JPH0438524Y2 - - Google Patents

Info

Publication number
JPH0438524Y2
JPH0438524Y2 JP1986195595U JP19559586U JPH0438524Y2 JP H0438524 Y2 JPH0438524 Y2 JP H0438524Y2 JP 1986195595 U JP1986195595 U JP 1986195595U JP 19559586 U JP19559586 U JP 19559586U JP H0438524 Y2 JPH0438524 Y2 JP H0438524Y2
Authority
JP
Japan
Prior art keywords
terrace
electrode metal
solder
metal plate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986195595U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63100847U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986195595U priority Critical patent/JPH0438524Y2/ja
Publication of JPS63100847U publication Critical patent/JPS63100847U/ja
Application granted granted Critical
Publication of JPH0438524Y2 publication Critical patent/JPH0438524Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/60—
    • H10W72/076—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247—Connecting the strap to a bond pad of the item
    • H10W72/07653—
    • H10W72/631—
    • H10W72/886—
    • H10W72/983—
    • H10W90/736—

Landscapes

  • Wire Bonding (AREA)
JP1986195595U 1986-12-19 1986-12-19 Expired JPH0438524Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986195595U JPH0438524Y2 (enExample) 1986-12-19 1986-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986195595U JPH0438524Y2 (enExample) 1986-12-19 1986-12-19

Publications (2)

Publication Number Publication Date
JPS63100847U JPS63100847U (enExample) 1988-06-30
JPH0438524Y2 true JPH0438524Y2 (enExample) 1992-09-09

Family

ID=31153625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986195595U Expired JPH0438524Y2 (enExample) 1986-12-19 1986-12-19

Country Status (1)

Country Link
JP (1) JPH0438524Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108206163A (zh) * 2016-12-19 2018-06-26 安世有限公司 Ic封装件中夹布置的半导体器件和方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001545A (en) * 1988-09-09 1991-03-19 Motorola, Inc. Formed top contact for non-flat semiconductor devices
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
JP4645276B2 (ja) * 2005-04-12 2011-03-09 富士電機システムズ株式会社 半導体装置
JP6479036B2 (ja) * 2014-10-30 2019-03-06 三菱電機株式会社 半導体装置及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313877A (en) * 1976-07-23 1978-02-07 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108206163A (zh) * 2016-12-19 2018-06-26 安世有限公司 Ic封装件中夹布置的半导体器件和方法

Also Published As

Publication number Publication date
JPS63100847U (enExample) 1988-06-30

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