JPH0438042U - - Google Patents
Info
- Publication number
- JPH0438042U JPH0438042U JP8015790U JP8015790U JPH0438042U JP H0438042 U JPH0438042 U JP H0438042U JP 8015790 U JP8015790 U JP 8015790U JP 8015790 U JP8015790 U JP 8015790U JP H0438042 U JPH0438042 U JP H0438042U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- paste
- roller
- supply stage
- bonding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 239000008188 pellet Substances 0.000 claims description 4
- 238000004898 kneading Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015790U JPH0438042U (enExample) | 1990-07-27 | 1990-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015790U JPH0438042U (enExample) | 1990-07-27 | 1990-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438042U true JPH0438042U (enExample) | 1992-03-31 |
Family
ID=31624962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8015790U Pending JPH0438042U (enExample) | 1990-07-27 | 1990-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438042U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0661280A (ja) * | 1992-08-12 | 1994-03-04 | Toshiba Corp | 半導体装置の製造装置 |
-
1990
- 1990-07-27 JP JP8015790U patent/JPH0438042U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0661280A (ja) * | 1992-08-12 | 1994-03-04 | Toshiba Corp | 半導体装置の製造装置 |