JPH04367457A - Cover tape film and mounting part package using the same - Google Patents

Abstract

PURPOSE:To provide a part mounting package whose surface resistance is not increased even if it is exposed to a high temp. and humidity for a long time and which is excellent in transparency and free from sticking and does not need cleaning for a long time. CONSTITUTION:On the surface of a transparent plastic film 1 is provided a transparent conductive resin layer 2 consisting of the fine powder of tin oxide compound and/or indium oxide compound having an average particle size of at most 0.3mum in diameter and a binder resin. The rear side thereof is constituted of a transparent composite cover film having thereon a hot melt adhesive layer 3 and a carrier tape 5 having part receiving recess parts 4 provided successively on an antistatic or conductive resin sheet. The carrier tape 5 is heat sealed to the rear side of the film with the hot melt adhesive layer in an easy- to-open manner.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a mounted component package used for storing and transporting various electronic components, precision components, and surface mount components such as ICs, especially active components susceptible to electrostatic damage such as ICs, and Regarding the cover tape film used.

0002

[Prior Art] Generally, as a cover tape film for a carrier tape, a biaxially oriented polyester film or a two-layer polyester/polyolefin coextruded film with a thickness of 10 to 50 μm is used as a base film, and an easy-open adhesive layer is added to this base film. As, styrene-butadiene-
Styrene block copolymer resin, ethylene-vinyl acetate copolymer resin alone or blended with polybutene, nylon resin, polyurethane resin, etc.
Those formed with a thickness of 0 μm by a film lamination method or a coating method are widely used.

[0003] This cover tape film is a carrier tape in which recesses (hereinafter referred to as cavities) for storing surface-mounted components are continuously formed in an antistatic or conductive resin sheet, and the various components are stored in the carrier tape and then a lid is placed on the carrier tape. Both ends of the cover tape film are heat-sealed and bonded to the carrier tape, which prevents components from falling off during storage and transportation, and prevents them from being peeled off from the carrier tape body when mounting components using an automatic mounting machine such as a chip mounter. It is used in

0004

[Problems to be Solved by the Invention] In this way, the cover tape film is unwound during its manufacturing process and usage process.
As the cover tape is peeled off from the carrier tape at the same time as it is wound several times, electricity transfers during peeling, and the film itself is easily charged. There are problems such as parts electrostatically adhering to the cover tape film side and falling out of the carrier tape cavity or being misaligned, making automatic mounting difficult, and complementary MOS-IC, transistor, transistor logic. , field effect MO
Semiconductor elements (generally referred to as active components) that are sensitive to static electricity, such as S-transistors, bipolar transistors, and Schottky diodes, suffer from electrostatic damage due to discharge when they come into contact with a charged cover tape film. Therefore, these cover tape films are generally made by incorporating an antistatic agent into the heat-sealing adhesive layer, depositing metal or metal oxide on the surface, or coating the surface with the antistatic agent to form a thin film. It is used as Further, it is said that the surface resistance of a cover tape film to obtain an antistatic effect is required to be 10 9 Ω or less, preferably 10 7 Ω or less.

[0005] As an effective means for providing such an antistatic effect, there is a method of adding conductive powder such as carbon black or fine metal powder to the adhesive layer. Transparency is required because it is necessary to check the characters and perform a visual inspection, so it cannot be used practically. Therefore, as a method to increase the conductivity of the top tape film surface, antistatic methods using transparent or translucent surfactants, such as anionic surfactants, cationic surfactants, nonionic surfactants, amphoteric surfactants, etc. A commonly used method is to knead a surfactant into the adhesive layer of the film or coat the surface of the film to impart hydrophilicity and ionicity to the surface of the cover tape film. Surfactants used in such antistatic agents include aliphatic quaternary ammonium salt type cationic surfactants, carboxybetaine type amphoteric surfactants, and anionic surfactants such as higher alcohol phosphate ester sodium salts. Examples include nonionic surfactants such as surfactants, polyoxyethylene sorbitan fatty acid esters, and polyoxyethylene alkyl amines.

