preferably 580° C. or higher.
また、ガラス粉末の配合量が３重量部未満では、グリー
ンシートを積層して加圧した後、焼成した際のグリーン
シート各層間の密着力が弱く、デラミネーションが発生
しやすくなる。そして、ガラス粉末を１８重量部超も添
加すると、抵抗を増大させ、銀の導電性を低下させてし
まつゆ
従って、ガラス粉末の配合量は３〜１８重量部が好まし
い。Furthermore, if the amount of glass powder blended is less than 3 parts by weight, the adhesion between the layers of the green sheets is weak when the green sheets are laminated and pressed and fired, and delamination is likely to occur. If more than 18 parts by weight of glass powder is added, the resistance increases and the conductivity of silver decreases. Therefore, the amount of glass powder blended is preferably 3 to 18 parts by weight.
本発明の実施例ならびに比較例について以下に説明する
。Examples and comparative examples of the present invention will be described below.
導体ペーストの作製法としては、「平均粒径１３μの銀
粉末１００重量部に対して、８真の表１に示すように種
々の軟化点のガラス粉末を１〜２８重量部の範囲内で配
合したもの」１００重量部に対して、「エチルセルロー
ス８重量部をターピアオール９２重量部に溶解させて得
た有機ビヒクル」１５重量部を加えて３本ロールミルを
用いて混合し、ペースト化した。なお、ガラス粉末とし
ては、日本電気硝子■製のものを用いた。The method for preparing the conductive paste is as follows: ``For 100 parts by weight of silver powder with an average particle size of 13μ, glass powders with various softening points are blended in the range of 1 to 28 parts by weight as shown in Table 1. 15 parts by weight of an organic vehicle obtained by dissolving 8 parts by weight of ethyl cellulose in 92 parts by weight of Tarpierol were added to 100 parts by weight of the "prepared product" and mixed using a three-roll mill to form a paste. As the glass powder, one manufactured by Nippon Electric Glass Co., Ltd. was used.
そして、このペーストをセラミンク−ガラスグリーンソ
ート上にスクリーン印刷して乾燥した。次いで、このグ
リーンシート８枚を加熱圧着した後、ヘルド式焼成炉に
挿入して全焼成時間を２時間とし、ピーク温度９００℃
×ピーク時間１０分で焼成を行った。This paste was then screen printed onto Ceramic Glass Green Sort and dried. Next, after heat-pressing these eight green sheets, they were inserted into a heald-type firing furnace for a total firing time of 2 hours, and the peak temperature was 900°C.
*Baking was performed at a peak time of 10 minutes.
焼成後のデラミネーション、基板の反り、シートの抵抗
値等についての調査結果を表１に併記する。なお、デラ
ミネーションの評価は、焼成基板の断面を電子顕微鏡で
観察し、層間の剥離の有無を目視評価することにより行
った。表ｌ中のデラミ２−ジョンおよび基板の反りの評
価において、良好とはデラミネーションまたは反りが全
く認められなかったものを示じ、不良とは多少ともデラ
ミネーションまたは反りが認められたものを示す。Table 1 also lists the investigation results regarding delamination, substrate warpage, sheet resistance, etc. after firing. Note that delamination was evaluated by observing the cross section of the fired substrate with an electron microscope and visually evaluating the presence or absence of interlayer peeling. In the evaluation of delamination and board warping in Table 1, "good" means that no delamination or warping was observed, and "poor" means that some delamination or warping was observed. .
また、表１において、ガラス粉末の種別記号は以下のも
のを示す。Further, in Table 1, the type symbols of glass powders indicate the following.
表１より以下の点が明らかである。The following points are clear from Table 1.
■本実節例に係るものは、ガラス粉末の軟化点が５８０
℃以上で且つ配合量が適正であるから、デラミネーショ
ンおよび基板の反りもなく、抵抗値も適正である。■In this example, the softening point of the glass powder is 580.
Since the temperature is above .degree. C. and the amount is appropriate, there is no delamination or warping of the substrate, and the resistance value is also appropriate.
■比較例１〜４に係るものは、軟化点が低すぎるので、
デラミネーションおよび基板の反りが発生した。■Those related to Comparative Examples 1 to 4 have too low softening points, so
Delamination and board warping occurred.
■比較例５．６．９．１０に係るものは、ガラス粉末の
配合量が２重量部以下で少なすぎるので、デラミネーシ
ョンおよび基板の反りが発生した。(2) In Comparative Examples 5.6.9.10, the amount of glass powder blended was 2 parts by weight or less, which was too small, so delamination and warpage of the substrate occurred.
■比較例７．８．１１．１２に係るものは、ガラス粉末
の配合量が多すぎるので、シート抵抗値が高くて導電性
が不良であり、基板の反りも発生した。(2) Comparative Examples 7.8.11.12 contained too much glass powder, so the sheet resistance was high, the conductivity was poor, and the substrate warped.
本発明によれば、導電性に優れ、デラミネーションや基
板の反りが発生することのない低温焼成多層基板用の内
層導体ペーストを提供することができる。According to the present invention, it is possible to provide an inner layer conductor paste for a low-temperature fired multilayer board that has excellent conductivity and does not cause delamination or warpage of the board.
Claims (1)
内層導体ペーストにおいて、 銀粉末１００重量部に対して軟化点が５８０℃以上のガ
ラス粉末を３〜１８重量部配合したことを特徴とする低
温焼成多層基板用の内層導体ペースト[Claims] In an inner layer conductor paste for a low-temperature fired multilayer board containing silver powder and glass powder, 3 to 18 parts by weight of glass powder with a softening point of 580°C or higher is blended with 100 parts by weight of silver powder. Inner layer conductor paste for low-temperature firing multilayer boards characterized by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14709390A JPH0439813A (en) | 1990-06-04 | 1990-06-04 | Inner layer conductor paste for low temperature baked multiple layer substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14709390A JPH0439813A (en) | 1990-06-04 | 1990-06-04 | Inner layer conductor paste for low temperature baked multiple layer substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0439813A true JPH0439813A (en) | 1992-02-10 |
Family
ID=15422320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14709390A Pending JPH0439813A (en) | 1990-06-04 | 1990-06-04 | Inner layer conductor paste for low temperature baked multiple layer substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0439813A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4688379B2 (en) * | 2001-09-26 | 2011-05-25 | 福田金属箔粉工業株式会社 | Circuit board, manufacturing method thereof, and electronic apparatus |
-
1990
- 1990-06-04 JP JP14709390A patent/JPH0439813A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4688379B2 (en) * | 2001-09-26 | 2011-05-25 | 福田金属箔粉工業株式会社 | Circuit board, manufacturing method thereof, and electronic apparatus |
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