JP2537575Y2 - Thermal fire detector - Google Patents

Thermal fire detector

Info

Publication number
JP2537575Y2
JP2537575Y2 JP7559590U JP7559590U JP2537575Y2 JP 2537575 Y2 JP2537575 Y2 JP 2537575Y2 JP 7559590 U JP7559590 U JP 7559590U JP 7559590 U JP7559590 U JP 7559590U JP 2537575 Y2 JP2537575 Y2 JP 2537575Y2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
mounting base
element mounting
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7559590U
Other languages
Japanese (ja)
Other versions
JPH0436691U (en
Inventor
一郎 小林
健太郎 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nohmi Bosai Ltd
Original Assignee
Nohmi Bosai Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nohmi Bosai Ltd filed Critical Nohmi Bosai Ltd
Priority to JP7559590U priority Critical patent/JP2537575Y2/en
Publication of JPH0436691U publication Critical patent/JPH0436691U/ja
Application granted granted Critical
Publication of JP2537575Y2 publication Critical patent/JP2537575Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】 産業上の利用分野 この考案は、火災感知器に関するもので、更に述べる
と、防水性や気密性が長期間に亙って安定し、かつ、構
造が簡単で組み立て及び分解の容易な熱式火災感知器に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION INDUSTRIAL APPLICATION This invention relates to a fire detector. More specifically, the present invention relates to a fire detector. The present invention relates to a thermal fire detector that can be easily disassembled.

従来の技術 サーミスタ等の半導体感熱素子を利用する火災感知器
では、感熱素子を取り付けるのに感知器ボディに設けた
挿通孔に感熱素子のリード線を挿通し、リード線の先端
を感熱器ボディの裏面側に設けたプリント基板の接続孔
に挿通して半田付けしている。
2. Description of the Related Art In a fire detector that uses a semiconductor thermal element such as a thermistor, a lead wire of the thermal element is inserted into an insertion hole provided in the sensor body to mount the thermal element, and the end of the lead wire is connected to the thermal element body. Solder is inserted through the connection hole of the printed circuit board provided on the back side.

考案が解決しようとする課題 従来例では、リード線の半田付けをボディ裏面側の狭
い場所で行われなければならず、その作業が面倒で組立
にくい問題がある。
Problems to be Solved by the Invention In the conventional example, the soldering of the lead wires must be performed in a narrow place on the back side of the body, and there is a problem that the work is troublesome and difficult to assemble.

又、防水構造や耐腐食性構造を得ようとすると、ボデ
ィのリード線挿通孔部分を充填材でシールしなければな
らない。しかし、リード線を挿通後、半田付け前(すな
わち、プリント基板を取り付ける前)にボディの裏面側
から充填材を充填すると、プリント基板への挿通半田付
けの際にリード線に無理な力がかかり、リード線が断線
しやすくなる問題があると共に充填の際に感熱素子の突
出距離が狂いやすい問題がある。又、リード線の半田付
け後に充填材を充填するには、ボディの裏側から行わな
ければならず、充填剤がボディ表面に露出してしまい美
観を損なう問題がある。
In order to obtain a waterproof structure or a corrosion-resistant structure, the lead wire insertion hole of the body must be sealed with a filler. However, if the filler is filled from the back side of the body after the lead wire is inserted and before soldering (that is, before mounting the printed circuit board), an excessive force is applied to the lead wire when soldering the printed circuit board. In addition, there is a problem that the lead wire is apt to be broken, and there is a problem that the protruding distance of the heat-sensitive element is easily deviated during filling. In addition, the filling of the filler after soldering the lead wires must be performed from the back side of the body, and there is a problem that the filler is exposed on the surface of the body and the appearance is impaired.

この考案は上記事情に鑑み、分解組み立てを容易にす
ると共に、火災現象検出素子取付部を簡単に防水できる
ようにすることを目的とする。他の目的は、火災現象検
出素子の取り付け高さの調整を容易にすると共に、該素
子のリード線が損傷しないようにすることである。
SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to facilitate disassembly and assembly, and to easily waterproof a mounting portion of a fire detection element. Another object is to facilitate the adjustment of the mounting height of the fire detection element and to prevent the lead wires of the element from being damaged.

