JPH0438524Y2 - - Google Patents
Info
- Publication number
- JPH0438524Y2 JPH0438524Y2 JP1986195595U JP19559586U JPH0438524Y2 JP H0438524 Y2 JPH0438524 Y2 JP H0438524Y2 JP 1986195595 U JP1986195595 U JP 1986195595U JP 19559586 U JP19559586 U JP 19559586U JP H0438524 Y2 JPH0438524 Y2 JP H0438524Y2
- Authority
- JP
- Japan
- Prior art keywords
- terrace
- electrode metal
- solder
- metal plate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/60—
-
- H10W72/076—
-
- H10W72/07653—
-
- H10W72/631—
-
- H10W72/886—
-
- H10W72/983—
-
- H10W90/736—
-
- H10W90/766—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195595U JPH0438524Y2 (esLanguage) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195595U JPH0438524Y2 (esLanguage) | 1986-12-19 | 1986-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63100847U JPS63100847U (esLanguage) | 1988-06-30 |
| JPH0438524Y2 true JPH0438524Y2 (esLanguage) | 1992-09-09 |
Family
ID=31153625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986195595U Expired JPH0438524Y2 (esLanguage) | 1986-12-19 | 1986-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438524Y2 (esLanguage) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108206163A (zh) * | 2016-12-19 | 2018-06-26 | 安世有限公司 | Ic封装件中夹布置的半导体器件和方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4935803A (en) * | 1988-09-09 | 1990-06-19 | Motorola, Inc. | Self-centering electrode for power devices |
| US5001545A (en) * | 1988-09-09 | 1991-03-19 | Motorola, Inc. | Formed top contact for non-flat semiconductor devices |
| JP4645276B2 (ja) * | 2005-04-12 | 2011-03-09 | 富士電機システムズ株式会社 | 半導体装置 |
| JP6479036B2 (ja) * | 2014-10-30 | 2019-03-06 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5313877A (en) * | 1976-07-23 | 1978-02-07 | Hitachi Ltd | Semiconductor device |
-
1986
- 1986-12-19 JP JP1986195595U patent/JPH0438524Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108206163A (zh) * | 2016-12-19 | 2018-06-26 | 安世有限公司 | Ic封装件中夹布置的半导体器件和方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63100847U (esLanguage) | 1988-06-30 |
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