JPS63232391A - Method and apparatus for removing contaminant in through-hole - Google Patents
Method and apparatus for removing contaminant in through-holeInfo
- Publication number
- JPS63232391A JPS63232391A JP6756487A JP6756487A JPS63232391A JP S63232391 A JPS63232391 A JP S63232391A JP 6756487 A JP6756487 A JP 6756487A JP 6756487 A JP6756487 A JP 6756487A JP S63232391 A JPS63232391 A JP S63232391A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- chamber
- rollers
- cleaning
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 9
- 239000000356 contaminant Substances 0.000 title 1
- 239000007788 liquid Substances 0.000 claims description 69
- 238000004140 cleaning Methods 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
イ 発明の目的
ａ 産業上の利用分野
本発明は、プリント基板に多数個形成されたスルホール
内の付着物を除去するための方法及び装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION A. OBJECTS OF THE INVENTION a. Field of Industrial Application The present invention relates to a method and apparatus for removing deposits from through holes formed in a large number on a printed circuit board.
ｂ 従来の技術
プリント基板には、両面を接続したり、部品の挿入のた
めに多数のスルホールが形成されている。b. Prior Art A printed circuit board has a large number of through holes for connecting both sides and inserting components.
このスルホールの形成は一般にドリルで形成されるので
、内周面に切り粉等が付着している。これを完全に除去
しておかないと、銅・半田メッキ等のスルホールメッキ
の付きが悪く、不良品となる。Since this through hole is generally formed using a drill, chips and the like adhere to the inner circumferential surface. If this is not completely removed, through-hole plating such as copper or solder plating will not adhere well, resulting in a defective product.
そこで従来はスルホール内の付着物除去手段として、ノ
ズル先端から４０〜６０ Ｋ ｇ ／ ｃ ｍ程度の高
圧水をプリント基板に吹付け、スルホール内の付着物を
水洗・除去させるのが一般的である。Conventionally, the conventional method for removing deposits inside the through-holes is to spray high-pressure water of approximately 40 to 60 Kg/cm onto the printed circuit board from the nozzle tip to wash and remove the deposits inside the through-holes. .
Ｃ発明が解決しようとする問題点
しかし上記従来の高圧水による水洗手段では、高圧水が
スルホール以外の基板面にも当るため、スルホールを通
過する水流が弱められるし、小径のスルホール内は高圧
水が充分に通過しない。そのため特に小径のスルホール
では、切り粉等の付着物が完全には除去されず、さらに
別の除去手段を必要としたり、不良品率も低くない等の
問題点がある。C Problems to be Solved by the Invention However, in the above-mentioned conventional water washing means using high-pressure water, the high-pressure water also hits substrate surfaces other than the through-holes, weakening the water flow passing through the through-holes, and the high-pressure water does not flow inside the small-diameter through-holes. does not pass through sufficiently. Therefore, especially in small-diameter through holes, there are problems such as not being able to completely remove deposits such as chips, requiring additional removal means, and having a low rate of defective products.
本発明は、スルホールの付着物除去装置に関し、上記従
来のものが有する問題点を解決しようとす゛るものであ
る。即ち本発明の目的は、スルホールの径が大・小を問
わず、内部の付着物を完全に除去する方法及び装置を提
供することにある。The present invention relates to a device for removing deposits from through-holes, and is intended to solve the problems of the conventional devices described above. That is, an object of the present invention is to provide a method and apparatus for completely removing deposits inside a through hole, regardless of whether the diameter is large or small.
口 発明の構成
ａ 問題点を解決するための手段
本発明に係るスルホールの付着物除去方法は、洗浄用の
液（１）が流通可能な洗浄用室（２）に、該室（２）を
２分して遮蔽する如くプリント基板（３）を通し、該洗
浄用室（２）の片方に液（１１を供給させ他方からその
液（１）を吸引することにより、各スルホール（４ンに
液（１）を通過させて付着物（５）を除去させるように
したものである。Arrangement of the Invention (a) Means for Solving Problems The method for removing deposits from through holes according to the present invention includes a cleaning chamber (2) through which a cleaning liquid (1) can flow. By passing the printed circuit board (3) so as to divide it into two parts and shielding it, supply the liquid (11) to one side of the cleaning chamber (2) and suck the liquid (1) from the other side. The liquid (1) is passed through to remove deposits (5).