課題を解決するための手段 この考案は、筐体外に設けた感熱素子のリード線を筐
体内のプリント基板に接続してなる熱式感知器におい
て、筐体の一部をプリント基板が背面側から着脱自在に
係合される素子取付台とし、該素子取付台の背面に感熱
素子のリード線が挿通される貫通孔を囲み、かつ、係合
されたプリント基板を載置する囲壁を設け、プリント基
板に素子取付台と囲壁とプリント基板とで囲まれた空間
部に連通する注入孔を設けること、により前記目的を達
成しようとするものである。
Means for Solving the Problems The present invention provides a thermal sensor in which a lead wire of a thermosensitive element provided outside a housing is connected to a printed circuit board in the housing. An element mounting base detachably engageable, a back wall of the element mounting base surrounds a through hole through which a lead wire of a thermosensitive element is inserted, and an enclosing wall for mounting the engaged printed circuit board is provided. The object is achieved by providing an injection hole communicating with a space surrounded by the element mounting base, the surrounding wall, and the printed board on the substrate.

作用 感熱素子のリード線の先端を素子取付台の貫通孔に通
した後、その先端をプリント基板の接続孔に通しながら
該素子取付台をプリント基板に係合させ、プリント基板
を囲壁端面に載置する。次に、感熱素子の位置を調整し
ながらリード線をプリント基板に半田付けする。
After passing the tip of the lead wire of the heat-sensitive element through the through hole of the element mount, the element mount is engaged with the printed board while the tip is passed through the connection hole of the printed board, and the printed board is mounted on the end face of the surrounding wall. Place. Next, the lead wire is soldered to the printed circuit board while adjusting the position of the thermal element.

そして、プリント基板の注入孔に充填材を注入すると
空間部は充填材により満たされてシールされる。
When the filler is injected into the injection hole of the printed circuit board, the space is filled with the filler and sealed.

実施例 この考案の実施例を添付図面により説明するが、同一
図面符号はその名称も機能も同一である。防水型火災感
知器の樹脂製筐体Fは、プリント基板11を収容する本体
1と感熱素子などの火炎検出部を支持する素子取付台4
と保護カバー2とから構成されている。
An embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same reference numerals have the same names and functions. The resin housing F of the waterproof fire detector is composed of a main body 1 for housing a printed circuit board 11 and an element mounting base 4 for supporting a flame detecting unit such as a thermal element.
And a protective cover 2.

有底筒状の本体1の底面1aには凸部1Aと係止突起1Bと
円筒壁102とが突設され、円筒壁102の先端には外側シー
ル部101が設けられている。第2図に示すように、素子
取付台4の略中央部には半導体式感熱素子、例えば、サ
ーミスタ14のリード線141を貫通する貫通孔44が形成さ
れ、その裏面側には前記貫通孔44を囲む囲壁43と係止用
支柱42とが設けられている。素子取付台4の周縁部には
内側シール部41が設けられている。保護カバー2は本体
1と素子取付台4との間の環状部を覆うもので、その内
面には、側壁22aを備えた外側シール部22が設けられて
いる。
A projection 1A, a locking projection 1B, and a cylindrical wall 102 protrude from a bottom surface 1a of the bottomed cylindrical main body 1, and an outer seal portion 101 is provided at a tip of the cylindrical wall 102. As shown in FIG. 2, a through hole 44 that penetrates a semiconductor thermosensitive element, for example, a lead wire 141 of the thermistor 14, is formed at a substantially central portion of the element mounting base 4, and the through hole 44 is formed on the back side thereof. Is provided with an enclosing wall 43 and a locking column 42. An inner seal portion 41 is provided on the periphery of the element mount 4. The protective cover 2 covers an annular portion between the main body 1 and the element mounting base 4, and has an inner surface provided with an outer seal portion 22 having a side wall 22a.

このシール部22には、先端が鉤状の固定用支柱23を設
けている。
The seal portion 22 is provided with a fixing post 23 having a hook-like tip.

外側シール部22の内側に、内側シール部21が配設され
ている。
Inside the outer seal portion 22, an inner seal portion 21 is provided.

