JPH0438066U - - Google Patents
Info
- Publication number
- JPH0438066U JPH0438066U JP1990080929U JP8092990U JPH0438066U JP H0438066 U JPH0438066 U JP H0438066U JP 1990080929 U JP1990080929 U JP 1990080929U JP 8092990 U JP8092990 U JP 8092990U JP H0438066 U JPH0438066 U JP H0438066U
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- circuit
- element chip
- infrared
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Optical Communication System (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990080929U JP2556376Y2 (ja) | 1990-07-30 | 1990-07-30 | 赤外線受光装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990080929U JP2556376Y2 (ja) | 1990-07-30 | 1990-07-30 | 赤外線受光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0438066U true JPH0438066U (enExample) | 1992-03-31 |
| JP2556376Y2 JP2556376Y2 (ja) | 1997-12-03 |
Family
ID=31626410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990080929U Expired - Lifetime JP2556376Y2 (ja) | 1990-07-30 | 1990-07-30 | 赤外線受光装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2556376Y2 (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310573U (enExample) * | 1986-07-09 | 1988-01-23 | ||
| JPH0432544U (enExample) * | 1990-07-13 | 1992-03-17 | ||
| JP3013758U (ja) * | 1995-01-19 | 1995-07-18 | ゼネラルパッカー株式会社 | 真空包装装置 |
-
1990
- 1990-07-30 JP JP1990080929U patent/JP2556376Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310573U (enExample) * | 1986-07-09 | 1988-01-23 | ||
| JPH0432544U (enExample) * | 1990-07-13 | 1992-03-17 | ||
| JP3013758U (ja) * | 1995-01-19 | 1995-07-18 | ゼネラルパッカー株式会社 | 真空包装装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2556376Y2 (ja) | 1997-12-03 |