JPH0439238B2 - - Google Patents
Info
- Publication number
- JPH0439238B2 JPH0439238B2 JP62067564A JP6756487A JPH0439238B2 JP H0439238 B2 JPH0439238 B2 JP H0439238B2 JP 62067564 A JP62067564 A JP 62067564A JP 6756487 A JP6756487 A JP 6756487A JP H0439238 B2 JPH0439238 B2 JP H0439238B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- chamber
- cleaning
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims description 84
- 238000004140 cleaning Methods 0.000 claims description 30
- 239000000758 substrate Substances 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
イ 発明の目的
ａ 産業上の利用分野
本発明は、プリント基板に多数個形成されたス
ルホール内の付着物を除去するための方法及び装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION A. OBJECTS OF THE INVENTION a. Field of Industrial Application The present invention relates to a method and apparatus for removing deposits from through holes formed in a large number on a printed circuit board.
ｂ 従来の技術
プリント基板には、両面を接続したり、部品の
挿入のために多数のスルホールが形成されてい
る。このスルホールの形成は一般にドリルで形成
されるので、内周面に切り粉等が付着している。
これを完全に除去しておかないと、銅・半田メツ
キ等のスルホールメツキの付きが悪く、不良品と
なる。b. Prior Art A printed circuit board has a large number of through holes formed therein for connecting both sides and inserting components. Since this through hole is generally formed using a drill, chips and the like adhere to the inner circumferential surface.
If this is not completely removed, through-hole plating such as copper and solder plating will not adhere well, resulting in defective products.
そこで従来はスルホール内の付着物除去手段と
して、ノズル先端から40〜60Kg／cm2程度の高圧水
をプリント基板に吹付け、スルホール内の付着物
を水洗・除去させるのが一般的である。 Conventionally, as a means for removing deposits inside the through-holes, it is common to spray high-pressure water of about 40 to 60 kg/cm 2 onto the printed circuit board from the tip of a nozzle to wash and remove the deposits inside the through-holes.
ｃ 発明が解決しようとする問題点
しかし上記従来の高圧水による水洗手段では、
高圧水がスルホール以外の基板面にも当るため、
スルホールを通過する水流が弱められるし、小径
のスルホール内は高圧水が充分に通過しない。そ
のため特に小径のスルホールでは、切り粉等の付
着物が完全には除去されず、さらに別の除去手段
を必要としたり、不良品率も低くない等の問題点
がある。c Problems to be solved by the invention However, with the above-mentioned conventional water washing means using high-pressure water,
Because high-pressure water hits the board surface other than through-holes,
The water flow passing through the through hole is weakened, and high pressure water does not pass through the through hole sufficiently. Therefore, especially in small-diameter through holes, there are problems such as not being able to completely remove deposits such as chips, requiring additional removal means, and having a low rate of defective products.
本発明は、スルホールの付着物除去装置に関
し、上記従来のものが有する問題点を解決しよう
とするものである。即ち本発明の目的は、スルホ
ールの径が大・小を問わず、内部の付着物を完全
に除去する方法及び装置を提供することにある。 The present invention relates to a device for removing deposits from through-holes, and is intended to solve the problems of the conventional devices described above. That is, an object of the present invention is to provide a method and apparatus for completely removing deposits inside a through hole, regardless of whether the diameter is large or small.
