JPH0438942Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] This invention uses a light beam from an arc thermal light source, etc., to melt solder with the heat, and is used for heating processing such as soldering electronic components. The present invention relates to a heating processing device that uses a light beam to perform.

[Conventional technology]

As a conventional heating processing device using this type of light beam, the one shown in Fig. 5 is used.
This will be explained below.

1 is an ellipsoidal reflector, 2 is an arc thermal light source which is a point light source placed at or near the first focus _F1 , and 3 is a second focus of the ellipsoidal reflector ₁ .
This is a heated workpiece such as a soldering part placed in _F2 .

Heat rays generated radially from the arc thermal light source ₂ placed at the first focal point F1 of the ellipsoidal reflector 1 are reflected by the ellipsoidal reflector 1 and focused at the second focal point _F2 . The heated part such as the soldering part of the heated workpiece 3 placed at the focal point F ₂ is heated in a dot shape according to the optical performance of the arc heat light source 2 and the ellipsoidal reflector 1, heating processing is performed.

[Problem that the invention attempts to solve]

In conventional heating processing equipment using a light beam, the shape of the focal point of the light beam is a single heating spot with a circular shape, as mentioned above, so it is difficult to heat the parts when there are several parts to be heated or when the parts are linear. , the position of the heating spot must be moved intermittently or continuously scanned in a linear manner.

As a result, work time becomes longer and work efficiency is lower, and since the heated part is melted and solidified at different locations, distortion occurs in the parts one after another, resulting in large stresses and strains, which can cause misalignment of parts. There were drawbacks that led to frequent defects such as, and decreased reliability.

[Purpose of invention]

In order to eliminate the above-mentioned drawbacks of conventional heating processing equipment using a light beam, the present invention has been developed to heat processing multiple locations simultaneously and in a linear manner despite using a single light source. The purpose is to shorten heating and work time, and improve reliability and product yield.

[Summary of the idea]

In order to achieve the above-mentioned object, the present invention splits the light beam and adjusts the angle using a plurality of plane mirrors in which a counter-linear light source of an ellipsoidal or parabolic reflecting mirror is provided in the path. By using multiple optical systems such as cylindrical lenses that focus light only in one direction,
The gist is to use a plurality of linear lights.

[Example of idea]

An embodiment of the present invention will be described below with reference to FIGS. 1 to 4.

In Figure 1, 4 is an arc thermal light source lamp;
5 is its point light source, 7 is its anode, 8 is its cathode, and the anode 7 and cathode 8 are connected to a lamp power source (not shown).
The point light source 5 is turned on.

Reference numeral 6 denotes an ellipsoidal reflecting mirror, on which the arc thermal light source lamp 4 is installed so that the point light source 5 is located at or near its first focus, and reflects the heat rays from the point light source 5.

9 is a first plane mirror that reflects the reflected light from the ellipsoidal reflecting mirror 6; 10 is the first plane mirror 9;
The second plane mirror 10 is a second plane mirror that reflects light reflected from It's getting old.

Reference numeral 12 denotes a cylindrical lens installed in the reflected light path of the second plane mirror 10. The cylindrical lens 12 is held at a constant angle and can be moved slightly in the horizontal direction in the drawing by a moving mechanism 13. be.

14 is installed in the reflected light path of the second plane mirror 10, and as shown in FIG. 3 and FIG.
The width of the reflected light reaching the cylindrical lens 12 is adjusted by changing the interval between the pairs of light shielding plates.

With the opening/closing mechanism 15 that adjusts the width, the light shielding plate 14 can not only adjust the width of the reflected light described above and completely block light, but also move slightly in the horizontal direction in the drawing in synchronization with the moving mechanism 13. 14 and the cylindrical lens 12 are always kept at a constant distance.

The above first plane mirror 9 and second plane mirror 1
An optical system consisting of the moving mechanisms 11 and 13, the cylindrical lens 12, and the light shielding plate 14 is arranged in four directions perpendicular to the center line of the ellipsoidal reflecting mirror 6.

16 is a heat-resistant shield glass for protecting the internal optical system of the device from gas or dust generated during processing, and 21 is an inlet for cooling fluid sent into the device from a cooling fluid generator (not shown). be.

Next, the operation of this device will be explained.

Thermal rays generated radially from the point light source 5 are reflected by the ellipsoidal reflector 6 to form an optical path a,
The light is reflected in four directions by the four first plane mirrors 9 to form an optical path b.