また本発明に係るスルホールの付着物除去装置は、プリ
ント基板（３）の通路（６）を挟んで対向状に、前部ロ
ーラ（７） （８）と後部ローラ（９）ａωを設け、各
側の面後部ローラ（７） （９） （８） Ｑａ間に各
々液通過用の間隙０１）Ｑａを形成するとともに、各ロ
ーラ（７） （８） （９） （ＩＩで囲まれた洗浄用
室（２）を設け、片側の前後部ローラ（７） （９）の
外側に、それらローラ（７） （９）とシールさせて液
供給室（１３１を設け、他側の前後部ローラ（８）ａΦ
の外側に、それらローラ（８ンαωとシールさせて液吸
引室間を設け、かつ該液吸引室θ船を液吸引用ポンプａ
！９に連通させてなるものである。Further, the through-hole deposit removal device according to the present invention includes front rollers (7) (8) and rear rollers (9) aω that are opposed to each other across the passage (6) of the printed circuit board (3). A gap 01)Qa for liquid passage is formed between the side rear rollers (7) (9) (8) Qa, and each roller (7) (8) (9) (for cleaning surrounded by II) is formed. A liquid supply chamber (131) is provided on the outside of the front and rear rollers (7) and (9) on one side by sealing them with the rollers (7 and 9), and a liquid supply chamber (131) is provided on the outside of the front and rear rollers (7) and (9) on the other side. )aΦ
A liquid suction chamber is provided between the rollers (8 and αω) on the outside of the vessel, and the liquid suction chamber θ is connected to a liquid suction pump a.
! 9.
上記構成において、液流通用の間隙Ｑｌ） Ｑａは、液
＜１）が液供給室０３）から洗浄用室（２）を経て液吸
引室Ｏｖへ流通可能とするものである。この間隙ａａａ
ｓは例えば１ｍｍ程度のものでよく、それらａυ（財）
を形成するために、例えば第３図で示すように各側の前
後部ローラ（７） （９） （８）ｆＪΦを各々両側寄
りを除いて０．５ｍｍ程度の小径部に形成しておけばよ
い。In the above configuration, the liquid flow gap Ql) Qa allows liquid <1) to flow from the liquid supply chamber 03) to the liquid suction chamber Ov via the cleaning chamber (2). This gap aaa
For example, s may be about 1 mm, and these aυ (goods)
In order to form a good.
液供給室ａ３は、タンクａＩ９から液供給用ポンプａη
により供給された液（１）が貯えられる場所であるが、
タンク０６）と兼用させることも可能である。液吸引室
α船は、前記液供給室αｊの液（１）が、液吸引ポンプ
０りにより吸引されて（る場所である。The liquid supply chamber a3 is connected to a liquid supply pump aη from the tank aI9.
This is the place where the liquid (1) supplied by is stored,
It is also possible to use it also as tank 06). The liquid suction chamber α ship is a place where the liquid (1) in the liquid supply chamber αj is sucked by the liquid suction pump 0.
ここで用いる洗浄用の液（１）は、例えば水であるが、
それに限らず後の工程に悪影響を及ぼさぬ限り何らかの
薬剤を含んでいてもよい。The cleaning liquid (1) used here is, for example, water, but
However, the composition is not limited to this, and may contain some kind of drug as long as it does not adversely affect subsequent steps.
洗浄用室（２）は前記各ローラ（７） （８） （９）
Ｑｌで囲まれた空間で、基板通路（６）が中央を横断
しており、基板（３）がここを通過中に該室（２）を２
分して液（ｉ）の流れを遮蔽し、各スルホール（４）に
液（１）を通すことで洗浄させる場所である。該室（２
）内での基板通路（６）の長さ、換言すれば前部ローラ
（７） （８）と後部ローラ（９）０Φとの軸間距離は
、基板（３）の前後方向の長さより小さくしておく。即
ち、基板（３）の前部寄りが後部ローラ（９）０１間に
ある時、その後部寄りが前部ローラ（７） （８）間に
あるような関係にしておけばよい。また横幅の狭い基板
（３）のためには、該洗浄用室（２）を通過時の基板（
３）の横幅を補なう補助板（図示略）を用いるものとす
る。The cleaning chamber (2) has the above-mentioned rollers (7) (8) (9).
In the space surrounded by Ql, a substrate passage (6) crosses the center, and the substrate (3) passes through this chamber (2).