ロ 発明の構成
ａ 問題点を解決するための手段
第１に、本発明に係るスルホールの付着物除去
方法は、
スルホール４付きのプリント基板３を、洗浄用
の液１が一方から他方へ流通するようにした洗浄
用室２内を通過させ、
その通過により、プリント基板３の入・出側を
密閉状にするとともに、液１の流れを遮蔽する如
く洗浄用室２内を二分し、
その状態で、該洗浄用室２の一方へ供給された
液１を、洗浄用室２の他方から強制的に吸引させ
て、
プリント基板３の各スルホール４に、洗浄用の
液１を勢いよく通過させ、
各スルホール４内の付着物５を液１と一緒に除
去させるようにしたものである。B. Arrangement of the Invention a Means for Solving the Problems Firstly, the method for removing deposits from through holes according to the present invention is as follows: A cleaning liquid 1 flows from one side of the printed circuit board 3 having the through holes 4 to the other. By passing through the inside of the cleaning chamber 2 configured as shown in FIG. Then, the liquid 1 supplied to one side of the cleaning chamber 2 is forcibly sucked from the other side of the cleaning chamber 2, and the cleaning liquid 1 is forcefully passed through each through hole 4 of the printed circuit board 3. , The deposits 5 in each through hole 4 are removed together with the liquid 1.
第２に、本発明に係るスルホールの付着物除去
装置は、
洗浄用の液１の液供給用ポンプ１７に連通した
液供給室１３と、液吸引用ポンプ１５に連通した
液吸引室１４とを対向状に配置して、
上記液供給室１３と液吸引室１４間に、プリン
ト基板３の厚みにほぼ等しい間隔で対向状に、プ
リント基板進入側に一対の前部ローラ７，８を、
退出側に一対の後部ローラ９，１０を各々設け、
上記対向した前部ローラ７，８と後部ローラ
９，１０との間の空間を、洗浄用室２に形成する
とともに、
上記液供給室１３側の前・後部ローラ７，９間
を液供給流通用の間〓１１に、液吸引室１４側の
前・後部ローラ８，１０間を液吸引流通用の間〓
１２に各々形成し、
かつ、上記前部ローラ７，８間から後部ローラ
９，１０間にかけてを、プリント基板３が上記洗
浄用室２を二分して遮蔽する如く通過可能な通路
６に形成したものである。 Second, the through-hole deposit removal device according to the present invention has a liquid supply chamber 13 communicating with the liquid supply pump 17 for the cleaning liquid 1, and a liquid suction chamber 14 communicating with the liquid suction pump 15. A pair of front rollers 7 and 8 are disposed oppositely between the liquid supply chamber 13 and the liquid suction chamber 14 at an interval approximately equal to the thickness of the printed circuit board 3 on the printed circuit board entry side.
A pair of rear rollers 9 and 10 are provided on the exit side, and a space between the opposed front rollers 7 and 8 and rear rollers 9 and 10 is formed into the cleaning chamber 2, and the liquid supply chamber 13 The space between the front and rear rollers 7 and 9 on the side is used for liquid supply and distribution = 11, and the space between the front and rear rollers 8 and 10 on the side of the liquid suction chamber 14 is used for liquid suction and distribution.
12, and a passage 6 through which the printed circuit board 3 can pass is formed between the front rollers 7 and 8 and between the rear rollers 9 and 10 so as to divide the cleaning chamber 2 into two and shield it. It is something.
上記構成において、液流通用の間隙１１，１２
は、液１が液供給室１３から洗浄用室２を経て液
吸引室１４へ流通可能とするものである。この関
〓１１，１２は例えば１mm程度のものでよく、そ
れら１１，１２を形成するために、例えば第３図
で示すように各側の前後部ローラ７，９，８，１
０を各々両側寄りを除いて0.5mm程度の小径部に
形成しておけばよい。 In the above configuration, the gaps 11 and 12 for liquid flow
This allows the liquid 1 to flow from the liquid supply chamber 13 to the liquid suction chamber 14 via the cleaning chamber 2. These barriers 11 and 12 may be, for example, about 1 mm, and in order to form these barriers 11 and 12, for example, as shown in FIG.
0 may be formed in a small diameter portion of approximately 0.5 mm, excluding the portions on both sides.
しかし上記間〓１１，１２は、上記の如き狭い
ものに限定するものではなく、もつと幅のあるも
のとしても構わない。 However, the above-mentioned spaces 11 and 12 are not limited to being narrow as described above, and may be wide.
