JPH0436691U - - Google Patents
Info
- Publication number
- JPH0436691U JPH0436691U JP7559590U JP7559590U JPH0436691U JP H0436691 U JPH0436691 U JP H0436691U JP 7559590 U JP7559590 U JP 7559590U JP 7559590 U JP7559590 U JP 7559590U JP H0436691 U JPH0436691 U JP H0436691U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- mounting base
- element mounting
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Fire-Detection Mechanisms (AREA)
Description
第１図は本考案の実施例を示す縦断面図、第２
図〜第４図は部品図で、第２図は素子取付台の断
面図、第３図はプリント基板の縦断面図、第４図
はプリント基板の平面図、である。
１……本体、１Ａ……凸部、１Ｂ……係止突起
、２……保護カバー、４……素子取付台、１１…
…プリント基板、１４……感熱素子、１９……充
填材、４３……囲壁、１１２……注入孔、１４１
……貫通孔、Ｆ……筺体。
Fig. 1 is a vertical sectional view showing an embodiment of the present invention;
4 are parts diagrams, FIG. 2 is a sectional view of the element mounting base, FIG. 3 is a longitudinal sectional view of the printed circuit board, and FIG. 4 is a plan view of the printed circuit board. DESCRIPTION OF SYMBOLS 1... Main body, 1A... Convex part, 1B... Locking protrusion, 2... Protective cover, 4... Element mounting base, 11...
... Printed circuit board, 14 ... Heat-sensitive element, 19 ... Filler, 43 ... Surrounding wall, 112 ... Injection hole, 141
...Through hole, F...Housing.
Claims (1)
内のプリント基板に接続してなる熱式感知器にお
いて、筺体の一部をプリント基板が背面側から着
脱自在に係合される素子取付台とし、該素子取付
台の背面に感熱素子のリード線が挿通される貫通
孔を囲み、かつ、係合されたプリント基板を載置
する囲壁を設け、プリント基板に素子取付台とプ
リント基板とで囲まれた空間部に連通する注入孔
を設けたことを特徴とする熱式火災感知器。 (2) 素子取付台と囲壁とプリント基板とで囲ま
れた空間部に充填材が充填されていることを特徴
とする請求項１に記載の熱式火災感知器。 (3) 筺体は、本体と素子取付台と保護カバーと
からなり、素子取付台はプリント基板を介して本
体に係止され、保護カバーは本体に直接に係止さ
れることを特徴とする請求項１又は２に記載の熱
式火災感知器。 (4) 素子取付台は、プリント基板の径より小径
であり、プリント基板は素子取付台より大径の部
分で本体に取り付けられることを特徴とする請求
項１，２、又は第３に記載の熱式火災感知器。[Scope of Claim for Utility Model Registration] (1) In a thermal sensor in which the lead wire of a heat-sensitive element provided outside the housing is connected to a printed circuit board inside the housing, a part of the housing is attached and detached from the back side of the printed circuit board. An element mounting base that can be freely engaged is provided, and an enclosure wall is provided on the back side of the element mounting base to surround a through hole through which a lead wire of a heat-sensitive element is inserted, and on which the engaged printed circuit board is placed. A thermal fire detector characterized by having an injection hole communicating with a space surrounded by an element mounting base and a printed circuit board. (2) The thermal fire detector according to claim 1, wherein a filler is filled in a space surrounded by the element mounting base, the surrounding wall, and the printed circuit board. (3) A claim characterized in that the casing consists of a main body, an element mounting base, and a protective cover, the element mounting base is fixed to the main body via a printed circuit board, and the protective cover is directly fixed to the main body. The thermal fire detector according to item 1 or 2. (4) The element mounting base has a diameter smaller than that of the printed circuit board, and the printed circuit board is attached to the main body at a portion having a larger diameter than the element mounting base. Thermal fire detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7559590U JP2537575Y2 (en) | 1990-07-18 | 1990-07-18 | Thermal fire detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7559590U JP2537575Y2 (en) | 1990-07-18 | 1990-07-18 | Thermal fire detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0436691U true JPH0436691U (en) | 1992-03-27 |
| JP2537575Y2 JP2537575Y2 (en) | 1997-06-04 |
Family
ID=31616304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7559590U Expired - Lifetime JP2537575Y2 (en) | 1990-07-18 | 1990-07-18 | Thermal fire detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2537575Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001216578A (en) * | 2000-01-31 | 2001-08-10 | Nohmi Bosai Ltd | Fire detector |
| JP2004039377A (en) * | 2002-07-02 | 2004-02-05 | Yazaki Corp | Structure for applying moisture-proof agent onto terminal connection portion in electronic component |
-
1990
- 1990-07-18 JP JP7559590U patent/JP2537575Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001216578A (en) * | 2000-01-31 | 2001-08-10 | Nohmi Bosai Ltd | Fire detector |
| JP2004039377A (en) * | 2002-07-02 | 2004-02-05 | Yazaki Corp | Structure for applying moisture-proof agent onto terminal connection portion in electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2537575Y2 (en) | 1997-06-04 |
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