This is a place where the flow of liquid (i) is blocked and cleaning is performed by passing liquid (1) through each through hole (4). The room (2
), in other words, the distance between the axes of the front roller (7) (8) and the rear roller (9) 0Φ is smaller than the length of the board (3) in the front-rear direction. I'll keep it. That is, when the front side of the substrate (3) is between the rear rollers (9) and 01, the relationship may be such that the rear side is between the front rollers (7) and (8). In addition, for narrow substrates (3), when the substrates (3) pass through the cleaning chamber (2),
3) An auxiliary plate (not shown) shall be used to compensate for the width.
液供給室０濁・液吸引室α０を各側の前後部ローラ（７
） （９） （８） Ｑｌにシールさせて設けるには、
例えば間にシール材Ｑｌα９を介装させて行なう。The liquid supply chamber 0 and the liquid suction chamber α0 are connected to the front and rear rollers (7) on each side.
) (9) (8) To seal and install Ql,
For example, a sealing material Qlα9 is interposed therebetween.
液吸引用ポンプα鴎は、例えば真空ポンプ式で容量の大
きいものが望ましい。The liquid suction pump α is preferably of a vacuum pump type and has a large capacity, for example.
図において、Ｑ呻はセンサーで、基板（３）が本装置の
前部ローラ（７） （８）を通過するのを感知するため
のもので、液吸引用ポンプαりを作動させるものである
。尚、多数のプリント基板（３）を連続的に洗浄する場
合には、センサー＋２１は当初のみ作動させればよい。In the figure, Q is a sensor that detects when the substrate (3) passes through the front rollers (7) and (8) of this device, and activates the liquid suction pump α. . Incidentally, when cleaning a large number of printed circuit boards (3) continuously, the sensor +21 only needs to be activated at the beginning.
（２１）は液中の付着物除去部で、例えばフィルタを交
換可能に設けてお（。(21) is a part for removing deposits in the liquid, for example, a filter is provided so as to be replaceable (21).
ｂ 作 用
本発明に係る方法及び装置の作用を装置°の使用状態に
よって説明する。b. Function The function of the method and device according to the present invention will be explained by using the device.
液供給室０階には、第１図の如くタンク叫から液供給用
ポンプａηにより液（１）が供給され貯えられており、
液吸引用ポンプ０りの作動で吸引され、洗浄用室（２）
を経て液吸引室（１４）へ流通可能な状態になっている
。On the 0th floor of the liquid supply room, as shown in Fig. 1, liquid (1) is supplied and stored from the tank by the liquid supply pump aη.
The liquid is suctioned by the operation of the suction pump, and the cleaning chamber (2)
The liquid can flow through the liquid suction chamber (14).
令弟１図のように、プリント基板（３）が本装置に進行
してきて、装置内へ入りはじめると、液吸引用ポンプ０
ωが作動して液供給室Ｑ１の液（１）は勢いよく液吸引
室Ｏａ側へ吸引される。そのため液供給室α争の液（１
）は、その側の前後部ローラ（７１（９）の間隙側を通
過して洗浄用室（２）全流入し、かつ液吸引室（１４１
例の前後部ローラ（８）α〔の間隙側から液吸引室α旬
へ流出するという、液の流れが形成される。As shown in Figure 1, when the printed circuit board (3) advances to this device and begins to enter the device, the liquid suction pump 0
ω operates, and the liquid (1) in the liquid supply chamber Q1 is forcefully sucked into the liquid suction chamber Oa side. Therefore, the liquid in the liquid supply chamber α (1
) passes through the gap side of the front and rear rollers (71 (9) on that side, completely flows into the cleaning chamber (2), and the liquid suction chamber (141
A flow of liquid is formed that flows from the gap side of the front and rear rollers (8) α into the liquid suction chamber α.
ぞして前記基板（３）がさらに前進し、第２図の如くそ
の前部寄りが後部ローラ（９１０１間に達するとともに
、後部寄りが前部ローラ（７） （８）間にある状態に
なると、基板（３）が洗浄用室（２）内を基板通路（６
）に沿って２分し塞いでしまう。そのため前記液（１）
の流れが、洗浄用室（２）内で基板（３）にて遮ぎられ
る形になるので、液吸引用ポンプ０！９により吸引され
ている液（１）は、基板（３）の各スルホール（４）を
通過せざ番を得なくなる。この際に液（１）は、径の大
小を問わず全てのスルホール（４）を通過するため、い
ずれのスルホール（４）からも付着物（５）が確実に洗
浄・除去されることになる。Then, the substrate (3) moves further forward, and as shown in Fig. 2, the front side reaches between the rear rollers (9101) and the rear side reaches between the front rollers (7) and (8). , the substrate (3) passes through the substrate passage (6) inside the cleaning chamber (2).