液供給室１３は、タンク１６から液供給用ポン
プ１７により供給された液１が貯えられる場所で
あるが、タンク１６と兼用させることも可能であ
る。液吸引室１４は、前記液供給室１３の液１
が、液吸引ポンプ１５により吸引されてくる場所
である。 The liquid supply chamber 13 is a place where the liquid 1 supplied from the tank 16 by the liquid supply pump 17 is stored, but it can also be used also as the tank 16. The liquid suction chamber 14 is configured to absorb the liquid 1 in the liquid supply chamber 13.
is the location where the liquid is sucked by the liquid suction pump 15.
ここで用いる洗浄用の液１は、例えば水である
が、それに限らず後の工程に悪影響を及ぼさぬ限
り何らかな薬剤を含んでいてもよい。 The cleaning liquid 1 used here is, for example, water, but is not limited thereto, and may contain some kind of chemical as long as it does not adversely affect subsequent steps.
洗浄用室２は前記各ローラ７，８，９，１０で
囲まれた空間で、基板通路６が中央を横断してお
り、基板３がここを通過中に該室２を２分して液
１の流れを遮蔽し、各スルホール４に液１を通す
ことで洗浄させる場所である。該室２内での基板
通路６の長さ、換言すれば前部ローラ７，８と後
部ローラ９，１０との軸間距離は、基板３の前後
方向の長さより小さくしておく。即ち、基板３の
前部寄りが後部ローラ９，１０間にある時、その
後部寄りが前部ローラ７，８間にあるような関係
にしておけばよい。また横幅の狭い基板３のため
には、該洗浄用室２を通過時の基板３の横幅を補
なう補助板（図示略）を用いるものとする。 The cleaning chamber 2 is a space surrounded by the rollers 7, 8, 9, and 10, and a substrate passage 6 crosses the center, and while the substrate 3 passes through the cleaning chamber 2, the chamber 2 is divided into two and the liquid is removed. This is a place where the flow of liquid 1 is blocked and cleaning is performed by passing liquid 1 through each through hole 4. The length of the substrate passage 6 in the chamber 2, in other words, the distance between the axes of the front rollers 7, 8 and the rear rollers 9, 10 is made smaller than the length of the substrate 3 in the front-rear direction. That is, when the front side of the substrate 3 is between the rear rollers 9 and 10, the relationship may be such that the rear side is between the front rollers 7 and 8. Further, for a substrate 3 having a narrow width, an auxiliary plate (not shown) is used to compensate for the width of the substrate 3 when passing through the cleaning chamber 2.
液供給室１３・液吸引室１４を各側の前後部ロ
ーラ７，９，８，１０にシールさせて設けるに
は、例えば間にシール材１８，１９を介装させて
行なう。 In order to seal the liquid supply chamber 13 and the liquid suction chamber 14 to the front and rear rollers 7, 9, 8, and 10 on each side, sealing materials 18 and 19 are interposed therebetween, for example.
液吸引用ポンプ１５は、例えば真空ポンプ式で
容量の大きいものが望ましい。 The liquid suction pump 15 is preferably of a vacuum pump type and has a large capacity, for example.
図において、２０はセンサーで、基板３が本装
置の前部ローラ７，８を通過するのを感知するた
めのもので、液吸引用ポンプ１５を作動させるも
のである。尚、多数のプリント基板３を連続的に
洗浄する場合には、センサー２０は当初のみ作動
させればよい。２１は液中の付着物除去部で、例
えばフイルタを交換可能に設けておく。 In the figure, a sensor 20 is used to sense when the substrate 3 passes through the front rollers 7 and 8 of the apparatus, and is used to operate the liquid suction pump 15. Note that when cleaning a large number of printed circuit boards 3 continuously, the sensor 20 only needs to be activated at the beginning. Reference numeral 21 denotes a part for removing deposits in the liquid, which is provided with a replaceable filter, for example.
