JPH0438080U - - Google Patents

Info

Publication number
JPH0438080U
JPH0438080U JP8140690U JP8140690U JPH0438080U JP H0438080 U JPH0438080 U JP H0438080U JP 8140690 U JP8140690 U JP 8140690U JP 8140690 U JP8140690 U JP 8140690U JP H0438080 U JPH0438080 U JP H0438080U
Authority
JP
Japan
Prior art keywords
laminate
main surfaces
chip
connection component
type multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8140690U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8140690U priority Critical patent/JPH0438080U/ja
Publication of JPH0438080U publication Critical patent/JPH0438080U/ja
Pending legal-status Critical Current

Links

JP8140690U 1990-07-30 1990-07-30 Pending JPH0438080U (enEXAMPLES)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8140690U JPH0438080U (enEXAMPLES) 1990-07-30 1990-07-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8140690U JPH0438080U (enEXAMPLES) 1990-07-30 1990-07-30

Publications (1)

Publication Number Publication Date
JPH0438080U true JPH0438080U (enEXAMPLES) 1992-03-31

Family

ID=31627325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8140690U Pending JPH0438080U (enEXAMPLES) 1990-07-30 1990-07-30

Country Status (1)

Country Link
JP (1) JPH0438080U (enEXAMPLES)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023519145A (ja) * 2020-03-23 2023-05-10 クアルコム，インコーポレイテッド 基板と基板に結合された高密度相互接続集積デバイスとを含むパッケージ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544776A (en) * 1978-09-26 1980-03-29 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS55158693A (en) * 1979-05-30 1980-12-10 Fujitsu Ltd Hybrid integrated circuit
JPS5739461B2 (enEXAMPLES) * 1975-06-12 1982-08-21
JPS5911577B2 (ja) * 1979-04-04 1984-03-16 メルク・シヤ−プ・エンド・ド−ム（アイ・エ−）コ−ポレ−シヨン ２−ヒドロキシ−６，９−メタノ−１１−アミノ−５，６，７，８，９，１０−ヘキサヒドロ−ベンゾシクロオクテンのアミノ誘導体
JPS6388773A (ja) * 1986-10-01 1988-04-19 松下電器産業株式会社 マグネツト・ワイヤ−とリ−ド線の接続方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739461B2 (enEXAMPLES) * 1975-06-12 1982-08-21
JPS5544776A (en) * 1978-09-26 1980-03-29 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS5911577B2 (ja) * 1979-04-04 1984-03-16 メルク・シヤ−プ・エンド・ド−ム（アイ・エ−）コ−ポレ−シヨン ２−ヒドロキシ−６，９−メタノ−１１−アミノ−５，６，７，８，９，１０−ヘキサヒドロ−ベンゾシクロオクテンのアミノ誘導体
JPS55158693A (en) * 1979-05-30 1980-12-10 Fujitsu Ltd Hybrid integrated circuit
JPS6388773A (ja) * 1986-10-01 1988-04-19 松下電器産業株式会社 マグネツト・ワイヤ−とリ−ド線の接続方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023519145A (ja) * 2020-03-23 2023-05-10 クアルコム，インコーポレイテッド 基板と基板に結合された高密度相互接続集積デバイスとを含むパッケージ

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