) and block it in two. Therefore, the liquid (1)
Since the flow of the liquid (1) is blocked by the substrate (3) in the cleaning chamber (2), the liquid (1) being sucked by the liquid suction pump 0!9 flows through each of the substrates (3). You will have to pass through the hole (4) to get your turn. At this time, the liquid (1) passes through all the through holes (4) regardless of their diameter, so the deposits (5) are reliably cleaned and removed from all through holes (4). .
その後に該基板（３）は、さらに前進して本装置外に去
るが、続いて次の基板（３）が入って来て前記と同様の
ことが行われる。尚、基板（３）のスルホール（４）を
通過した液（１）は、液吸引室α船を通過して液吸引用
ポンプＱＳＩに達し、タンクＯＩへ戻って循環されるが
、その途中で液中付着物除去部（２１）により付着物（
５）は外部へ除去される。Thereafter, the substrate (3) moves further forward and leaves the apparatus, but then the next substrate (3) comes in and the same process as described above occurs. The liquid (1) that has passed through the through hole (4) of the substrate (3) passes through the liquid suction chamber α vessel, reaches the liquid suction pump QSI, returns to the tank OI, and is circulated. The in-liquid deposit removal section (21) removes deposits (
5) is removed to the outside.
ハ 発明の効果
以上で明かな如（、本発明に係るスルホールの付着物除
去方法及び装置によれば、スルホールの径が大・小を問
わず、内部の付着物を完全に除去できる。C. Effects of the Invention As is clear from the above, the method and apparatus for removing deposits from through holes according to the present invention can completely remove deposits inside the through holes, regardless of whether the diameter is large or small.
即ち、従来一般に用いられている高圧水を吹き付ける手
段では、高圧水がスルホール以外の基板面にも当るため
、スルホールを通過する水流が弱められるし、小径のス
ルホールには水が入り難い。That is, in the conventionally commonly used means of spraying high-pressure water, the high-pressure water hits substrate surfaces other than the through-holes, weakening the water flow passing through the through-holes, and making it difficult for water to enter small-diameter through-holes.
そのため特に小径のスルホールでは、切り粉等の付着物
が充分に除去されなかった。Therefore, especially in small-diameter through holes, deposits such as chips were not sufficiently removed.
それに対し本発明においては、プリント基板で遮蔽状と
して一方から液を供給し他方からポンプで液を吸引する
構成である。そのために液は、径の大小を問わずスルホ
ールを通過せざるを得なくなり、いずれのスルホールに
も流入し流出するので、それによって内部の付着物が洗
浄・除去できるものである。したがって本発明では、別
の洗浄・除去手段を併用しなくても、またあらゆるスル
ホールから付着物を確実に除去でき、歩留りを向上させ
ることができるという有用な効果を奏する。In contrast, in the present invention, the liquid is supplied from one side using a printed circuit board as a shield, and the liquid is sucked from the other side using a pump. Therefore, the liquid has no choice but to pass through the through holes regardless of their diameter, and since it flows into and out of any of the through holes, it is possible to wash and remove the deposits inside. Therefore, the present invention has the useful effect of being able to reliably remove deposits from all through-holes without using any other cleaning/removal means, thereby improving the yield.
