JPH0438047U - - Google Patents
Info
- Publication number
- JPH0438047U JPH0438047U JP7971890U JP7971890U JPH0438047U JP H0438047 U JPH0438047 U JP H0438047U JP 7971890 U JP7971890 U JP 7971890U JP 7971890 U JP7971890 U JP 7971890U JP H0438047 U JPH0438047 U JP H0438047U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- outside air
- gas conditions
- view
- component package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 2
- 230000005856 abnormality Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
Description
第１図〜第７図は本考案の第１実施例の説明図
であり、第１図は実施例の装置におけるパツケー
ジ内部の平面図、第２図はパツケージ外観の側面
図、第３図及び第４図はパツケージの封止性が損
なわれ易い箇所を示す図、第５図ａは湿度センサ
の一例を示す平面図、同図ｂは同側断面図、第６
図ａは湿度センサの他の例を示す平面図、第６図
ｂは同側断面図、第７図は湿度検出回路を示す図
である。第８図〜第１０図は本考案の第２実施例
の説明図であり、第８図は実施例の装置における
パツケージ内部の平面図、第９図は圧力センサの
一例を示す側断面図、第１０図は圧力検出回路を
示す図である。第１１図〜第１５図は本考案の第
３実施例の説明図であり、第１１図は実施例の装
置におけるパツケージ内部の平面図、第１２図ａ
は酸素センサの一例を示す平面図、第１２図ｂは
同側面図、第１３図は上記酸素センサ５３を構成
するヒータ基板５５の平面図、第１４図は酸素セ
ンサ基板５６の平面図、第１５図は酸素検出回路
を示す図である。
１Ａ，１Ｂ，１Ｃ……加速度センサ、４……パ
ツケージ、１３，１３ａ，１３ｂ……湿度センサ
、３３……圧力センサ、５３……酸素センサ。
1 to 7 are explanatory diagrams of the first embodiment of the present invention, in which FIG. 1 is a plan view of the inside of the package in the device of the embodiment, FIG. 2 is a side view of the exterior of the package, and FIGS. Fig. 4 is a diagram showing locations where the sealing performance of the package is likely to be impaired, Fig. 5 a is a plan view showing an example of a humidity sensor, Fig. 5 b is a sectional view of the same side, and Fig.
FIG. 6a is a plan view showing another example of the humidity sensor, FIG. 6b is a sectional view of the same side, and FIG. 7 is a diagram showing a humidity detection circuit. 8 to 10 are explanatory diagrams of a second embodiment of the present invention, in which FIG. 8 is a plan view of the inside of the package in the device of the embodiment, and FIG. 9 is a side sectional view showing an example of a pressure sensor. FIG. 10 is a diagram showing the pressure detection circuit. 11 to 15 are explanatory diagrams of the third embodiment of the present invention, FIG. 11 is a plan view of the inside of the package in the device of the embodiment, and FIG. 12 a
is a plan view showing an example of an oxygen sensor, FIG. 12b is a side view of the same, FIG. 13 is a plan view of the heater board 55 that constitutes the oxygen sensor 53, and FIG. FIG. 15 is a diagram showing the oxygen detection circuit. 1A, 1B, 1C... Acceleration sensor, 4... Package, 13, 13a, 13b... Humidity sensor, 33... Pressure sensor, 53... Oxygen sensor.