The above-mentioned antistatic agent is commercially available in the form of a powder, an aqueous solution, or an oil solution, and is used by being kneaded into the heat-sealing adhesive layer or by coating the surface of the film. However, ■Generally, surfactants have the following properties on the film surface: -COO- M+, -OSO3-M+, (
The above M is an element atom such as H, Na, K, etc.), [-N(C
H3)2 -]+ X- (X is a halogen element atom such as Cl or Br), -OH, -(CH2CH2O)n -
Hydrophilic groups such as these are arranged toward the atmosphere, and their hygroscopicity lowers the electrical resistance.
45 to 85% RH), the surface resistance is 109 Ω or more, and it is not useful for preventing the electrostatic damage of semiconductor elements described above. Compatibility becomes a problem, and if the compatibility is poor, it may bleed onto the surface of the adhesive layer and deteriorate the heat-sealing performance.■ Coatings applied to the film surface may dissolve in moisture and become electrostatically charged. There were problems such as the prevention effect being easily lost.

In order to solve these problems, the present inventor first developed an organic conductor, 7,7,8,8,-tetracyanoquinodimethane complex (hereinafter abbreviated as TCNQ complex), in which the donor was Attempts have been made to improve heat resistance and reliability by mixing several types of different complexes, and TCNQ with alkyl group substitution has been made.
Attempts have been made to use complexes. However, these T.C.
When an NQ complex is used, the TCNQ complex interacts with the donor and TC.
Because it is an ionic bond of NQ, high temperature and high humidity conditions (60℃
At the same time, there is a problem that the conductivity decreases when stored for a long period of time under conditions such as The resin is coated on a base film, and the solvent is evaporated and dried to precipitate needle-shaped crystals in the matrix resin, and the needle-shaped crystals come into contact with each other to obtain conductivity. Therefore, these acicular crystals protrude from the polymer matrix resin layer, and when heat sealing is performed for a long time in actual use, the acicular crystals protruding from the matrix resin layer may break on the heated seal head surface. The adhered crystals not only dirty the seal head, but also become sticky due to the heat of the seal head, lifting the cover tape and making it impossible to seal, so it was necessary to periodically clean the seal head. Furthermore, when electronic components are contained in the cavity of the carrier tape and the cover tape is sealed and taping is completed, an inspection is performed to visually confirm the orientation of the electronic components contained therein and whether or not they are unfilled. At this testing stage, there is the problem that the needle-shaped crystals of TCNQ adhere to the gloves of the inspector, and at the same time, the fine crystals of this TCNQ complex adhere to electronic components, reducing solderability. There were such problems.

[0008] In addition, instead of using an organic conductor such as the above-mentioned TCNQ complex, it is possible to improve reliability under high temperature and high humidity conditions.
In order to solve problems such as adhesion to seal heads, various studies were conducted on metal oxide conductive materials.
Although there were no problems in terms of reliability, conductivity, and adhesion to the seal head under high temperature and high humidity conditions, there was a problem in that sufficient transparency could not be obtained.

[0009]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the inventors of the present invention have conducted intensive studies on the type and particle size of the above-mentioned transparent conductive material, and have found that the average A transparent composite cover tape film provided with a transparent conductive resin layer consisting of fine powder of a tin oxide compound and/or indium oxide compound with a particle size of 0.3 μm or less and a binder resin, and a hot melt adhesive layer provided on the back side. and a carrier tape comprising an antistatic or conductive resin sheet with continuous recesses for accommodating the mounted components, and the carrier tape is heat-sealed with the hot melt adhesive layer for easy opening. The present invention was completed by discovering a mounted component package characterized by the following.

The present invention will be explained in detail below with reference to the drawings. As shown in FIG. 1(a), the cover tape film of the present invention has a transparent conductive resin layer 2 on the surface of a transparent plastic film 1, and an easy-open hot melt adhesive layer 3 on the back surface.
As shown in (b), a carrier tape 5 having continuous recesses 4 for accommodating mounted components is heat-sealed by this. As mentioned above, the transparent conductive material is a tin oxide compound or an indium oxide compound, and these compounds include tin oxide, indium oxide alone, and tin oxide or indium oxide doped with a different element. Examples of the different elements to be doped include antimony, fluorine, phosphorus, etc., as well as tin for indium and indium for tin. By doping with these different elements, conductivity can be improved. If the particle size of these transparent conductive materials is too large, when combined with a binder resin to form a transparent conductive resin layer,
Visible light is diffusely reflected by the conductive material particles, reducing light transmittance, and the conductive material particles protrude on the surface of the binder resin, forming fine irregularities and increasing the haze of the film. To avoid the problem of decreased transparency, the average particle size of the transparent conductive material is 0.3 μm or less, which is shorter than the wavelength of visible light, and 90% or more of the particles are 0.3 μm or less.
．． It may be within the range of 5 μm or less. However, if the average particle size is smaller than 0.05 μm, the surface resistance of the resulting transparent conductive resin layer may increase significantly and become higher than the above-mentioned required surface resistance. It is preferably in the range of 0.05 to 0.3 μm.