また液供給室１３と液吸引室１４の位置関係
は、図示例の場合と上・下が逆になつたものでも
よい。 Further, the positional relationship between the liquid supply chamber 13 and the liquid suction chamber 14 may be such that the top and bottom are reversed from the illustrated example.
ｂ 作 用
本発明に係る方法及び装置の作用を、図示例の
装置の使用状態によつて説明する。b. Effects The effects of the method and apparatus according to the present invention will be explained by using the illustrated example of the apparatus in use.
液供給室１３には、第１図の如くタンク１６か
ら液供給用ポンプ１７により液１が供給され貯え
られており、液吸引用ポンプ１５の作動で吸引さ
れ、洗浄用室２を経て液吸引室１４へ流通可能な
状態になつている。 As shown in FIG. 1, liquid 1 is supplied from a tank 16 by a liquid supply pump 17 and stored in the liquid supply chamber 13. The liquid 1 is sucked by the operation of the liquid suction pump 15, and is sucked through the cleaning chamber 2. It is now in a state where it can be distributed to the chamber 14.
今第１図のように、プリント基板３が本装置に
進行してきて、装置内へ入りはじめると、液吸引
用ポンプ１５が作動して液供給室１３の液１は勢
いよく液吸引室１４側へ吸引される。そのため液
供給室１３の液１は、その側の前後部ローラ７，
９の間〓１２を通過して洗浄用室２へ流入し、か
つ液吸引室１４側の前後部ローラ８，１０の間〓
１２から液吸引室１４へ流出するという、液の流
れが形成される。 Now, as shown in FIG. 1, when the printed circuit board 3 advances to this device and begins to enter the device, the liquid suction pump 15 is activated and the liquid 1 in the liquid supply chamber 13 is rapidly moved toward the liquid suction chamber 14. is attracted to. Therefore, the liquid 1 in the liquid supply chamber 13 is transferred to the front and rear rollers 7 on that side.
Between 9 and 12, the liquid flows into the cleaning chamber 2, and between the front and rear rollers 8 and 10 on the liquid suction chamber 14 side.
A liquid flow is formed that flows from the liquid suction chamber 12 to the liquid suction chamber 14.
そして前記基板３がさらに前進し、第２図の如
くその前部寄りが後部ローラ９，１０間に達する
とともに、後部寄りが前部ローラ７，８間にある
状態になると、基板３が洗浄用室２内を基板通路
６に沿つて２分し塞いでしまう。そのため前記液
１の流れが、洗浄用室２内で基板３にて遮ぎられ
る形になるので、液吸引用ポンプ１５により吸引
されている液１は、基板３の各スルホール４を通
過せざるを得なくなる。この際に液１は、径の大
小を問わず全てのスルホール４を通過するため、
いずれのスルホール４からも付着物５が確実に洗
浄・除去されることになる。 When the substrate 3 moves further forward and the front side reaches between the rear rollers 9 and 10 as shown in FIG. 2, and the rear side reaches between the front rollers 7 and 8, the substrate 3 The interior of the chamber 2 is divided into two along the substrate passage 6 and is blocked. Therefore, the flow of the liquid 1 is blocked by the substrate 3 in the cleaning chamber 2, so the liquid 1 being sucked by the liquid suction pump 15 has no choice but to pass through each through hole 4 of the substrate 3. You won't get any more. At this time, the liquid 1 passes through all the through holes 4 regardless of their diameter, so
The deposits 5 can be reliably cleaned and removed from any of the through holes 4.
その後に該基板３は、さらに前進して本装置外
に去るが、続いて次の基板３が入つて来て前記と
同様のことが行われる。尚、基板３のスルホール
４を通過した液１は、液吸引室１４を通過して液
吸引用ポンプ１５に達し、タンク１６へ戻つて循
環されるが、その途中で液中付着物除去部２１に
より付着物５は外部へ除去される。 Thereafter, the substrate 3 moves further forward and leaves the apparatus, but then the next substrate 3 comes in and the same process as described above occurs. The liquid 1 that has passed through the through hole 4 of the substrate 3 passes through the liquid suction chamber 14 and reaches the liquid suction pump 15, and returns to the tank 16 for circulation. The deposits 5 are removed to the outside.