プリント基板11には、第3図、第4に示すように素子
取付台4の係止用支柱42を係止せしめる係止孔111と、
充填材を注入するための注入孔112と、サーミスタ14の
リード線141を挿通せしめる接続孔113と、が形成され
て、該基板11の径Lは、素子取付台4の径Dより大きく
形成され、又、素子取付台4より外側の大径部分11aで
本体1と係合する。次に、火災感知器の組み立て方につ
いて説明する。プリント基板11に定温式用、差動式用、
アナログ式用、などの図示しない回路部品やディップス
イッチ15などを半田付けする。サーミスタ14のリード線
141を素子取付台4の貫通孔44を挿通させてその先端を
プリント基板11の孔113に挿通し、取付台4の係止用支
柱42をプリント基板11の係止孔111に挿通係止する。こ
の時、プリント基板11の下面は囲壁43の上縁に当接す
る。その後、サーミスタ14を設定高さに位置せしめなが
らリード線141をプリント基板11に半田付けして接続固
定し、余剰部分を切断する。
3 and 4, the printed circuit board 11 has a locking hole 111 for locking the locking column 42 of the element mounting base 4.
An injection hole 112 for injecting the filler and a connection hole 113 for inserting the lead wire 141 of the thermistor 14 are formed, and the diameter L of the substrate 11 is formed larger than the diameter D of the element mount 4. Also, the main body 1 is engaged with the large diameter portion 11a outside the element mounting base 4. Next, how to assemble the fire detector will be described. For printed circuit board 11 for constant temperature type, differential type,
Solder circuit components (not shown) for the analog type, the DIP switch 15, and the like. Thermistor 14 lead wire
141 is inserted through the through hole 44 of the element mounting base 4, the tip of which is inserted into the hole 113 of the printed circuit board 11, and the locking column 42 of the mounting table 4 is inserted and locked into the locking hole 111 of the printed circuit board 11. . At this time, the lower surface of the printed circuit board 11 contacts the upper edge of the surrounding wall 43. Thereafter, the lead wire 141 is soldered and fixed to the printed circuit board 11 while the thermistor 14 is positioned at the set height, and the excess portion is cut.

この状態で、プリント基板11の注入孔112よりシリコ
ンなどの充填材19を注入する。
In this state, the filler 19 such as silicon is injected through the injection hole 112 of the printed circuit board 11.

これにより充填材19は取付台4と囲壁43とプリント基
板11とで囲まれた空間部に流入すると共にその一部が貫
通孔44の隙間にも流入し、貫通孔44による外部とのシー
ルとサーミスタ14のリード線141の固定を行う。
As a result, the filler 19 flows into a space surrounded by the mounting table 4, the surrounding wall 43, and the printed circuit board 11, and a part thereof also flows into a gap between the through-holes 44, and seals with the outside through the through-holes 44. The lead wire 141 of the thermistor 14 is fixed.

このようにして、リード線141を固定するので、素子
取付台4に対するサーミスタ14の高さ調整が容易である
と共にリード線141をプリント基板11に半田付けする際
にリード線141が無理に引っ張られることも無く断線な
どの損傷などを受けることが無い。
Since the lead wire 141 is fixed in this manner, the height of the thermistor 14 with respect to the element mount 4 is easily adjusted, and the lead wire 141 is forcibly pulled when the lead wire 141 is soldered to the printed circuit board 11. There is no damage such as disconnection.

また、リード線141が遊嵌挿通されている貫通孔44に
も充填材19が流入するので、貫通孔44部分のシールも確
実に行われる。
In addition, since the filler 19 flows into the through-hole 44 into which the lead wire 141 is loosely inserted, the through-hole 44 is reliably sealed.

この時素子取付台4の裏側から充填材19が注入される
ため、充填材19は素子取付台4の表面側まで流出するこ
とが無いので、美感を損なうことが無い。次に、外線接
続用のリード線12を本体1の凹部105の孔に貫通させ、
その先端をプリント基板11の接続孔114に挿通して半田
付け固定しリード線12を外側に引っ張る。そして、プリ
ント基板11をその取付台4より大径部分11a、すなわ
ち、係止孔111より外側寄りに設けた孔117に本体1の係
止突起(図示せず)を挿通して係合させると共に、本体
1の底面1aの下方に突出している凹部105や凸部1Aなど
の下面に当接させる。なお、凹部105等の突出部の当接
面に位置決め用の突起を設け、この突起をプリント基板
11に設けた位置決め孔に挿通するようにしてもよい。ま
た、リード線12は予めプリント基板11に半田付けしてお
き、プリント基板1Iを本体1に取り付けるときにリード
線12を凹部105の孔に貫通させても良い。
At this time, since the filler 19 is injected from the back side of the element mounting base 4, the filler 19 does not flow out to the surface side of the element mounting base 4, so that the beauty is not spoiled. Next, the lead wire 12 for external line connection is passed through the hole of the concave portion 105 of the main body 1,
The tip is inserted into the connection hole 114 of the printed circuit board 11 and fixed by soldering, and the lead wire 12 is pulled outward. Then, the printed board 11 is engaged with the larger diameter portion 11a of the mounting base 4 by inserting a locking projection (not shown) of the main body 1 into a hole 117 provided on the outer side of the locking hole 111. Then, the main body 1 is brought into contact with the lower surface such as the concave portion 105 or the convex portion 1A projecting below the bottom surface 1a. In addition, a projection for positioning is provided on the contact surface of the projecting portion such as the concave portion 105, and this projection is attached to the printed circuit board.
You may make it penetrate through the positioning hole provided in 11. Alternatively, the lead wire 12 may be soldered to the printed board 11 in advance, and the lead wire 12 may be passed through the hole of the recess 105 when the printed board 1I is attached to the main body 1.