[0011] As a method for producing these fine particles, tin or indium compounds that are water-soluble and can be hydrolyzed in a weakly alkaline region of pH 8 to 12, such as potassium stannate, sodium stannate, indium nitrate, or sulfuric acid, are used. It can be obtained by hydrolyzing indium or the like in the above-mentioned weak alkaline region to generate a sol, filtering the sol, then drying and firing. In addition, when it is desired to dope a different element as mentioned above, each element can be doped by dissolving a water-soluble compound of the doping element, for example, potassium antimonyl tartrate in the case of antimony, or ammonium fluoride in the case of fluorine. A fine powder can be obtained.

The cover tape of the present invention is prepared by blending and dispersing the transparent conductive fine powder obtained as described above in a binder resin dissolved in a suitable solvent to form a conductive ink. It is obtained by coating a film using an appropriate method to form a transparent conductive resin layer, and forming an easily openable hot melt adhesive layer on the opposite side of the plastic film. The binder resin used to blend and disperse the transparent conductive powder needs to have high adhesion and transparency to the transparent plastic film used. Furthermore, since the transparent conductive resin layer is preferably formed by coating as described above, the binder resin needs to be dissolved in a general-purpose solvent, and in actual use, it is heat-sealed. Therefore, if the binder resin softens and becomes sticky when it comes into contact with a heated seal head, a sticking phenomenon occurs in which the cover tape film adheres to the seal head, which hinders sealing operations. It must have heat resistance so that it does not become sticky even if it is brought into contact with the head for a predetermined period of time.

Typical binder resins include thermosetting polyurethane (PU), saturated copolymer polyester with a high glass transition point, epoxy resin (EP), phenolic resin (PF), and polymethyl methacrylate (PMMA). polyacrylate, polycarbonate (PC)
, urea resin, melamine resin, alkyd resin, nylon 11 and 12, polyvinyl butyral (PVB),
It is preferable to use a single substance or a mixture of two or more of polyvinyl alcohol (PVA), fluororesin, silicone resin (SR), etc. In order to improve the heat resistance of these resins, isocyanates, acid anhydrides, and amines are added. It is optional to add a curing agent such as a compound, and when an isocyanate-based curing agent is used, the resulting top tape film is aged at 60°C for 72 hours to promote curing. In order to prevent blocking, it is optional to add an antiblocking agent, etc., as exemplified by block copolymers containing perfluoroalkyl groups.

Further, as the binder resin, an ultraviolet curable resin or an electron beam curable resin may be used because of the advantages of not only being able to be coated without a solvent but also improving processing speed.

[0015] If the proportion of the transparent conductive fine powder added to the binder resin is too small, the desired conductivity cannot be obtained, and if it is too large, the adhesion of the transparent conductive resin layer to the plastic film of the base material is reduced. At the same time, there is a problem that the binder resin cannot fill between the conductive particles, creating gaps and reducing transparency, so the conductive fine powder is The content may be 40 to 85% by weight.

[0016] The solvent for dissolving these binder resins may be appropriately selected from general-purpose solvents, taking into account the solubility of the resin and the solvent resistance of the plastic film to be coated. ,ethanol,
Alcohols such as n-propanol, i-propanol, n-butanol, i-butanol, diacetone alcohol, cyclohexanol, acetone, cyclohexanone, methyl ethyl ketone, methyl isobutyl ketone,
Ketones such as holone and isophorone, ethers such as ethylene glycol monomethyl ether, carbitol and dioxane, esters such as ethyl acetate, butyl acetate and isopropyl acetate, aromatics such as toluene, xylene and solvent naphtha, dimethylformamide, Examples include polar solvents such as dimethylacetamide, propylene carbonate, γ-butyrolactone, dimethyl sulfoxide, sulfolane, formamide, N-methyl-2-pyrrolidone, acetonitrile, propionitrile, and water alone or as a mixed solvent of two or more. be done.