The light beam on the optical path b is further reflected by the second plane mirror 10 to form an optical path c, and enters the cylindrical lens 12.

The cylindrical lens 12 is set at an angle perpendicular to the optical path c and at a position where a sufficient amount of light can be incident. The light beam forms a linear spot 17 and irradiates the vicinity of the lead wire of the electronic component 18, which is the workpiece.

FIG. 2 shows the electronic component 1 of this linear spot 17.
8 shows the irradiation situation around the lead wire 8. In the entire process, paste-like solder on the circuit board 19 is applied to this part, so the solder is melted by this irradiation and soldering is performed.

Therefore, the only thermal effect on the electronic component 18 is heat conduction through the lead wires.

Next, a case where the size of the electronic component 18 or the shape of the soldering location changes will be described.

First, in order to change the position of the linear spot 17, the moving mechanisms 11 and 13 move the second optical system facing each other.
A plane mirror 10 and a cylindrical lens 12 are moved as a set in conjunction with each other in opposite directions.

Therefore, the linear spots 17, the opposing linear spots 17a and 17a, and 17b and 17b move in opposite directions to increase or decrease the distance between them to correspond to changes in the soldering position.

In order to change the length of the linear spot 17,
Each of the light shielding plates 14 is moved in the direction of the arrow in FIG. 4 to increase or decrease the interval therebetween, thereby appropriately shielding the optical path c incident on the cylindrical lens 12.

Thereby, the length of the emitted light beam that is not focused by the cylindrical lens 12 is adjusted, and the length of the linear spot 17 is adjusted.

When the soldering position is only on the opposite side of the electronic component 18, the opposite linear spot 17
Either one of a and 17b is completely shielded from light by the light shielding plate 14, and the linear spot 17a or 1 that is not shielded from light is
Heat processing is performed only on 7b to prevent heating of unnecessary parts.

In the above embodiment, the moving mechanisms 11 and 13 and the opening/closing mechanism 15 each have an independent drive source,
Although it is operated in this way, it is also possible to construct a constant operating ratio using a single drive source using a speed reduction mechanism and to synchronize the speed reduction mechanism. Further, the operation method may be parallel movement, rotational movement, or a combination thereof.

Further, although the ellipsoidal reflecting mirror 6 is used, a parabolic reflecting mirror may also be used. In this case, the reflected light rays will be close to parallel rays, so the first plane mirror 9, the second plane mirror 10 The installation situation of the cylindrical lens 12 also needs to be changed accordingly.

Furthermore, in the above embodiment, four linear spots 17 are formed using four optical systems, but depending on the number of parts to be heated, the number of optical systems may be increased or decreased to suit the task. It can also be adapted.

Although the above embodiments are used to solder electronic components, it can also be used in non-contact heating processing equipment for heated workpieces that are heated at multiple locations and where heat influence on other parts is a problem. However, the same effects as in this embodiment can be expected.

[Effect of idea]

As mentioned above, the present invention can form multiple linear spots with one light source, so it is possible to simultaneously heat and solder many terminals on the four sides of a flat package type electronic component. The work time can be greatly shortened, the thermal effect on electronic components is reduced, and it is also possible to handle irregularly shaped components.

Since soldering at a plurality of locations is simultaneously melted and solidified, a self-alignment effect is produced, improving positional accuracy and reducing stress and strain, thereby improving reliability.

Furthermore, since the first plane mirror blocks the heat rays hitting the cathode of the arc light source lamp, heating of the cathode is prevented, extending the life of the lamp.
There are effects such as being able to maintain work for a long time.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of one embodiment of the present invention, Fig. 2 is a plan view showing the state of the linear spot, Figs. 3 and 4 are side and front views of the light shielding plate portion, and Fig. 5. 1 is a principle diagram of a conventional light beam heating processing device. 4...Arc heat light source lamp, 5...Point light source, 6
...Ellipsoidal reflecting mirror, 9...First plane mirror, 10
...Second plane mirror, 12... Cylindrical lens, 1... Light shielding plate.

Claims (1)

[Scope of utility model registration request] A point light source, a reflecting mirror such as an ellipsoid or paraboloid that reflects the light rays from the point light source into condensed rays or parallel rays, and an optical path provided on the path of the reflected rays by the reflecting mirror. It is characterized by comprising a plurality of mirrors that split the light beam and adjust the angle of the light beam, and an optical system that focuses the light beam in only one direction, such as a cylindrical lens that focuses the light beam reflected by the mirror into a linear shape. A heating processing device that uses a light beam.