Claims (1)
ス条件に保持された電子部品用パツケージの内部
に、同内部のガス条件が外気のガス条件に近付い
たことを検出する異常検知センサを組み込んだこ
とを特徴とする電子部品用パツケージの封止性検
知装置。 An abnormality detection sensor that detects when the gas conditions inside the electronic component package approach the gas conditions of the outside air is installed inside an electronic component package whose inside is isolated from the outside air and maintained under gas conditions different from the outside air. A sealing performance detection device for electronic component packages, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990079718U JP2530272Y2 (en) | 1990-07-30 | 1990-07-30 | Electronic component package sealing detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990079718U JP2530272Y2 (en) | 1990-07-30 | 1990-07-30 | Electronic component package sealing detection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0438047U true JPH0438047U (en) | 1992-03-31 |
| JP2530272Y2 JP2530272Y2 (en) | 1997-03-26 |
Family
ID=31624130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990079718U Expired - Lifetime JP2530272Y2 (en) | 1990-07-30 | 1990-07-30 | Electronic component package sealing detection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2530272Y2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007248416A (en) * | 2006-03-20 | 2007-09-27 | Musashino Kiki Kk | Level gage |
| JP2009019977A (en) * | 2007-07-11 | 2009-01-29 | Taiyo Nippon Sanso Corp | Leak tester and leak testing method |
| JP2009085678A (en) * | 2007-09-28 | 2009-04-23 | Akim Kk | Leakage inspection device for sensor and leakage inspection method for sensor |
| JP2011021964A (en) * | 2009-07-15 | 2011-02-03 | Mtc:Kk | Seal performance measuring instrument |
| JP2012163539A (en) * | 2011-02-09 | 2012-08-30 | Ulvac Japan Ltd | Sealed device |
| JP2014119456A (en) * | 2012-12-13 | 2014-06-30 | Tesat-Spacecom Gmbh & Co Kg | Method for testing airtightness of package |
| WO2020100208A1 (en) * | 2018-11-13 | 2020-05-22 | 三菱電機株式会社 | Semiconductor device and semiconductor device leak inspection method |
| JP2021512282A (en) * | 2018-02-01 | 2021-05-13 | ピーピージー・インダストリーズ・オハイオ・インコーポレイテッドＰＰＧ Ｉｎｄｕｓｔｒｉｅｓ Ｏｈｉｏ，Ｉｎｃ． | Complex impedance moisture sensor and sensing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279376A (en) * | 1985-10-02 | 1987-04-11 | Hitachi Ltd | Evaluation of moisture resistance for semiconductor device |
| JPS634651A (en) * | 1986-06-25 | 1988-01-09 | Hitachi Ltd | Semiconductor device |
-
1990
- 1990-07-30 JP JP1990079718U patent/JP2530272Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279376A (en) * | 1985-10-02 | 1987-04-11 | Hitachi Ltd | Evaluation of moisture resistance for semiconductor device |
| JPS634651A (en) * | 1986-06-25 | 1988-01-09 | Hitachi Ltd | Semiconductor device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007248416A (en) * | 2006-03-20 | 2007-09-27 | Musashino Kiki Kk | Level gage |
| JP2009019977A (en) * | 2007-07-11 | 2009-01-29 | Taiyo Nippon Sanso Corp | Leak tester and leak testing method |
| JP2009085678A (en) * | 2007-09-28 | 2009-04-23 | Akim Kk | Leakage inspection device for sensor and leakage inspection method for sensor |
| JP2011021964A (en) * | 2009-07-15 | 2011-02-03 | Mtc:Kk | Seal performance measuring instrument |
| JP2012163539A (en) * | 2011-02-09 | 2012-08-30 | Ulvac Japan Ltd | Sealed device |
| JP2014119456A (en) * | 2012-12-13 | 2014-06-30 | Tesat-Spacecom Gmbh & Co Kg | Method for testing airtightness of package |
| JP2021512282A (en) * | 2018-02-01 | 2021-05-13 | ピーピージー・インダストリーズ・オハイオ・インコーポレイテッドＰＰＧ Ｉｎｄｕｓｔｒｉｅｓ Ｏｈｉｏ，Ｉｎｃ． | Complex impedance moisture sensor and sensing method |
| WO2020100208A1 (en) * | 2018-11-13 | 2020-05-22 | 三菱電機株式会社 | Semiconductor device and semiconductor device leak inspection method |
| JPWO2020100208A1 (en) * | 2018-11-13 | 2021-04-01 | 三菱電機株式会社 | Leak inspection method for semiconductor devices and semiconductor devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2530272Y2 (en) | 1997-03-26 |
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