そして、内側Oリング9を素子取付台4の内側シール
部41の側壁41aに圧入載置すると共に外側Oリング10を
本体1の外側シール部101の側壁101aに圧入載置し、下
面側にプロテクタ3が係合固定された保護カバー2の固
定用支柱23を本体1の樋状部103に挿通しその先端の鉤
部を樋状部103の上縁に引っ掛け係合する。このとき、
保護カバー2の内側シール部21の側壁21aと素子取付台
4の内側シール部41の側壁41aとの間には、所謂ガタが
あるので側壁21a、41aは相対的に水平方向へ動き変位し
ながら、Oリング9の内側部と外側部とを押圧する。そ
のため、Oリング9に求心作用が発生するので、Oリン
グ9は自然に全方向に均等に締め付けられる。
Then, the inner O-ring 9 is press-fitted and mounted on the side wall 41a of the inner seal portion 41 of the element mounting base 4, and the outer O-ring 10 is press-fitted and mounted on the side wall 101a of the outer seal portion 101 of the main body 1. The fixing column 23 of the protective cover 2 to which the engagement 3 is fixed is inserted into the gutter-shaped portion 103 of the main body 1 and the hook at the tip thereof is hooked and engaged with the upper edge of the gutter-shaped portion 103. At this time,
There is a so-called play between the side wall 21a of the inner seal portion 21 of the protective cover 2 and the side wall 41a of the inner seal portion 41 of the element mounting base 4, so that the side walls 21a, 41a relatively move and displace in the horizontal direction. , And presses the inside and outside of the O-ring 9. Therefore, a centripetal action is generated on the O-ring 9, so that the O-ring 9 is naturally tightened uniformly in all directions.

従って、樹脂製筐体Fに部分的な力が加わらないの
で、Oリング9は安定した状態で固定される。なお、外
側Oリング10も前記内側Oリング9と同様の要領により
固定される。
Therefore, since no partial force is applied to the resin housing F, the O-ring 9 is fixed in a stable state. The outer O-ring 10 is fixed in the same manner as the inner O-ring 9.

このようにして、火災感知器はOリング9、10及び凹
部105並びに囲壁43で囲まれた部分の充填材19によりシ
ールされるので、水や腐食性ガスなどがプリント基板11
の収納部に浸入することがない。
In this manner, the fire detector is sealed by the O-rings 9 and 10, the recess 105, and the filler 19 surrounded by the surrounding wall 43.
Does not penetrate into the storage section.

また、前述のように本体1にプリント基板11、素子取
付台4、保護カバー2、プロテクタ3を組み込むときに
はサーミスタ14とリード線12の半田付けを除いて係合に
よる組み立てによるので、ねじなどの細かな部品を大幅
に省略でき、製作が容易で組み立てが短時間で出来る。
また、分解も前記係合を外すだけで良いため、容易であ
り保守点検や修理が簡単となる。なお、第1図におい
て、16は天井板等に固定される感知器ベース、17、18は
刃金具8が回転挿入される刃受金具、をそれぞれ示す。
Also, as described above, when the printed circuit board 11, the element mounting base 4, the protective cover 2, and the protector 3 are incorporated into the main body 1, they are assembled by engagement except for the soldering of the thermistor 14 and the lead wire 12, so that fine screws and the like are used. Parts can be largely omitted, and it is easy to manufacture and can be assembled in a short time.
In addition, the disassembly only needs to be released from the engagement, so that the disassembly is easy and the maintenance and inspection and repair are simplified. In FIG. 1, reference numeral 16 denotes a sensor base fixed to a ceiling plate or the like, and reference numerals 17 and 18 denote blade holders into which the blade bracket 8 is inserted by rotation.

考案の効果 この考案に係る熱式火災感知器は、以上のように構成
したので、プリント基板の両面を電気部品取付部として
利用できると共に、本体側の電気部品との接続を外周部
分で行うことができる。そのため、プリント基板は火災
現象検出素子を含め各種部品を組み込んだ後で本体へ取
り付けることができ、しかも、保守修理の際に本体から
プリント基板を素子支持台を取り付けたままで簡単に脱
着することができる。
Effect of the Invention Because the thermal fire detector according to the invention is configured as described above, both sides of the printed circuit board can be used as electric component mounting portions, and connection with electric components on the main body side is performed at an outer peripheral portion. Can be. Therefore, the printed circuit board can be attached to the main body after incorporating various parts including the fire detection element, and the printed circuit board can be easily detached from the main body with the element support stand attached during maintenance and repair. it can.