図は本発明の一実施例を示すもので、第１図はその方法
の実施に使用する装置の一部縦断正面図、第２図は要部
の縦断正面、第３図は前・後部ローラの平面図、第４図
は付着物除去中のプリント基板の一部拡大縦断面図であ
る。
図面符号 （１）−液、（２）−洗浄用室、（３）−プ
リント基板、（４）−スルホール、（５）−付着物、（
６）一基板の通路、（７）−前部ローラ、（８）−後部
ローラ、（９）−前部ローラ、αω−後部ローラ、ａυ
α乃−間隙、（１３１−液供給室、Ｑ４）−液吸引室、
αω−液吸引用ポンプ。
第１図
第３図The drawings show one embodiment of the present invention, in which Fig. 1 is a partially longitudinal front view of the apparatus used to carry out the method, Fig. 2 is a longitudinal sectional front view of the main part, and Fig. 3 is a front and rear roller roller. FIG. 4 is a partially enlarged vertical sectional view of the printed circuit board during removal of deposits. Drawing codes: (1) - Liquid, (2) - Cleaning chamber, (3) - Printed circuit board, (4) - Through hole, (5) - Deposits, (
6) One substrate path, (7) - front roller, (8) - rear roller, (9) - front roller, αω - rear roller, aυ
α-gap, (131-liquid supply chamber, Q4)-liquid suction chamber,
αω-Liquid suction pump. Figure 1 Figure 3
Claims (1)
、該室（２）を２分して遮蔽する如くプリント基板（３
）を通し、該洗浄用室（２）の一方に液（１）を供給さ
せ他方からその液（１）を吸引することにより、各スル
ホール（４）に液（１）を通過させて付着物（５）を除
去することを特徴とする、スルホールの付着物除去方法
。 〔２〕プリント基板（３）の通路（２）を挟んで対向状
に、前部ローラ（７）（８）と後部ローラ（９）（１０
）を各々設け、各側の前後部ローラ（７）（９）（８）
（１０）間に各々液通過用の間隙（１１）（１２）を形
成するとともに、各ローラ（７）（８）（９）（１０）
で囲まれた洗浄用室（２）を設け、片側の前後部ローラ
（７）（９）の外側に、それらローラ（７）（９）とシ
ールさせて液供給室（１３）を設け、他側の前後部ロー
ラ（８）（１０）の外側に、それらローラ（８）（１０
）とシールさせて液吸引室（１４）を設け、かつ該液吸
引室（１４）を液吸引用ポンプ（１５）に連通させたこ
とを特徴とする、スルホールの付着物除去装置。[Scope of Claims] [1] A printed circuit board (3) is installed in the cleaning chamber (2) through which the cleaning liquid (1) can flow, so as to divide the chamber (2) into two and shield it.
), by supplying the liquid (1) to one of the cleaning chambers (2) and sucking the liquid (1) from the other, the liquid (1) is passed through each through hole (4) to remove deposits. (5) A method for removing deposits from throughholes, which comprises removing. [2] Front rollers (7) (8) and rear rollers (9) (10) are arranged opposite to each other across the passage (2) of the printed circuit board (3).
) are provided respectively, and the front and rear rollers (7) (9) (8) on each side are provided.
(10) to form gaps (11) and (12) for liquid passage between each roller (7), (8), (9), and (10).
A cleaning chamber (2) is provided surrounded by a cleaning chamber (2), and a liquid supply chamber (13) is provided outside the front and rear rollers (7) and (9) on one side by sealing them with the rollers (7) and (9). On the outside of the front and rear rollers (8) (10) on the side, there are rollers (8) (10).
) A through-hole deposit removal device characterized in that a liquid suction chamber (14) is provided in a sealed manner, and the liquid suction chamber (14) is communicated with a liquid suction pump (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6756487A JPS63232391A (en) | 1987-03-19 | 1987-03-19 | Method and apparatus for removing contaminant in through-hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6756487A JPS63232391A (en) | 1987-03-19 | 1987-03-19 | Method and apparatus for removing contaminant in through-hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63232391A true JPS63232391A (en) | 1988-09-28 |
| JPH0439238B2 JPH0439238B2 (en) | 1992-06-26 |
Family
ID=13348581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6756487A Granted JPS63232391A (en) | 1987-03-19 | 1987-03-19 | Method and apparatus for removing contaminant in through-hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63232391A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06188542A (en) * | 1992-05-07 | 1994-07-08 | Fuji Kiko Denshi Kk | Method and equipment for cleaning board member having small holes |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63220596A (en) * | 1986-11-21 | 1988-09-13 | テレダイン インダストリーズ インコーポレーテッド | Method and apparatus for washing printed circuit board |
-
1987
- 1987-03-19 JP JP6756487A patent/JPS63232391A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63220596A (en) * | 1986-11-21 | 1988-09-13 | テレダイン インダストリーズ インコーポレーテッド | Method and apparatus for washing printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06188542A (en) * | 1992-05-07 | 1994-07-08 | Fuji Kiko Denshi Kk | Method and equipment for cleaning board member having small holes |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0439238B2 (en) | 1992-06-26 |
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