[0017] The conductive fine powder is obtained by blending it into the binder resin solution dissolved in the above solvent and then uniformly dispersing it. As a dispersion method, a spiral mixer, a planetary mixer, or a dispersion method can be used. After premixing is performed using a blade-type stirring and kneading device such as a parser or hybrid mixer, thorough dispersion is performed using a ball-type kneading device such as a ball mill, vibration mill, or sand mill, or a roll-type kneading device such as a triple roll. is desirable.

[0018] In order to improve the dispersibility, various anionic, nonionic, and cationic surfactants and various coupling agents such as silane, titanium, and aluminum are added as dispersants. This is considered optional.

After the viscosity and solid content of the transparent conductive ink prepared in this manner are appropriately adjusted according to the various coating methods shown below, the transparent conductive ink is coated using a known coating method, specifically, a gravure coater, Roll coaters such as triple reverse coaters and offset gravure coaters, Meyer bars,
It is sufficient to apply the coating to a thickness that provides an appropriate surface resistance using a bar coater, comma coater, air knife coater, or even a dip coater or spray coater, and then dry it. However, if this thickness is too thick, the cost will increase. The dry film thickness is preferably in the range of 0.2 to 1.0 μm.

[0020] Furthermore, as the transparent plastic film used in the present invention, a general-purpose plastic film with high transparency is used. Specific examples include polyethylene film, polyvinyl chloride film, polypropylene film, polystyrene film, polyethylene terephthalate film, polycarbonate film, polyarylate film, polyvinylidene fluoride film, polyamide film, or composite films thereof. Since these transparent plastic films form a transparent conductive resin layer, their surfaces are preferably subjected to corona discharge treatment or plasma treatment for the purpose of improving this adhesiveness.

The cover tape film of the present invention is obtained by forming an easily openable hot melt adhesive layer on the opposite side of the film obtained as described above, and the resin used for the adhesive is , saturated copolymerized polyester resin,
Polyvinyl butyral, vinyl chloride resin, ethylene-vinyl acetate copolymer resin, polybutadiene resin, ethylene-
Ethyl acrylate copolymer resin, polyvinyl acetate resin, ionomer resin, styrene-butadiene-styrene copolymer resin, styrene-isobutylene-styrene copolymer resin, styrene-ethylene/butylene-styrene copolymer resin, nylon resin, polyvinyl butyral resin Examples include a single substance or a complex of two or more types. These hot melt adhesive resins may optionally contain hydrophilic or hydrophobic fillers such as silica, etc., to the extent that the transparency is not reduced, in order to suppress the peel strength of the resin.

[0022] The method of forming these hot melt adhesive resin layers on the base film includes coating the base film by melting and extruding the above hot melt adhesive resin through a T-die, or coating the base film with the above adhesive. The resin may be dissolved in an appropriate solvent to form a varnish, and the adhesive may be formed by coating by selecting an appropriate coating method from the above coating methods. Furthermore, if the adhesive is in the form of a film,
It may be formed by laminating with a hot roll or bonding using an adhesive.

[0023] The thickness of this hot melt adhesive is as follows:
Since the adhesive is also required to have transparency, if it is too thick, the transparency will decrease, and if it is too thin, sufficient adhesive strength will not be obtained.
It may be in the range of 0 to 20 μm. In addition, this cover tape needs to be peeled off from the carrier tape when mounting internal electronic components, so if the adhesive strength of the hot melt adhesive is excessively high, the base film may break. It must be easy to open, and the specific peel strength is 10~180 degrees peel.
It may be 100 gf/mm, preferably 20 to 70 gf/mm.