ハ 発明の効果
以上で明かな如く、本発明に係るスルホールの
付着物除去方法及び装置によれば、スルホールの
径が大・小を問わず、内部の付着物を完全に除去
できる。C. Effects of the Invention As is clear from the above, according to the method and apparatus for removing deposits from through holes according to the present invention, deposits inside the through holes can be completely removed regardless of whether the diameter of the through hole is large or small.
即ち、従来一般に用いられている高圧水を吹き
付ける手段では、高圧水がスルホール以外の基板
面にも当るため、スルホールを通過する水流が弱
められるし、小径のスルホールには水が入り難
い。そのため特に小径のスルホールでは、切り粉
等の付着物が充分に除去されなかつた。 That is, in the conventionally commonly used means of spraying high-pressure water, the high-pressure water hits substrate surfaces other than the through-holes, weakening the water flow passing through the through-holes, and making it difficult for water to enter small-diameter through-holes. Therefore, especially in small-diameter through holes, deposits such as chips were not sufficiently removed.
それに対し本発明においては、プリント基板で
遮蔽状として一方から液を供給し他方からポンプ
で液を吸引する構成である。そのために液は、径
の大小を問わずスルホールを通過せざるを得なく
なり、いずれのスルホールにも流入し流出するの
で、それによつて内部の付着物が洗浄・除去でき
るものである。したがつて本発明では、別の洗
浄・除去手段を併用しなくても、またあらゆるス
ルホールから付着物を確実に除去でき、歩留りを
向上させることができるという有用な効果を奏す
る。 In contrast, in the present invention, the liquid is supplied from one side using a printed circuit board as a shield, and the liquid is sucked from the other side using a pump. For this reason, the liquid has no choice but to pass through the through holes, regardless of their diameter, and flows into and out of any of the through holes, thereby cleaning and removing deposits inside. Therefore, the present invention has the useful effect of being able to reliably remove deposits from all through-holes and improving the yield without using any other cleaning/removal means.
図は本発明の一実施例を示すもので、第１図は
その方法の実施に使用する装置の一部縦断正面
図、第２図は要部の縦断正面、第３図は前・後部
ローラの平面図、第４図は付着物除去中のプリン
ト基板の一部拡大縦断面図である。
図面符号、１……液、２……洗浄用室、３……
プリント基板、４……スルホール、５……付着
物、６……基板の通路、７……前部ローラ、８…
…後部ローラ、９……前部ローラ、１０……後部
ローラ、１１，１２……間〓、１３……液供給
室、１４……液吸引室、１５……液吸引用ポン
プ。
The drawings show one embodiment of the present invention, in which Fig. 1 is a partially longitudinal front view of the apparatus used to carry out the method, Fig. 2 is a longitudinal sectional front view of the main part, and Fig. 3 is a front and rear roller roller. FIG. 4 is a partially enlarged vertical sectional view of the printed circuit board during removal of deposits. Drawing code, 1...Liquid, 2...Cleaning chamber, 3...
Printed circuit board, 4... through hole, 5... deposit, 6... board passage, 7... front roller, 8...
...rear roller, 9...front roller, 10...rear roller, 11, 12...between, 13...liquid supply chamber, 14...liquid suction chamber, 15...liquid suction pump.