又、火災現象検出素子を素子支持台を介してプリント
基板に半田付けした後で充填材の充填ができるので、充
填材によってリード線に損傷を与える心配がなく、しか
も火災現象検出素子の取り付け高さの調整が容易とな
る。
In addition, since the filler can be filled after the fire detecting element is soldered to the printed circuit board via the element support, there is no fear that the filler damages the lead wire, and the mounting height of the fire detecting element can be reduced. Adjustment becomes easy.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本考案の実施例を示す縦断面図、第2図〜第4
図は部品図で、第2図は素子取付台の断面図、第3図は
プリント基板の縦断面図、第4図はプリント基板の平面
図、である。 1……本体 1A……凸部 1B……係止突起 2……保護カバー 4……素子取付台 11……プリント基板 14……感熱素子 19……充填材 43……囲壁 112……注入孔 141……貫通孔 F……筐体
FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, and FIGS.
FIG. 2 is a component diagram, FIG. 2 is a sectional view of an element mounting table, FIG. 3 is a longitudinal sectional view of a printed board, and FIG. 4 is a plan view of the printed board. DESCRIPTION OF SYMBOLS 1 ... Main body 1A ... Convex part 1B ... Locking protrusion 2 ... Protective cover 4 ... Element mounting base 11 ... Printed circuit board 14 ... Thermal element 19 ... Filler 43 ... Enclosure wall 112 ... Injection hole 141: Through-hole F: Housing

Claims (3)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】筐体外に設けた感熱素子のリード線を筐体
内のプリント基板に接続してなる熱式感知器において、
筐体の一部をプリント基板が背面側から着脱自在に係合
される素子取付台とし、該素子取付台の背面に感熱素子
のリード線が挿通される貫通孔を囲み、かつ、係合され
たプリント基板を載置する囲壁を設け、プリント基板に
素子取付台と囲壁とプリント基板とで囲まれた空間部に
連通する注入孔を設けたことを特徴とする熱式火災感知
器。
1. A thermal sensor in which a lead wire of a thermosensitive element provided outside a housing is connected to a printed circuit board in the housing.
A part of the housing is an element mounting base on which the printed circuit board is detachably engaged from the rear side, and the rear surface of the element mounting base surrounds a through hole through which a lead wire of the thermosensitive element is inserted, and is engaged. A thermal fire detector comprising: a surrounding wall on which a printed circuit board is mounted; and an injection hole communicating with a space surrounded by the element mounting base, the surrounding wall, and the printed circuit board.
【請求項2】筐体は、本体と素子取付台と保護カバーと
からなり、素子取付台はプリント基板を介して本体に係
止され、保護カバーは本体に直接に係止されることを特
徴とする請求項1に記載の熱式火災感知器。
2. The housing comprises a main body, an element mounting base, and a protective cover. The element mounting base is locked to the main body via a printed circuit board, and the protective cover is directly locked to the main body. The thermal fire detector according to claim 1, wherein:
【請求項3】素子取付台は、プリント基板の径より小径
であり、プリント基板は素子取付台より大径の部分で本
体に取り付けられることを特徴とする請求項1又は2記
載の熱式火災感知器。
3. The thermal fire according to claim 1, wherein the element mounting base has a smaller diameter than the diameter of the printed circuit board, and the printed circuit board is attached to the main body at a portion larger in diameter than the element mounting base. sensor.
JP7559590U 1990-07-18 1990-07-18 Thermal fire detector Expired - Lifetime JP2537575Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7559590U JP2537575Y2 (en) 1990-07-18 1990-07-18 Thermal fire detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7559590U JP2537575Y2 (en) 1990-07-18 1990-07-18 Thermal fire detector

Publications (2)

Publication Number Publication Date
JPH0436691U JPH0436691U (en) 1992-03-27
JP2537575Y2 true JP2537575Y2 (en) 1997-06-04

Family

ID=31616304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7559590U Expired - Lifetime JP2537575Y2 (en) 1990-07-18 1990-07-18 Thermal fire detector

Country Status (1)

Country Link
JP (1) JP2537575Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216578A (en) * 2000-01-31 2001-08-10 Nohmi Bosai Ltd Fire detector
JP2004039377A (en) * 2002-07-02 2004-02-05 Yazaki Corp Structure for applying moisture-proof agent onto terminal connection portion in electronic component

Also Published As

Publication number Publication date
JPH0436691U (en) 1992-03-27

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