[0024]

[Examples] The present invention will be specifically explained below with reference to Examples and Comparative Examples. [Example 1] A polyester film "Lumirror RT Type" (manufactured by Toray Industries, Inc., trade name) having a thickness of 25 μm was used as a transparent base film. As an easy-to-open hot-melt adhesive, ``ELITEL R'' is a saturated copolymer polyester with a glass transition point of 2°C and a ring and ball softening point of 115°C.
UE-3221'' (manufactured by Unitika Co., Ltd., trade name), and 100 parts by weight of this ``Eritel RUE-3221'' was mixed with toluene/methyl ethyl ketone (50/50% by volume).
) was dissolved in 233.3 parts by weight of a mixed solvent using a high-speed disperser to prepare a coating solution A having a viscosity of 150 cP. Next, a saturated copolymer polyester "ELITEL RU" having a glass transition point of 90°C and a ring and ball softening point of 185°C was used.
30 parts by weight of "E-3690" (manufactured by Unitika Co., Ltd., trade name) was dissolved in 70 parts by weight of a mixed solvent of methyl ethyl ketone/toluene (50/50) using a high-speed disperser to obtain a binder resin with a solid content of 30 wt%. A solution was prepared. After blending 30 parts by weight of antimony-doped tin oxide compound fine powder produced in the following process and 240 parts by weight of a mixed solvent of methyl ethyl ketone/toluene = 1/1 to 30 parts by weight of this binder resin solution, a disperser was added. After stirring using the ink, a sand mill treatment was performed to complete the dispersion, and a transparent conductive ink B having a solid content of 13.0% and a viscosity of 200 cp was prepared.

The antimony-doped tin oxide compound fine powder is obtained by dissolving 300 g of potassium stannate and 36.0 g of potassium antimonyl tartrate in 664 g of distilled water, and then adding this aqueous solution to 2 liters of distilled water adjusted to 45°C. After adding nitric acid while stirring and applying ultrasonic waves and adjusting the pH of the temperature-controlled water bath to 8.5, a sol solution in which conductive particles are dispersed is prepared by hydrolysis. After filtration, the particles remaining on the filter paper were washed with distilled water, and the resulting particles were dried and heated at 200°C in the air.
to 600℃ over 4 hours, and further to 650℃.
C. for 2 hours to produce a tin oxide compound fine powder with an average particle size of 0.17 .mu.m and 90% of the particles being within 3.3 .mu.m.

Coating solution A and transparent conductive ink B prepared above were each applied to a gravure plate with a line count of 150 mesh and a depth of 50 μm and a line count of 200 mesh and a depth of 2.
A 5 μm gravure plate was installed in a two-color gravure coater that can coat both sides simultaneously, and the polyester film was coated on both sides by inverting it from A to B in the order of B, followed by aging at 40 ° C. for 3 days. was carried out. At this time, 1.0 parts by weight of an isocyanate curing agent "CAT-10" (manufactured by Toyo Morton Co., Ltd., trade name) was added to 100 parts by weight of transparent conductive ink B, and the mixture was stirred.

The thickness of the dried coating film obtained was 3 μm for coating liquid A and 0.2 μm for coating liquid B. D on the transparent conductive resin layer of the obtained cover tape film
When applying C100V and measuring the surface resistance, the average value was 5.0 x 106 Ω, the maximum value was 6.0 x 106 Ω, and the minimum value was 4.5 x 106 Ω, which was very stable.
The light transmittance is 82%, the haze is 10 or less, and the abrasion resistance was tested by rubbing the nonwoven fabric against the transparent conductive resin layer with a load of 100 gf. The layers did not stick together, and no significant change in conductivity was observed. This was then slit to a predetermined width, and a seal head temperature of 180°C was applied to the polyvinyl chloride IC carrier tape "Shin-Etsu Carrier" (manufactured by Shin-Etsu Polymer Co., Ltd., trade name) using a heat seal head with a width of 1 mm. When sealing was repeated with a crimping time of 0.3 seconds, the conventional TC
The cover tape film using the NQ complex developed a sticking phenomenon after about 6,000 shots and required cleaning of the seal head, whereas the cover tape film of the present invention does not cause staining of the seal head even after 100,000 shots. was not observed, and no sticking phenomenon occurred. In addition, its average peel adhesion strength is 38 gf/mm, and the maximum is 64 gf/mm.
, the minimum strength was 25 gf/mm, showing good strength.