Claims (1)
用の液１が一方から他方へ流通するようにした洗
浄用室２内を通過させ、 その通過により、プリント基板３の入・出側を
密閉状にするとともに、液１の流れを遮蔽する如
く洗浄用室２内を二分し、 その状態で、該洗浄用室２の一方へ供給された
液１を、洗浄用室２の他方から強制的に吸引させ
て、 プリント基板３の各スルホール４に、洗浄用の
液１を勢いよく通過させ、 各スルホール４内の付着物５を液１と一緒に除
去させるようにした、スルホールの付着物除去方
法。 ２ 洗浄用の液１の液供給用ポンプ１７に連通し
た液供給室１３と、液吸引用ポンプ１５に連通し
た液吸引室１４とを対向状に配置し、 上記液供給室１３と液吸引室１４間に、プリン
ト基板３の厚みにほぼ等しい間隔で対向状に、プ
リント基板進入側に一対の前部ローラ７，８を、
退出側に一対の後部ローラ９，１０を各々設け、 上記対向した前部ローラ７，８と後部ローラ
９，１０との間の空間を洗浄用室２に形成すると
ともに、 上記液供給室１３側の前・後部ローラ７，９間
を液供給流通用の間〓１１に、液吸引室１４側の
前・後部ローラ８，１０間を液吸引流通用の間〓
１２に各々形成し、 かつ、上記前部ローラ７，８間から後部ローラ
９，１０間にかけてを、プリント基板３が上記洗
浄用室２を二分して遮蔽する如く通過可能な通路
６に形成した、スルホールの付着物除去装置。[Claims] 1. A printed circuit board 3 with through holes 4 is passed through a cleaning chamber 2 in which a cleaning liquid 1 flows from one side to the other. The outlet side is sealed and the inside of the cleaning chamber 2 is divided into two so as to block the flow of the liquid 1. In this state, the liquid 1 supplied to one side of the cleaning chamber 2 is transferred to the inside of the cleaning chamber 2. Through-holes are configured such that cleaning liquid 1 is forcefully passed through each through-hole 4 of printed circuit board 3 by suction from the other side, and deposits 5 in each through-hole 4 are removed together with liquid 1. How to remove deposits. 2. A liquid supply chamber 13 communicating with the liquid supply pump 17 for the cleaning liquid 1 and a liquid suction chamber 14 communicating with the liquid suction pump 15 are arranged to face each other, and the liquid supply chamber 13 and the liquid suction chamber are arranged to face each other. Between 14 and 14, a pair of front rollers 7 and 8 are placed on the printed circuit board entry side, facing each other at an interval approximately equal to the thickness of the printed circuit board 3.
A pair of rear rollers 9, 10 are provided on the exit side, and a space between the opposed front rollers 7, 8 and rear rollers 9, 10 is formed in the cleaning chamber 2, and the liquid supply chamber 13 side The space between the front and rear rollers 7 and 9 is used for liquid supply and distribution = 11, and the space between the front and rear rollers 8 and 10 on the liquid suction chamber 14 side is used for liquid suction and distribution.
12, and a passage 6 through which the printed circuit board 3 can pass is formed between the front rollers 7 and 8 and between the rear rollers 9 and 10 so as to divide the cleaning chamber 2 into two and shield it. , Through-hole deposit removal device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6756487A JPS63232391A (en) | 1987-03-19 | 1987-03-19 | Method and apparatus for removing contaminant in through-hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6756487A JPS63232391A (en) | 1987-03-19 | 1987-03-19 | Method and apparatus for removing contaminant in through-hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63232391A JPS63232391A (en) | 1988-09-28 |
| JPH0439238B2 true JPH0439238B2 (en) | 1992-06-26 |
Family
ID=13348581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6756487A Granted JPS63232391A (en) | 1987-03-19 | 1987-03-19 | Method and apparatus for removing contaminant in through-hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63232391A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06188542A (en) * | 1992-05-07 | 1994-07-08 | Fuji Kiko Denshi Kk | Method and equipment for cleaning board member having small holes |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63220596A (en) * | 1986-11-21 | 1988-09-13 | テレダイン インダストリーズ インコーポレーテッド | Method and apparatus for washing printed circuit board |
-
1987
- 1987-03-19 JP JP6756487A patent/JPS63232391A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63220596A (en) * | 1986-11-21 | 1988-09-13 | テレダイン インダストリーズ インコーポレーテッド | Method and apparatus for washing printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63232391A (en) | 1988-09-28 |
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