JPH0438893Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] During the process of manufacturing the enamel board, there is a work of separating the joint 14 between the board 11 and the edge crosspiece 12 (second
(see figure).

This invention relates to a cutting mold for hollow substrates used for cutting off the tethers 14.

[Conventional technology] An example is shown in FIG.

It consists of an upper mold 16 and a lower mold 22, and the joints 14 at four locations, for example, are cut at the same time by a punch 18.

In order to prevent damage to the substrate 11 during cutting,
Urethane rubber 20 is placed around the punch 18 of the upper die 16.
It has a structure in which shock is absorbed by incorporating the urethane rubber 20, and contact with the substrate 11 is made only by the urethane rubber 20, which is a very small area.

However, the entire surface of the lower mold 22 is flat, and the entire surface of the substrate 11 is in contact with the metal portion thereof.

Note that 26 is a die.

[Problems to be solved by the invention] As mentioned above, there are, for example, four places on one board 11 where the edge crosspiece 12 is cut, and these are cut at the same time, but the board is coated with enamel. Because of this, the enamel powder is scattered widely on the mold surface each time it is cut.

As described above, damage to the back surface of the substrate 11 was prevented by the impact absorption of the urethane rubber 20 of the upper mold 16, but scattering of the enamel powder could not be avoided.

In conventional presses of this type, after one cut, the scattered enamel powder was removed using a spray gun and brush, and the next cut was made in a clean state. There were many cases where it could not be completely removed.

In addition, since enamel powder is always wet with punch oil (dropped onto the cut part of the metal to protect the metal and maintain the normal shape of the cut part of the board), it can be removed by spraying with compressed air or by brushing. had become even more difficult.

Then, the substrate 11 and the edge crosspiece 12 may be press-cut on the remaining enamel powder, causing white dot-like scratches on the back surface of the substrate.

These scratches can lead to serious defects resulting in poor insulation, and must be completely eliminated.

[Means for solving the problem] As shown in Fig. 1, (1) only the part of the die 26 of the lower mold is made higher than the lower mold surface 24 in correspondence with the punching area; (2) its height is increased; (3) The punch 18 is surrounded by urethane rubber (2)0.

If the protruding height of the die 26 is too high, the workpiece 10 will be misplaced, and when you try to slide it sideways and return it to the correct position, the edge of the workpiece will touch the die 2.
6, the workability deteriorates.

However, if the height of the die is 1 mm or less, it can be moved sideways without getting caught.

Therefore, the upper limit of the height of the die 26 is 1 mm.

Also, from the perspective of not being attracted to
The lower the protruding height of the dice, the better.
If it is too low, the center of the board may vibrate due to the impact when the joint is cut, and may come into contact with the lower mold surface and cause damage.

When the punch 18 is surrounded by urethane rubber 20, the impact during cutting is absorbed, and the vibration amplitude is reduced to 0.5 mm or less vertically.

Therefore, if the height of the die is set to 0.5 mm or more, even if the substrate vibrates during cutting, there is no need for it to come into contact with the lower die surface. From this, the lower limit of the die height is 0.5 mm.

In addition, the compressed air outlet is installed so as to face the surface of the die 26, and when one cutting is completed,
For example, the structure is such that spraying can be performed simultaneously on the 26 surfaces of the die at four locations.

Furthermore, depending on the type of cutting die, there are many cases in which the outline of the die 26 reaches onto the surface of the substrate other than the cutting part, and when cutting, the edge part of the die that is higher than the lower mold surface 24 allows In anticipation of damage to the back side of the substrate, all edges of the die 26 are chamfered to prevent damage to the back side of the substrate.

If the area of the substrate 11 near the joint 14 is notched inward as shown in FIG. 2, the contact area with the die surface is reduced, and the urethane 20 surrounding the punch 18 during cutting is prevented from being crushed.
Combined with the use of, the impact transmitted to the board can be reduced.

[Operations and effects of the invention] (1) Since the lower part of the die is higher than the lower part of the die corresponding to the punching area,
When the workpiece is set on the mold surface, the substrate is
No contact with the lower die surface except for the die part.

Therefore, even if enamel powder is scattered on the surface of the lower mold, if there is no enamel powder only on the die surface, the back side of the substrate will not be damaged.

Furthermore, since the enamel powder can be checked only on the die before setting the workpiece, work efficiency is improved.

(2) If the protruding height of the die is too high, the workpiece will be placed in a different position, and when you try to slide it sideways and return it to the correct position, the edge of the workpiece will get caught on the die, making workability worse. .

However, in this invention, the height of the die is 1
Since it is less than mm, it can be moved sideways without getting caught.

(3) From the standpoint of not sticking, the lower the die protrusion height, the better; however, if it is too low, the impact when the bond is cut will cause the center of the board to vibrate, causing damage to the lower mold surface. There is a risk of injury if you come into contact with it.

However, in the present invention, since the punch is surrounded by urethane rubber, the shock during cutting is absorbed, and the vibration amplitude is reduced to 0.5 mm or less vertically.
And since the height of the die is 0.5mm or more,
There is no need to worry about contact with the lower mold surface.

In addition, 100 pieces of workpieces 10 were cut using a cutting die in which the die 26 was set 0.8 mm higher than the lower die surface 24, and the shape of the cut portion, the state of the enamel film, dotted scratches on the back side, and die contact on the back side were observed. As a result of observing the appearance and condition of the vicinity of the
A quick glance confirmed that the cutting was done normally without any problems.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of an embodiment of the present invention, FIG. 2 is an explanatory diagram of a work to be cut, and FIG. 3 is an explanatory diagram of a conventional technique. 10...Workpiece, 11...Substrate, 12...Edge piece, 14...Connector, 16...Upper die, 18...Punch, 20...Urethane rubber, 22...Lower die, 2
4...lower mold side, 26...dice.

Claims (1)

[Scope of utility model registration request] It is a device that separates the enamel board from the edge bars on both sides by press punching, and only the die part of the lower mold is higher than the lower mold surface, corresponding to the punching location, and the height is 0.5 to 1.0 mm. A device for separating enamel substrates, characterized in that the punch is surrounded by urethane rubber.