[Comparative Example 1] In place of the transparent conductive ink B in Example 1, a saturated copolymerized polyester "ELITEL RUE-3690" (with a glass transition point of 90°C and a ring and ball softening point of 185°C) was used as a polymer matrix. 10 parts by weight of Unitika Co., Ltd. (trade name), cyclohexanone/
Dissolve Nn-butylisoquinolinium-methyl-TCNQ complex (manufactured by Nitto Kagaku Kogyo Co., Ltd., prototype) in 500 parts by weight of a mixed solvent of toluene (70/30) using a high-speed disperser. ) and 2.7 parts by weight of N-n-butyl-N-methylmorpholinium-methyl-TCNQ complex (manufactured by Nitto Kagaku Kogyo Co., Ltd., prototype), and using a disperser. After stirring and dissolving the mixture, it was subjected to a sand mill treatment and further filtered through a filter paper (Whatman filter paper No. 3). To 100 parts by weight of the obtained liquid, 0.25 parts by weight of toluene diisocyanate-trimethylpropane adduct prepolymer "Coronate L" (manufactured by Nippon Polyurethane Industries, Ltd., trade name) and anti-blocking agent "Modiper F" (Nippon Oil & Fats Co., Ltd.) were added. After adding 0.1 part by weight (trade name, manufactured by )), stirring was performed again using a disperser to prepare a coating solution C having a viscosity of 20 cP. The rest was carried out in the same manner as in Example-1, and the coating liquid C had a dry film thickness of 0.1 μm. The coating liquid C of the obtained top tape film
When the surface resistance was measured by applying DC100V to the coating film, the average value was 2.5×106 Ω, and the maximum value was 3.0×
The resistance was 106 Ω, and the minimum value was 2.0×106 Ω. Figure 2
Table 1 shows the changes in surface resistance under high temperature and high humidity conditions, and Table 1 shows the results of the rubbing test and long run test.

[0029]

[Table 1]

[0030]

[Effects of the Invention] The cover tape film of the present invention uses tin oxide compound fine powder and indium oxide fine powder, which are metal oxides that are highly reliable under high temperature and high humidity conditions, in the transparent conductive resin layer. As shown in Figure 2, the surface resistance does not increase even after long-term storage under high temperature and high humidity conditions, and by making the particles smaller than conventional conductive powders, it is possible to improve Transparency can be significantly improved in comparison, and visibility in checking markings on electronic components can be greatly improved, thereby enabling automatic recognition of these checking processes. In addition, the transparent conductive fine powder used in the present invention solves the problems of staining and sticking of the seal head during long-term heat sealing and adhesion of conductive materials such as gloves, which were problems with conventional TCNQ complexes. It is a fine powder of a tin oxide compound or an indium oxide compound, and since it is an inorganic conductor, it does not melt or soften and become sticky even when it comes into contact with the seal head in heat sealing, so it does not cause sticking. Furthermore, as mentioned above, the particles used are smaller than conventional ones and do not crystallize like the TCNQ complex, so even if the conductive material is exposed on the surface, it will not protrude from the transparent conductive resin layer. Even in long-term seal tests (long-run tests), the time it takes to clean the seal head is significantly extended, and in effect, the lot to be sealed with one seal head is 10,000 to 100,000 shots, making the work much easier. This eliminates the need for interrupted cleaning. Similarly, visual inspection etc. also confirmed that there was no stain caused by conductive material adhering to the gloves or the like.

[Brief explanation of drawings]

FIG. 1(a) is a longitudinal sectional view of a cover tape film of the present invention, and FIG. 1(b) is a longitudinal sectional view of a mounted component package made of a carrier tape heat-sealed with a cover tape.

FIG. 2 is a graph showing changes in surface resistance of the mounted component package according to the present invention under high temperature and high humidity conditions (60° C.-95% Rh).

[Explanation of symbols]

1 Transparent plastic film 2 Transparent conductive resin layer 3. Easy-open hot melt adhesive 4 Recessed part 5 Carrier tape

Claims (2)

[Claims] [Claim 1] On the surface of a transparent plastic film,
A transparent conductive resin layer consisting of fine powder of a tin oxide compound and/or indium oxide compound with an average particle size of 0.3 μm or less and a binder resin is provided, and a hot melt adhesive layer is provided on the back side. Transparent composite cover tape film. [Claim 2] On the surface of the transparent plastic film,
A transparent composite cover tape provided with a transparent conductive resin layer consisting of fine powder of a tin oxide compound and/or indium oxide compound with an average particle size of 0.3 μm or less and a binder resin, and a hot melt adhesive layer provided on the back side. film and
The carrier tape consists of an antistatic or conductive resin sheet with continuous recesses for storing the mounted components, and the carrier tape is heat-sealed with the hot melt adhesive layer for easy opening. Mounted parts package.